XC3S200-4FTG256I vs XC3S200-4FT256I 对比
详细并排对比 XC3S200-4FTG256I 出自 Xilinx 和 XC3S200-4FT256I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC3S200-4FTG256I | XC3S200-4FT256I |
|---|---|---|
| 品牌 | Xilinx | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| Family | Spartan-3 | — |
| System Gates | 200,000 | 50,000 gates |
| Logic Cells | 4,320 | — |
| Slices | 2,160 | — |
| Block RAM | 216 Kbit (12 blocks x 18 Kbit) | [DATA_NEEDED: block RAM resources] |
| Dedicated Multipliers | 4 (18x18) | — |
| DCM (Digital Clock Manager) | 4 | — |
| Maximum User I/O | 173 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | -4 | -4 |
| Process Technology | 90 nm | — |
| 封装 | 256-ball FTBGA (FTG256), 17 x 17 mm | — |
| 工作温度 | -40C to +100C (Industrial) | 0 C to +85 C |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball | — |
| Peak Reflow Time | 30 s | — |
| RoHS 状态 | Compliant (G suffix = lead-free) | Compliant |
| Device Type | — | Spartan-3 field-programmable gate array (FPGA) |
| Nominal System Gates | — | 200,000 gates |
| Logic Cells / Logic Blocks | — | 4,320 |
| 最大时钟频率 | — | 630 MHz |
| Technology | — | 90 nm |
| Core Supply Voltage | — | 1.14 V to 1.26 V |
| Package Type | — | FTBGA-256 |
| Package Dimensions | — | 17 mm x 17 mm |
| Number of Terminals | — | 256 |
| Device Family | — | Spartan-3 |
| Temperature Grade | — | Industrial |
| User I/O Count | — | [DATA_NEEDED: user I/O count] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |