XC3S200-4FTG256I vs XC3S200-4FT256I Comparación
Comparación detallada lado a lado de XC3S200-4FTG256I por Xilinx y XC3S200-4FT256I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC3S200-4FTG256I | XC3S200-4FT256I |
|---|---|---|
| Marca | Xilinx | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Family | Spartan-3 | — |
| System Gates | 200,000 | 50,000 gates |
| Logic Cells | 4,320 | — |
| Slices | 2,160 | — |
| Block RAM | 216 Kbit (12 blocks x 18 Kbit) | [DATA_NEEDED: block RAM resources] |
| Dedicated Multipliers | 4 (18x18) | — |
| DCM (Digital Clock Manager) | 4 | — |
| Maximum User I/O | 173 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | -4 | -4 |
| Process Technology | 90 nm | — |
| Encapsulado | 256-ball FTBGA (FTG256), 17 x 17 mm | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0 C to +85 C |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball | — |
| Peak Reflow Time | 30 s | — |
| Estado RoHS | Compliant (G suffix = lead-free) | Compliant |
| Device Type | — | Spartan-3 field-programmable gate array (FPGA) |
| Nominal System Gates | — | 200,000 gates |
| Logic Cells / Logic Blocks | — | 4,320 |
| Frecuencia de reloj máxima | — | 630 MHz |
| Technology | — | 90 nm |
| Core Supply Voltage | — | 1.14 V to 1.26 V |
| Package Type | — | FTBGA-256 |
| Package Dimensions | — | 17 mm x 17 mm |
| Number of Terminals | — | 256 |
| Device Family | — | Spartan-3 |
| Temperature Grade | — | Industrial |
| User I/O Count | — | [DATA_NEEDED: user I/O count] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |