10AS048H2F34E2LG - Arria 10 SX 480K SoC FPGA, Dual A9, 1152-FBGA | Intel
MPN: 10AS048H2F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 100 | $2530 | $253,000.00 |
| 500 | $2395 | $1,197,500.00 |
| 1,000 | $2280 | $2,280,000.00 |
Drop-in alternatives for 10AS048H2F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048H2F34E1HG
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View Datasheet →10AS048H2F34E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 480000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Package | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Industrial / Medical (per OPN code H2) |
| Logic Family | Arria 10 SoC FPGA |
| RoHS Status | Compliant |
| MSL Level | 3 (per FBGA package) |
10AS048H2F34E2LG 1152-ball fc-fbga (f34), 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS048H2F34E2LG (1152-ball fc-fbga (f34), 35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H2F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H2F34E2LG is suitable for 6 applications: Medical Ultrasound Beamforming, Industrial Machine Vision, Broadcast Video Processing, Military/Aerospace Signal Intelligence, 5G Baseband Prototyping, Avionics Displays and Control.
Medical Ultrasound Beamforming
The 10AS048H2F34E2LG's 480K logic elements and variable-precision DSP blocks are ideal for beamforming in cart-based and portable ultrasound systems. The dual-core ARM Cortex-A9 HPS runs the user interface, scan-conversion, and DICOM stack, while the FPGA fabric executes parallel delay-and-sum beamforming across 64-256 channels in real time. The 0.9V core keeps thermal envelopes manageable inside sealed transducer enclosures. With 1.5 GHz HPS clock, the part also supports elastography and Doppler post-processing alongside beamforming. Compared to discrete DSP+MCU solutions, the integrated SoC FPGA reduces BOM, simplifies deterministic latency, and shortens regulatory pathways for medical device certification.
Recommended
Industrial Machine Vision
For high-throughput machine vision on factory floors, the 10AS048H2F34E2LG provides enough logic and DSP bandwidth to process 4K camera streams at line rate, running defect-detection CNNs on fabric plus a Linux control plane on the dual A9. The 1.5 GHz Cortex-A9 MPCore handles GigE Vision protocol stacks and PLC handshaking, while fabric DSP accelerates convolutional layers. The 1152-ball F34 BGA exposes sufficient user I/O for multi-camera LVDS/MIPI bridging. Industrial temperature OPN variants in the same package simplify qualification of vision cells operating in elevated ambient conditions.
Recommended
Broadcast Video Processing
The 10AS048H2F34E2LG's fabric and HPS split supports broadcast video processing pipelines including 4K/UHD up/down/cross-conversion, HDR tone-mapping, and multi-screen SDI mosaics. FPGA transceivers handle 12G-SDI and SMPTE 2110 IP transport while the dual-core ARM runs a real-time Linux media framework. The 480K logic elements provide headroom for advanced features such as motion-adaptive deinterlacing and AI-assisted upscaling. The device's deterministic fabric timing also suits live production environments where frame-accurate switching is required.
Recommended
Military/Aerospace Signal Intelligence
Defense SIGINT and electronic-warfare subsystems benefit from the 10AS048H2F34E2LG's combination of hardened A9 cores for command/control and dense FPGA fabric for wideband digital down-conversion and channelization. The dual ARM runs secure firmware and crypto, while the fabric implements fast-Fourier transforms and pulse de-interleaving across hundreds of MHz of instantaneous bandwidth. With suitable ruggedization and conduction cooling, the part supports airborne EW pods where SWaP-C constraints favor SoC integration. The Cortex-A9 HPS also eases porting of existing signal-classification ML inference stacks.
Recommended
5G Baseband Prototyping
For 5G NR baseband prototyping and pre-silicon validation, the 10AS048H2F34E2LG provides 480K logic elements paired with a multi-GHz HPS to emulate L1/L2 stacks. The FPGA fabric implements PHY accelerators (LDPC, polar coding, FFT/iFFT), while the dual A9 hosts the L2/L3 protocol stack under Linux. Designers iterate faster than waiting for ASIC availability, and the same hardware later informs ASIC porting decisions. The 1152-ball BGA also supports the high I/O count needed for CPRI/eCPRI fronthaul interfaces to RF modules.
Recommended
Avionics Displays and Control
Avionics flight decks leverage the 10AS048H2F34E2LG to drive multi-panel glass-cockpit displays while running ARINC 653 partitioned real-time OS on the hardened ARM cores. The FPGA fabric accelerates graphics overlay rendering and synthetic-vision terrain rendering, and the integrated HPS simplifies DO-178C certification by isolating safety-critical software from the FPGA fabric. The 35x35 mm F34 BGA with high pin density suits line-replaceable units where PCB area is at a premium. Industrial/extended temperature OPN variants support the wide thermal range required by unpressurized avionics bays.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H2F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H2F34E1HG | 10AS048H1F34E1HG | 10AS032H4F34E3SG | 10AS032H4F34E3LG | 10AS032H4F34I3LG | 10AS032H4F34I3SG |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F34, 35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480000 | 480000 | 480000 | 320000 (-33%) | 320000 (-33%) | 320000 (-33%) | 320000 (-33%) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Unit Price (qty 1, USD, as of 2026-09-05) | ~$2850 | [DATA_NEEDED] | [DATA_NEEDED] | lower (smaller die) | lower (smaller die) | lower (smaller die) | lower (smaller die) |
Key Differentiators
- Highest-density same-footprint option for production volume (vs 10AS032H4F34E3LG)
- Medical/industrial OPN bin supports broader thermal range (vs 10AS048H2F34E1HG)
- Dual-core A9 HPS is hardened - does not consume fabric (vs Soft-core Nios II on Cyclone V SoC)
Design Notes
The 1152-ball F34 BGA (35x35 mm) is a high-power device; with SmartVID at 0.9V core and full fabric+HPS utilization, sustained power can reach 20-30W. Design a thermal solution with at least 4 thermal vias in the BGA land pad pattern and consider a heat-spreader or low-profile heatsink. Estimated: at 25W dissipation and standard JEDEC still-air thermal resistance, junction-to-ambient could exceed 100C without active cooling - validate against actual workload using the Arria 10 PowerPlay early power estimator.
Use 1.0 mm ball pitch routing per the F34 package guidelines with microvia stack-up (any-layer HDI recommended). Maintain 100-ohm differential impedance on transceiver pairs and 50-ohm single-ended on general-purpose I/O. Place HPS DDR3/4 controller within 25 mm of the BGA with matched-length fly-by topology; the EMIF Toolkit in Quartus is mandatory for sign-off. Decouple core and HPS supplies with a mix of 100 nF, 10 uF, and 47 uF ceramics per the Arria 10 pin connection guidelines.
Do not confuse the SX (SoC, dual A9) family with the GX (transceiver-rich, no HPS) family when ordering - they share the 10AS prefix but require different Quartus configurations and pinouts. Also, SmartVID requires an external controller or proper VID pull-up/down resistor network at boot; missing this network causes boot failure. Reference the Intel Application Note AN754 (Arria 10 SoC boot) before PCB layout.
Compliance Information
RoHS and lead-free per Altera/Intel product declarations. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC; for AEC-Q100 qualified logic, a separate product line is required. Per Intel supplier responsibility disclosures, the part is conflict-minerals compliant.
