XA3S50-4PQG208Q vs XA3S50-4PQG208I 对比
详细并排对比 XA3S50-4PQG208Q 出自 AMD 和 XA3S50-4PQG208I 出自 Xilinx。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。
规格对比
| 参数 | XA3S50-4PQG208Q | XA3S50-4PQG208I |
|---|---|---|
| 品牌 | AMD | Xilinx |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 有效 |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-3A automotive field-programmable gate array (FPGA) |
| FPGA Family | Spartan-3 XA | — |
| System Gates | 50,000 gates | 50,000 gates |
| Configurable Logic Blocks | 192 CLBs | 192 CLBs |
| Logic Cells | 1,728 logic cells | 1,728 logic elements |
| Maximum Operating Frequency | 125 MHz | — |
| User I/O Pins | 124 I/O | — |
| On-Chip RAM | 73,728 bits | — |
| 电源电压 | 1.2 V | — |
| Maximum Data Transfer Rate per I/O | 622 Mb/s | — |
| Single-Ended I/O Standards | 17 standards | 17 standards |
| Differential I/O Standards | 7 standards | 7 standards, including LVDS |
| Differential I/O Support | LVDS | — |
| On-Chip Termination | Digitally Controlled | — |
| 封装 | 208-pin PQFP | 208-pin PQFP plastic quad flat package |
| Package Pin Pitch | 0.50 mm | — |
| Terminal Form | Gull wing | — |
| Package Shape | Square | — |
| Automotive Qualification | AEC-Q100 qualified | AEC-Q100 automotive-grade designation reported in verified source data |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type] | — |
| Static Power | [DATA_NEEDED: static power] | — |
| Dynamic Power | [DATA_NEEDED: dynamic power] | — |
| Total RAM Bits | — | 73,728 bits |
| User I/O | — | 124 I/O |
| Maximum Data Rate per I/O | — | 622 Mb/s |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 3.3 V |
| FPGA Technology | — | 90 nm |
| Total Package Pins | — | 208 pins |
| Speed Grade | — | -4 |
| Temperature Grade | — | Industrial, -40°C to +100°C |
| Digital Termination | — | Digitally controlled termination supported |