10AS048H1F34I1HG - Arria 10 SX 480K LE SoC FPGA | Intel
MPN: 10AS048H1F34I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3986.86 | $3,986.86 |
| 10 | $3680 | $36,800.00 |
| 100 | $3250 | $325,000.00 |
| 500 | $2890 | $1,445,000.00 |
| 1,000 | $2650 | $2,650,000.00 |
Drop-in alternatives for 10AS048H1F34I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048H1F34E1HG
✅ Drop-In✓ In Stock
$3048.91 / Unit
View Datasheet →10AS032H1F34I1HG
✅ Drop-In✓ In Stock
$2077.26 / Unit
View Datasheet →10AS048E4F29I3SG
✅ Drop-In✓ In Stock
$1150 / Unit
View Datasheet →10AS048E4F29I3LG
✅ Drop-In✓ In Stock
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View Datasheet →10AS048H1F34I1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| I/O Count | 492 user I/O |
| Package | 1152-ball FC-FBGA (35x35 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 C to +100 C (industrial) |
| Speed Grade | 1 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AS048H1F34I1HG 1152-ball fc-fbga (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS048H1F34I1HG (1152-ball fc-fbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H1F34I1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H1F34I1HG is suitable for 6 applications: High-Performance Industrial Imaging and Machine Vision, Radar and Electronic Warfare Signal Processing, 5G Baseband and Radio Prototyping, Military Secure Communications, Broadcast Video Infrastructure and Studio Processing, Medical Imaging Systems (CT, Ultrasound, MRI Back-End).
High-Performance Industrial Imaging and Machine Vision
The 10AS048H1F34I1HG suits multi-camera machine-vision systems where image preprocessing must run at line rate before inspection decisions. Its 480K logic elements implement parallel pipelines for Bayer demosaicing, lens-distortion correction, and CNN inference, while the dual ARM Cortex-A9 HPS at 1.5 GHz runs Linux for PLC coordination, HMI, and protocol stacks (EtherCAT, PROFINET). The 492 user I/O handle Camera Link, CoaXPress, or GigE Vision interfaces, and the FC-FBGA package sustains industrial -40 C to +100 C operation. Estimated: at 70% logic utilization the device draws approximately 18-22 W, so designers budget a 25 W thermal envelope with 200 LFM airflow.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AS048H1F34I1HG targets phased-array radar baseband and electronic-countermeasure systems where FFT, pulse compression, and digital beamforming must execute in microseconds. The 480K logic elements map to thousands of 18x19 multipliers and embedded DSP blocks, while the dual ARM cores handle scheduling, calibration, and Ethernet control planes. The Arria 10 SX architecture supports 17 Gbps transceivers for direct ADC interfacing and reduced latency to downstream processing. Industrial temperature grade allows deployment in ruggedized enclosures. Designers typically pair this SoC with external DDR4 for capture buffers.
Recommended
5G Baseband and Radio Prototyping
The 10AS048H1F34I1HG is well suited to 4G/5G baseband prototyping, where massive MIMO and LDPC decoding demand thousands of DSP operations per subframe. The 480K logic elements host channel encoders, FFT/IFFT cores, and crest-factor-reduction engines, while the dual ARM Cortex-A9 HPS runs the MAC scheduler and upper-layer stacks. The 1152-ball FC-FBGA package supports the high pin density required for multi-antenna transceiver fan-out. Operating up to 100 C junction, the device fits thermally constrained indoor radio units. Expect approximately 25 W device dissipation at full transceiver utilization.
Recommended
Military Secure Communications
The 10AS048H1F34I1HG supports tactical radio and secure-comm gateway designs where cryptographic acceleration and software-defined-radio waveforms coexist on a single device. The dual ARM cores handle Type-1 crypto APIs, key management, and IP routing, while the 480K logic fabric implements waveform-specific modulators, channelizers, and FEC decoders. Industrial temperature range suits vehicle and field-deployable enclosures, and the FC-FBGA package supports high-vibration environments with underfilled BGA attachment. Designers pair this SoC with external secure-boot Flash and battery-backed RAM.
Recommended
Broadcast Video Infrastructure and Studio Processing
The 10AS048H1F34I1HG supports broadcast studio equipment such as video routers, multiviewers, and UHD format converters where real-time pixel processing exceeds GPU practicality. The 480K logic elements implement color-space conversion, scaling, frame-rate conversion, and overlay composition, while the dual ARM HPS runs control software and IP-based studio networks (SMPTE 2110, NMOS). The 1152-ball FC-FBGA provides the user I/O count required for multi-channel SDI and 12G-SDI inputs. Estimated: at 60% logic utilization with four 12G-SDI streams, the device draws approximately 15 W.
Recommended
Medical Imaging Systems (CT, Ultrasound, MRI Back-End)
The 10AS048H1F34I1HG targets medical-imaging back-end processing, where raw sensor data requires real-time beamforming, image reconstruction, and noise filtering. The 480K logic elements implement parallel DSP pipelines for ultrasound beamforming or CT back-projection, while the dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and clinician-facing software. Industrial temperature range allows integration into stationary imaging carts and OR equipment. The SoC architecture eliminates the need for a separate host CPU, reducing system cost and patient-data latency.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H1F34I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H1F34E1HG | 10AS032H1F34I1HG | 10AS048E4F29I3SG | 10AS048E4F29I3LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35 mm) | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 480,000 | 480,000 | 320,000 | 480,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | 1 (fastest) | 1 | 1 | 3 (slower) | 3 (lower power) |
| Temperature Grade | Industrial (-40 C to +100 C) | Extended | Industrial | Industrial | Industrial |
| User I/O Count | 492 | 492 | [DATA_NEEDED] | 492 | 492 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Approx. Unit Price (USD, as of 2026-09-05) | 3,986.86 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic density in the same 1152-ball FC-FBGA footprint (vs 10AS032H1F34I1HG)
- Fastest speed grade in the Arria 10 SX 480K family (vs 10AS048E4F29I3SG)
- Industrial temperature grade with full -40 C to +100 C support (vs 10AS048H1F34E1HG)
- True SoC integration eliminates external host CPU (vs 10AS048 (GX variant without HPS))
Design Notes
The 1152-ball FC-FBGA package at 1.0 mm ball pitch requires a high-layer-count PCB stack-up (12 layers or more) with laser-drilled microvias for fan-out. Use a symmetric stack-up to prevent BGA warpage during reflow, and follow Intel's via-in-pad recommendations for the inner rows of the BGA. Allocate at least 4 internal layers to solid ground and 2 to power for return-path integrity on the high-speed HPS DDR3/4 interfaces.
Estimated: at 70% logic utilization with active transceivers, the 10AS048H1F34I1HG dissipates 18-22 W; at full utilization with all transceivers active, dissipation can reach 30+ W. The 35x35 mm FC-FBGA has a thermal resistance of approximately 1.0 C/W with the recommended thermal via array and thermal interface material. Use a heatsink plus 200 LFM airflow for industrial-grade reliability, and simulate the junction-to-ambient thermal path in your mechanical CAD before committing to layout.
The Arria 10 SX SoC requires multiple power rails: 0.9 V core, 1.1 V auxiliary, 1.5 V/1.8 V/2.5 V/3.0 V user I/O banks, 1.2 V DDR3/4 for the HPS, and 1.8 V/2.5 V for transceiver channels. Use a PowerTree-aware sequencing controller (such as the LTC2977 or LTM4677) to enforce Intel's power-up and power-down sequencing requirements; incorrect sequencing can latch-up the device. Decouple every rail with bulk ceramic and polymer capacitors placed within 100 mil of each BGA power pin.
HPS DDR3/4 interfaces require matched-length routing within +/-25 mil across the byte lane and matched impedance of 50 ohm single-ended (100 ohm differential for DDR4). The FPGA fabric's high-speed transceivers need 85-100 ohm differential routing with length matching within +/-0.1 mm across the P and N pairs. Use Intel's Quartus Prime Pin Planner and the Arria 10 EMIF Toolkit to validate DDR timing closure before fabrication.
Do not confuse the H (industrial temperature) suffix with the E (extended) suffix when sourcing - the E variant is for harsher ambient conditions. Also avoid the F35 vs F34 package code distinction - F35 indicates a different transceiver lane count, which changes the BGA ball map. Always verify the exact MPN against Intel's ordering information guide before issuing a purchase order. Note: cross-package alternatives such as the 10AS048H4F35I3SG (1517-ball BGA) are NOT drop-in and require PCB rework.
Compliance Information
RoHS and lead-free compliance confirmed via distributor listings. AEC-Q100 not applicable (industrial/extended-grade part, not automotive-qualified). Conflict-minerals compliance per Intel corporate policy.
