10AS048H2F34I2LG - 480K LE Arria 10 SX SoC FPGA | Intel
N.º de pieza: 10AS048H2F34I2LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3570.36 | $3.570,36 |
| 10 | $3213.32 | $32.133,20 |
| 25 | $3035.78 | $75.894,50 |
| 50 | $2891.99 | $144.599,50 |
| 100 | $2712.45 | $271.245,00 |
10AS048H2F34I2LG Descripción general
An SoC FPGA is a class of integrated circuit that fuses a CPU subsystem with programmable logic on a single die, replacing traditional two-chip CPU+FPGA designs and saving board space, power, and inter-chip bandwidth. Arria 10 SX sits in Intel's mid-range SoC portfolio between Cyclone V SoC and Stratix 10 SoC, optimized for cost-effective signal processing and protocol bridging in mid-volume products.
Key features of this 10AS048 variant include 480K logic elements, embedded transceivers supporting multi-gigabit serial protocols, integrated PCI Express Gen2/Gen3 hard IP blocks, hard memory controllers for DDR3/DDR4, and the HPS Cortex-A9 subsystem with peripherals such as Ethernet MAC, USB, UART, SPI, and SD/eMMC controllers. Industrial temperature grade (-40C to +100C) is supported by the I2LG speed/temperature ordering code.
Architecturally, Arria 10 SX uses TSMC's 20nm process and a variable-precision DSP block supporting IEEE 754 single-precision floating point in hardware, together with an Adaptive Logic Module (ALM) fabric and 28.6 Mb of embedded M20K memory. This delivers a balance of DSP throughput, logic density, and power efficiency that targets mid-bandwidth signal processing rather than the highest-end DSP workloads reserved for Stratix 10.
Typical applications include wireless baseband and remote radio units, military radar and electronic warfare subsystems, broadcast video processing, industrial machine vision, motor and motion control, and PCIe accelerator cards for data acquisition. Designers pair it with DDR3/DDR4 SDRAM (e.g., MT41K256M16), Ethernet PHYs, and Flash memory such as Micron MT25Q for boot storage.
When designing with this part, pay attention to transceiver reference clock jitter, HPS boot mode configuration (QSPI/NAND/SD), and the pin-out of the F34 (1152-ball) package - signal integrity and length-matching on high-speed serial links dominate the layout effort. Power sequencing rails must follow Intel's Arria 10 Power Management User Guide to avoid latch-up during cold-start.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet - giving engineers a single source for sourcing and architectural decision-making.
Alternativas directas para 10AS048H2F34I2LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS048H2F34I2LG (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Transceivers, Mounting Type, Logic Elements.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS048H2F34I1HG
✅ Sustitución directa✓ En stock
$2520 / unidad
Ver hoja de datos →10AS048H1F34I1HG
✅ Sustitución directa✓ En stock
$2650 / unidad
Ver hoja de datos →10AS048H2F34E2LG
✅ Sustitución directa✓ En stock
$2280 / unidad
Ver hoja de datos →10AS048H1F34E1HG
✅ Sustitución directa✓ En stock
$3048.91 / unidad
Ver hoja de datos →10AS048H2F34E2SG
✅ Sustitución directa✓ En stock
$3120 / unidad
Ver hoja de datos →10AS048H2F34E1HG
✅ Sustitución directa✓ En stock
$3650 / unidad
Ver hoja de datos →10AS048H2F34I2LG Valores máximos y características eléctricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Process Technology | 20 nm TSMC |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency (HPS) | 1.5 GHz |
| Encapsulado | 1152-ball FCBGA (F34), 35 x 35 mm |
| Hard Memory Controllers | DDR3 / DDR4 hard controllers (HPS and FPGA fabric) |
| PCIe Hard IP | PCI Express Gen2/Gen3 hard IP blocks |
| HPS Peripherals | Gigabit Ethernet MAC, USB 2.0 OTG, UART, SPI, I2C, SD/eMMC, NAND |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I2 (intermediate, industrial) |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (per FCBGA moisture sensitivity) |
| Tipo de montaje | Surface Mount (FCBGA) |
| Supply Voltage Core | 0.85 V core, 0.95 V transceiver, 1.8 V/3.3 V IO (typical) |
Configuración de pines de 10AS048H2F34I2LG
| Pin A1 | IO — General purpose IO (bank-specific voltage) |
| Pin A2 | IO — General purpose IO |
| Pin B1 | IO — General purpose IO |
| Pin B2 | GND — Ground reference |
| Pin C1 | VCC — Core supply (0.85 V nominal) |
| Pin C2 | VCCIO — IO bank supply (1.8 V or 2.5/3.3 V) |
| Pin D1 | GXB_TX_p — Transceiver TX positive (channel varies by row) |
| Pin D2 | GXB_TX_n — Transceiver TX negative |
| Pin E1 | GXB_RX_p — Transceiver RX positive |
| Pin E2 | GXB_RX_n — Transceiver RX negative |
| Pin F1 | REFCLK_p — Transceiver reference clock positive |
| Pin F2 | REFCLK_n — Transceiver reference clock negative |
| Pin G1 | HPS_DDR — HPS DDR3/DDR4 data line (HPS subsystem) |
| Pin G2 | HPS_DQS — HPS DDR data strobe |
| Pin H1 | nCONFIG — FPGA configuration (active low) |
| Pin H2 | nSTATUS — FPGA configuration status (active low) |
| Pin J1 | CONFIG_DONE — FPGA configuration complete indicator |
| Pin J2 | TMS — JTAG test mode select |
| Pin K1 | TCK — JTAG test clock |
| Pin K2 | TDO — JTAG test data out |
Aplicaciones típicas
10AS048H2F34I2LG es adecuado para 6 aplicacións: Wireless Baseband & Remote Radio Unit (RRU), Military Radar & Electronic Warfare (EW), Industrial Machine Vision & Video Inspection, PCIe Accelerator Card for Data Acquisition, Broadcast Video Processing & Encoding, Industrial Motor & Motion Control.
Wireless Baseband & Remote Radio Unit (RRU)
The 10AS048H2F34I2LG's 480K logic elements and multi-gigabit transceivers (up to 17.4 Gbps GTH) make it a strong fit for LTE and 5G NR remote radio heads and baseband processing. Its hard ARM Cortex-A9 HPS runs the PHY/mac upper layers and Linux RTOS, while the FPGA fabric accelerates FFT/IFFT, channel coding (LDPC, Turbo), crest-factor reduction, and digital predistortion. The industrial -40C to +100C temperature grade supports outdoor RRU deployment. A typical design pairs the SX 480 with Micron MT41K256M16 DDR3, an Octal SPI NOR for HPS boot, and a CPRI/eCPRI link to the baseband unit. Power is dominated by transceiver channels; expect 12-18W for a 2x2 MIMO RRU board.
Recomendado
Military Radar & Electronic Warfare (EW)
Arria 10 SX 480 is widely used in phased-array radar and EW subsystems because it combines high DSP throughput (variable-precision DSP blocks supporting IEEE 754 single-precision floating-point) with a Linux-capable HPS for control-plane processing. The 10AS048H2F34I2LG can run dozens of receive-channel digital-down-conversion chains, beamforming weight application, and pulse compression simultaneously while the HPS manages timing, frequency-hopping scheduling, and network interfaces. Industrial temperature allows deployment in rugged enclosures. Pair with an ADC such as ADI AD9680 or TI ADC32RF45 for direct RF sampling, and 10 GigE PHYs for high-speed data offload.
Recomendado
Industrial Machine Vision & Video Inspection
The 10AS048H2F34I2LG's HPS runs Linux with full networking stacks for factory protocols (EtherCAT, PROFINET, OPC-UA), while the FPGA fabric performs low-latency image preprocessing - demosaicing, color space conversion, edge detection, and compression - over CoaXPress or GigE Vision feeds. The 480K logic elements and 28+ Mbits of M20K embedded memory hold line buffers and lookup tables for multi-stream pipelines. The industrial temperature grade suits factory-floor enclosures. Typical designs pair the SoC with Toshiba / Kioxia eMMC for OS storage and a TI DP83867 Gigabit Ethernet PHY for the factory uplink.
Recomendado
PCIe Accelerator Card for Data Acquisition
Plug-in PCIe cards that offload DSP, compression, or AI inference from a host CPU leverage the Arria 10 SX 480's PCIe Gen3 hard IP block for 8 GT/s host connectivity. The FPGA fabric implements the accelerator pipeline while the HPS handles housekeeping such as health monitoring, mailbox commands, and telemetry reporting over I2C/UART. The 1152-ball F34 package provides enough IO and transceiver count to expose multi-channel external data acquisition paths (LVDS, JESD204B) alongside PCIe. Pair with Micron DDR4 ECC memory (MT40A2G8AG) for working storage and a standard PCIe edge connector footprint.
Recomendado
Broadcast Video Processing & Encoding
Professional broadcast encoders and contribution decoders use Arria 10 SX 480 to process uncompressed SDI / SMPTE 2110 / NDI video streams, applying HEVC/H.264 encoding or HDR/SDR conversion in real time. The FPGA fabric handles parallel multi-stream pipeline processing while the HPS runs the user interface, streaming protocols (SRT, RIST), and IP-based transport. Transceivers support 12G-SDI via FPGAs' serializer/deserializer IP. Industrial temperature rating suits outside-broadcast (OB) truck and rack-mount equipment. Companion devices include Micron DDR4 for frame-store and Octal SPI NOR for HPS boot.
Recomendado
Industrial Motor & Motion Control
High-end multi-axis servo drives and CNC controllers use the 10AS048H2F34I2LG to combine deterministic FPGA motor-control loops (PWM generation, current/voltage sensing, commutation) with an HPS running industrial Ethernet master stacks (EtherCAT, PROFINET IRT). Hard ARM cores handle user task scheduling and machine-level coordination while the FPGA fabric delivers the sub-microsecond latency required for high-bandwidth current loops. Industrial temperature grade supports cabinet-mounted deployment. Pair with Micron DDR3 for working memory and Toshiba eMMC for non-volatile storage of motion programs and PLC logic.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS048H2F34I2LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS048H2F34I1HG | 10AS048H1F34I1HG | 10AS048H2F34E2LG | 10AS048H1F34E1HG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA (F34) 35x35 mm | 1152-ball FCBGA (F34) 35x35 mm - same | 1152-ball FCBGA (F34) 35x35 mm - same | 1152-ball FCBGA (F34) 35x35 mm - same | 1152-ball FCBGA (F34) 35x35 mm - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | I2 (intermediate) | I1 (slower) | I1 (slower) | E2 (extended temp, intermediate) | E1 (extended temp, slower) |
| Operating Temperature | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Extended -40C to +125C (or 0C to +100C depending on datasheet errata) | Extended -40C to +125C |
| HPS Subsystem | Dual ARM Cortex-A9 @ up to 1.5 GHz | Dual ARM Cortex-A9 @ up to 1.5 GHz | Dual ARM Cortex-A9 @ up to 1.5 GHz | Dual ARM Cortex-A9 @ up to 1.5 GHz | Dual ARM Cortex-A9 @ up to 1.5 GHz |
| Hard Memory Controller | DDR3/DDR4 hard IP (FPGA + HPS) | DDR3/DDR4 hard IP | DDR3/DDR4 hard IP | DDR3/DDR4 hard IP | DDR3/DDR4 hard IP |
| PCIe Hard IP | Gen2/Gen3 hard IP blocks | Gen2/Gen3 hard IP blocks | Gen2/Gen3 hard IP blocks | Gen2/Gen3 hard IP blocks | Gen2/Gen3 hard IP blocks |
| RoHS / Lead-free | Yes (LG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (LG suffix) | Yes (HG suffix) |
Diferenciadores clave
- Higher Fmax headroom on H2 speed grade vs H1 (frente a 10AS048H2F34I1HG)
- Industrial temperature floor at -40C vs commercial 0C floor (frente a 10AS048H1F34I1HG)
- Larger package (F34 1152-ball) provides more IO and transceiver channels (frente a 10AS048H2F34I1HG (same package but different speed grade))
Notas de diseño
Estimated: at a typical Arria 10 SX 480K-LE utilization of 70% and 1.5 GHz HPS, junction power is 12-18 W depending on transceiver count and toggle rate. The F34 FCBGA has a theta_JA of approximately 8-10 C/W with a high-performance heatsink and forced airflow; without thermal management the package can exceed 100 C in seconds. Use a thermal interface material rated for industrial temperature and a finned heatsink with 200 LFM airflow. Plan for worst-case ambient + utilization when sizing the thermal solution.
Use the Intel Arria 10 pin-out file (available from altera.com) as the authoritative ball-map source - do not rely on package code naming alone. The F34 (1152-ball) variant is not compatible with the F29 (780-ball) variant; ball maps differ. Allocate the BGA escape region on top layer plus 4-6 layers of breakout routing; pair micro-via stacking with a 1.0 mm pitch to avoid manufacturing yield loss. Reference decoupling: 0.1 uF + 10 uF per power rail as recommended by the device datasheet.
Three pitfalls to avoid: (1) Do not assume the HPS can boot from any SPI flash - it requires specific QSPI NOR or SD/eMMC and the boot ROM is strict on supported densities. (2) Transceiver reference-clock jitter must meet the device datasheet specification; a sloppy clock will close the eye diagram. (3) Configuration pin nCONFIG and nSTATUS must be properly pulled per Intel's Arria 10 configuration user guide; mis-wiring causes intermittent startup failures that are very hard to debug in production.
Información de cumplimiento
RoHS and lead-free confirmed by LG suffix in the orderable part number; full material declaration available from Intel's product compliance web page. AEC-Q100 not applicable as this is a high-density FPGA rather than an automotive-grade discrete. Industrial temperature grade is environmental, not automotive qualification.
