10AS048H2F34I1HG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
MPN: 10AS048H2F34I1HG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3488.37 | $3,488.37 |
| 10 | $3295 | $32,950.00 |
| 100 | $2980 | $298,000.00 |
| 500 | $2750 | $1,375,000.00 |
| 1,000 | $2520 | $2,520,000.00 |
Drop-in alternatives for 10AS048H2F34I1HG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet β10AS048H2F34I1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Fabric Frequency | 1.5 GHz |
| Package | 1152-FBGA, FC (35x35 mm) |
| User I/O Pins | 492 |
| Transceivers | Up to 24 channels |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Speed Grade | H2 |
| Temperature Grade | Industrial (I1), -40C to 100C |
| Process Technology | 20 nm TSMC |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| I/O Standard Support | LVCMOS / LVDS / LVTTL up to 3.3 V |
10AS048H2F34I1HG Pin Configuration
| Pin 1 | BALL_A1 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 2 | BALL_A2 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 3 | BALL_A3 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 4 | BALL_A4 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 5 | BALL_A5 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 6 | BALL_A6 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 7 | BALL_A7 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 8 | BALL_A8 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 9 | BALL_A9 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 10 | BALL_A10 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 11 | BALL_A11 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 12 | BALL_A12 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 13 | BALL_B1 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 14 | BALL_B2 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 15 | BALL_B3 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 16 | BALL_B4 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 17 | BALL_B5 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 18 | BALL_B6 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 19 | BALL_B7 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 20 | BALL_B8 β Package ball; refer to Arria 10 F34 pin connection guidelines for function |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H2F34I1HG is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, Broadcast Video Encoder/Decoder, Industrial Machine Vision & Video Inspection, Radar and Electronic-Warfare Signal Processing, 5G Fronthaul Digital Pre-Distortion (DPD), Embedded ARM-Linux Controller with FPGA Acceleration.
Software-Defined Radio (SDR) Baseband
The 10AS048H2F34I1HG fits SDR baseband processing because its dual ARM Cortex-A9 HPS runs the real-time OS and protocol stack while the FPGA fabric executes wideband DDC/DUC, channelization, and FFT kernels. With up to 24 transceivers at 17.4 Gbps, the same die can host multi-band RF aggregation for cellular, defense, or airborne SDRs; the industrial -40C to 100C grade supports outdoor and vehicular deployments. Companion parts include the AD9361 RF transceiver, HMC7044 clock generator, and DDR3/LPDDR3 memory for waveform buffers.
Recommended
Broadcast Video Encoder/Decoder
Broadcast 4K/UHD video codecs and contribution encoders benefit from the 10AS048H2F34I1HG's 480K logic elements plus variable-precision DSP for HEVC/H.264 motion estimation and deblocking filtering. The HPS runs the transport stream, scrambling, and IP/ASI mux while the FPGA fabric handles real-time video processing at 60 fps. The 1152-FBGA F34 package provides the 492 user I/Os needed for multiple SDI/HDMI/DisplayPort interfaces. Companion parts include the ADV7511 HDMI transmitter, M25P flash for boot, and Ethernet PHYs for IP transport.
Recommended
Industrial Machine Vision & Video Inspection
The 10AS048H2F34I1HG's parallel logic resources and DSP blocks accelerate industrial machine-vision pipelines: image rectification, color-space conversion, defect detection, and CNN inference at line rates. The industrial temperature range (-40C to 100C) supports factory-floor and outdoor installations, while the HPS can run Linux with GigE Vision drivers and OPC-UA connectivity. With 24 transceivers, multiple CoaXPress or GigE Vision cameras can be aggregated. Companion parts include PoE+ controllers, image sensors, and DDR4 memory for high-throughput buffering.
Recommended
Radar and Electronic-Warfare Signal Processing
The 10AS048H2F34I1HG is suited for radar and EW systems where wide instantaneous bandwidth and high throughput matter; the 24 transceivers up to 17.4 Gbps handle A/D data capture while the 480K logic elements plus DSP blocks run pulse compression, CFAR detection, and jammer cancellation in real time. The hardened HPS hosts Linux for situational-awareness software and tracks the operator interface. Industrial temperature grade supports airborne, shipboard, and ground-vehicle platforms. Companion parts include the AD9208 wideband ADC, HMC830 PLL, and signal-conditioning amplifiers.
Recommended
5G Fronthaul Digital Pre-Distortion (DPD)
In 5G massive-MIMO and fronthaul links, the 10AS048H2F34I1HG runs wideband DPD and CFR (crest-factor reduction) on the FPGA fabric while the HPS handles CPRI/eCPRI MAC, Ethernet, and management. Up to 24 transceivers support multi-radio aggregation and the variable-precision DSP blocks accelerate matrix inversions and LUT updates. The industrial temperature range covers outdoor radio units. Companion parts include the AD9371 transceiver, PoE controllers, and PTP/SyncE clock devices for fronthaul timing.
Recommended
Embedded ARM-Linux Controller with FPGA Acceleration
The 10AS048H2F34I1HG is an excellent choice for industrial controllers that must combine a full Linux operating system on the HPS with custom FPGA accelerators - for example, deterministic real-time EtherCAT motion controllers, predictive-maintenance vibration processors, or factory-edge AI gateways. The HPS runs Linux + Docker with OPC-UA, MQTT, and TLS; the FPGA handles high-speed I/O (EtherCAT, Profinet, RS-485) and time-critical DSP. Industrial temperature grade enables deployment in unshielded enclosures. Companion parts include the TPS7A4701 LDO, Ethernet PHYs, and industrial flash.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H2F34I1HG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H1F34I1HG | 10AS048H2F34E1HG | 10AS048H2F34E2SG | 10AS048H2F34E2LG | 10AS048H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 480K | 480K - same | 480K - same | 480K - same | 480K - same | 480K - same |
| Speed Grade | H2 | H1 (slower) | H2 - same | H2 - same | H2 - same | H1 (slower) |
| Temperature Grade | Industrial -40C to 100C (I1) | Industrial -40C to 100C (I1) | Enhanced 0C to 100C (E1) | Enhanced 0C to 100C (E2) | Enhanced 0C to 100C (E2) | Enhanced 0C to 100C (E1) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Maximum Transceiver Data Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade (-40C to 100C) with H2 speed (vs 10AS048H2F34E1HG)
- Highest H2 speed grade within the 10AS048 F34 industrial family (vs 10AS048H1F34I1HG)
- 1152-ball FCBGA package supports maximum transceiver count (vs 10AS048H2F34E1HG)
Design Notes
The 1152-ball FCBGA (35x35 mm) F34 package has a relatively high theta_JB (junction-to-board) of approximately 0.5 C/W and theta_JC (junction-to-case) of 0.05 C/W; designers MUST mount the exposed die-attached pad over a high-layer-count PCB with a thermal via array under the package center to dissipate up to ~20 W of fabric + HPS power. Recommended stack-up is 12+ layers with continuous inner-plane copper under the BGA and a heat sink or top-side heat-spreader for industrial deployments above 8 W total power. Estimated: at 15 W dissipation and 70 C/W theta_JA, junction rises 150 C above ambient; refer to Quartus Prime Power Analyzer early in the design.
The 35x35 mm 1152-FBGA F34 package requires microvia (laser-drilled) stack-up with 1 mm or 0.8 mm pitch escape routing; do NOT attempt 0.5 mm-pitch fan-out without 0.1 mm microvias. Per Intel pin connection guidelines, 0.4 mm-pitch escape is recommended. Decoupling capacitors (0.1 uF, 1 uF, 10 uF) must be placed within 2 mm of the BGA on the BOTTOM side to minimize inductance. Power-plane cuts under the BGA can cause simultaneous switching noise (SSN); keep at least 0.5 mm clearance and stitch with GND vias every 2-3 mm.
Three common pitfalls with the 10AS048H2F34I1HG: (1) do NOT omit MSEL configuration-pin pull resistors - incorrect MSEL setting will prevent configuration; (2) when designing HPS boot, ensure JTAG pins (TCK, TMS, TDI, TDO) are correctly pulled to known logic levels to prevent HPS entering test mode; (3) DDR3/DDR4 routes to the HPS must be length-matched within the stringent tDS/tDH budgets in Quartus Prime - use the DDR pin-macro assignments tool. Also be aware that transceiver reference clocks must be AC-coupled with 100 nF capacitors at the XCVR pins, otherwise CDR locking will fail.
Compliance Information
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable (FPGA, not automotive discrete). Halogen-free status not explicitly confirmed in verified data. Conflict-minerals compliance inferred from Intel supply-chain program.
