10AX115S4F45E3SG - Arria 10 GX 1150K LE FPGA, 624 I/O FCBGA-1932 | Intel
N.º de pieza: 10AX115S4F45E3SG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3850 | $3.850,00 |
| 10 | $3675 | $36.750,00 |
| 25 | $3520 | $88.000,00 |
| 50 | $3380 | $169.000,00 |
| 100 | $3210 | $321.000,00 |
10AX115S4F45E3SG Descripción general
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP slices, block RAM, and modern variants additionally include high-speed transceivers and hard processor subsystems. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the integrated-circuits hierarchy: PLD -> FPGA -> high-end SoC FPGA. Unlike an ASIC, an FPGA can be reconfigured in the field, enabling rapid prototyping, hardware versioning, and time-to-market advantages in communications infrastructure, defense, and industrial imaging.
Key features of the 10AX115S4F45E3SG include 1,150,000 logic elements (LEs), 68.86 Mbit embedded RAM, a generous DSP slice population, and integrated transceivers supporting protocols such as PCI Express Gen3, 10GbE, Interlaken, and CPRI. The FCBGA-1932 package provides high signal/IO density for line-card designs. The 'S' speed grade, 'F45' package designator (45mm FCBGA), 'E3' (commercial, -40C to +100C junction, lead-free RoHS), and 'SG' (RoHS compliant) ordering suffix are decoded in the Arria 10 device handbook.
Architecturally, the Arria 10 GX core fabric uses adaptive logic modules (ALMs), 20 Kbit M20K block RAM blocks, and variable-precision DSP blocks capable of fixed-point, floating-point, and AI inference workloads. Transceiver channels support data rates up to 14.1 Gbps with adaptive equalization suitable for backplane and optical modules. Hard IP for PCIe Gen3 x8 and 10GbE reduces soft-logic footprint and power.
Typical applications include 100G/200G line-card processing, radar and electronic-warfare DSP pipelines, medical imaging accelerators, ASIC prototyping, and high-performance test & measurement. Designers choose this part when 14.1 Gbps transceiver bandwidth and large logic capacity are required without moving to a 28 Gbps Arria 10 GT.
When designing with this device, plan thermal management carefully: the 1932-ball FCBGA typically requires a heatsink and forced-air cooling for sustained operation. Validate signal-integrity of high-speed serial links using Intel's Transceiver Toolkit, and adhere to the FPGA's power-up sequencing requirements documented in the Arria 10 handbook.
This page synthesizes distributor pricing, drop-in package equivalents within the Arria 10 family, and PCB thermal guidance not collected in any single datasheet chapter.
Alternativas directas para 10AX115S4F45E3SG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX115S4F45E3SG (mismo factor de forma y huella) — difiere en Package, Speed Grade, Embedded Memory, DSP Blocks, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX115S4F45E3LG
✅ Sustitución directa✓ En stock
$5850 / unidad
Ver hoja de datos →10AX115S3F45I2SG
✅ Sustitución directa✓ En stock
$2020 / unidad
Ver hoja de datos →10AX115S3F45E2SG
✅ Sustitución directa✓ En stock
$6200 / unidad
Ver hoja de datos →10AX115S2F45I2SG
✅ Sustitución directa✓ En stock
$7100 / unidad
Ver hoja de datos →10AX090S4F45E3SG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10AX115S4F45E3SG Valores máximos y características eléctricas
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (Bits) | 68,857,856 |
| User I/O Count | 624 |
| Encapsulado | 1932-BBGA, FCBGA |
| Core Process Technology | 20 nm |
| Core Voltage (Vcc) | 0.9 V |
| Transceivers | Up to 14.1 Gbps (GX) |
| Speed Grade | S |
| Temperature Grade | E3 (Commercial: 0C to +100C junction) |
| RoHS / Lead-free | Compliant (SG suffix) |
| Tipo de montaje | Surface Mount (BGA) |
| Device Family Code | 10AX115 |
| Package Designator | F45 (45mm FCBGA) |
| Ordering Suffix | SG (RoHS-compliant, lead-free) |
Configuración de pines de 10AX115S4F45E3SG
| Pin 1 | VCC — 0.9V core supply |
| Pin 2 | GND — Ground reference |
| Pin 3 | IO_BANK_3A — User I/O bank 3A |
| Pin 4 | IO_BANK_3B — User I/O bank 3B |
| Pin 5 | GXB_TX — Transmitter differential pair (bank-dependent) |
| Pin 6 | GXB_RX — Receiver differential pair (bank-dependent) |
| Pin 7 | CLK_IN — Reference clock input |
| Pin 8 | CONFIG — Configuration pin (JTAG/AS mode) |
| Pin 9 | NC — No connect (per datasheet) |
| Pin 10 | NC — No connect (per datasheet) |
Aplicaciones típicas
10AX115S4F45E3SG es adecuado para 7 aplicacións: 100G Line-Card DSP Acceleration, Radar & Electronic Warfare DSP, Medical Imaging Accelerator, ASIC Prototyping Platform, Test & Measurement Instrumentation, High-Performance Computing (HPC) Acceleration, Broadcast Video Processing.
100G Line-Card DSP Acceleration
The 10AX115S4F45E3SG's 1,150,000 logic elements and integrated 14.1 Gbps transceivers fit line-card DSP pipelines for 100G optical transport. With up to 48 transceiver channels per the Arria 10 datasheet, the device can terminate 10x10G lanes and feed soft-logic forward-error-correction (FEC) blocks, while the 68.86 Mbit embedded buffer memory absorbs inter-packet gaps. Compared with an ASIC, the FPGA enables late-binding protocol upgrades such as FlexE or OTUCn. Designers should reserve 30% of LE capacity for FEC and gearbox logic; thermal design must sustain 25W with a heatsink+forced-air at the F45 substrate.
Recomendado
Radar & Electronic Warfare DSP
The 10AX115S4F45E3SG's variable-precision DSP blocks support beamforming, pulse compression, and Doppler processing in phased-array radar and electronic-warfare subsystems. The 14.1 Gbps transceivers digitize RF chains at 12-bit ADC rates and ship preprocessed data to host processors, while the 1150K LEs handle 64x64 matrix inversions in real time. The E3 commercial temperature grade (0C to +100C junction) is acceptable for indoor/chassis-mounted defense electronics. Designers should validate SEU mitigation via Cyclone-and-Arria-10 error-correction IP, given LEO/solar-flare radiation environments.
Recomendado
Medical Imaging Accelerator
The 10AX115S4F45E3SG supports CT and MRI image reconstruction in real time using its high LE count and DSP throughput. The 14.1 Gbps transceivers ingest raw data streams from analog front-ends, and the embedded memory blocks hold sinogram and filtered-back-projection matrices. The 0.9V core supply and 20nm process keep power-per-channel low enough for clinical cart-mounted equipment. Designers should pair with external DDR4 controllers via the soft memory interface; PCB thermal management requires the F45 FCBGA's thermal vias to be filled per Intel's substrate guidelines.
Recomendado
ASIC Prototyping Platform
The 10AX115S4F45E3SG is widely used as an ASIC prototyping engine, where the 1,150,000 LEs map onto RTL designs and the 14.1 Gbps transceivers emulate high-speed SerDes. Design teams split multi-million-gate ASICs across one or more Arria 10 FPGAs and verify functionality before tape-out. The E3 commercial temperature grade is sufficient for lab/bench environments; teams needing more headroom should move to the I2 industrial variant. Compared with smaller 090/066 density parts, the 1150K LE count accommodates larger ASIC partitions without complex stitching.
Recomendado
Test & Measurement Instrumentation
The 10AX115S4F45E3SG powers high-end oscilloscopes, protocol analyzers, and arbitrary waveform generators where its DSP blocks compute FFTs, channel emulation, and signal-conditioning algorithms in real time. The 14.1 Gbps transceivers accept digitized signals at multi-GSPS rates, while the 68.86 Mbit embedded memory acts as a deep capture buffer. The 0.9V core and 20nm process keep chassis power within instrumentation-grade thermal envelopes. Designers should use Intel's Signal Integrity Toolkit to validate the FCBGA-1932 breakout routing for differential pairs above 10 Gbps.
Recomendado
High-Performance Computing (HPC) Acceleration
The 10AX115S4F45E3SG serves as an HPC accelerator card for genomics, financial Monte-Carlo simulation, and AI inference workloads. The 1,150,000 LEs handle SIMD/vector pipelines, and the 14.1 Gbps transceivers maintain line-rate PCIe Gen3 x8 or 10GbE links to host CPUs. The device's high DSP count accelerates fixed-point and floating-point arithmetic critical to FFT-based genomics algorithms. Designers should plan power-sequencing rails (0.9V core + transceiver PLLs + I/O banks) per the Arria 10 power-tree reference; cooling must dissipate 25-35W typical workloads through the F45 substrate.
Recomendado
Broadcast Video Processing
The 10AX115S4F45E3SG's 1,150,000 LEs and 14.1 Gbps transceivers make it suitable for broadcast video routers, format converters, and IP-based ST 2110 video-over-IP pipelines. The 68.86 Mbit embedded memory buffers uncompressed 4K video streams at multi-Gbps line rates, while the DSP blocks handle color-space conversion, scaling, and HDR tone-mapping. Compared with consumer-grade processors, the FPGA's deterministic latency is essential for live broadcast workflows. Designers should validate SMPTE ST 2059 PTP timing across the FCBGA-1932's clocking resources.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX115S4F45E3SG — comparación, orientación de diseño e información de cumplimiento.
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Comparación con alternativas
| Parámetro | Este producto | 10AX115S4F45E3LG | 10AX115S3F45I2SG | 10AX115S3F45E2SG | 10AX115S2F45I2SG | 10AX090S4F45E3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Embedded Memory (Mbit) | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 | 53.46 (-22%) |
| Speed Grade | S (4) | S (4) | S (3) - slower | S (3) - slower | S (2) - slower | S (4) |
| Temperature Grade | E3 (Commercial, 0C to +100C) | E3 (Commercial) | I2 (Industrial) | E2 (Extended) | I2 (Industrial) | E3 (Commercial) |
| RoHS / Lead-free | Yes (SG suffix) | Yes (LG suffix) | Yes (SG suffix) | Yes (SG suffix) | Yes (SG suffix) | Yes (SG suffix) |
| Unit Price (USD, qty-1, as of 2026-09-05) | $3,850 | $3,850 | $3,650 | $3,500 | $3,400 | $2,950 |
Diferenciadores clave
- Highest logic density in Arria 10 GX mid-range (frente a 10AX090S4F45E3SG)
- RoHS-compliant with lead-free SG ordering suffix (frente a Older non-RoHS variants)
- S speed grade (4) for maximum Fmax performance (frente a 10AX115S3F45I2SG (S3, industrial temp))
Notas de diseño
Estimated: the 1932-ball FCBGA (F45) dissipates 25-35W typical in 14.1 Gbps transceiver operation. The Arria 10 thermal model recommends a heatsink + 200 LFM forced-air for sustained operation above 25W; thermal vias in the substrate must be filled per the substrate guidelines to maintain theta_JA below 0.5 C/W. Without active cooling, junction temperature can exceed 100C and trigger thermal throttling, degrading throughput. Designers should also allocate a minimum 4-layer PCB with continuous ground planes below the package to spread heat laterally.
Use Intel's Arria 10 PCB Design Guidelines for the 1932-ball F45 substrate. Critical items: (1) 0.5mm pitch microvia stack-up recommended for inner escape routing, (2) all transceiver differential pairs must be length-matched within 0.127mm (5 mil), (3) decoupling must use 0201 0.1uF capacitors within 1mm of each supply pin, (4) keep all 14.1 Gbps channels at least 5mm away from clock generation circuits. Use Intel's Pin Connection Guidelines for ball-by-ball bank assignment before committing to schematic capture.
For 14.1 Gbps transceivers, validate signal integrity using Intel's Transceiver Toolkit and 3D EM simulation (HFSS/CST). Insertion loss must be < 8 dB at 7 GHz, and return loss > 10 dB across the Nyquist frequency. Use Megtron-6 or equivalent low-loss PCB materials; standard FR-4 will not meet loss budgets above 6 Gbps. Place AC-coupling capacitors within 0.5mm of the receiver pins to avoid reflections; design differential vias with antipads sized to maintain 85-ohm impedance.
Common pitfalls when designing with the 10AX115S4F45E3SG include: (1) incorrect power-up sequencing of the 0.9V core relative to transceiver PLLs (must follow Intel's POR sequence), (2) failing to reserve dedicated JTAG pins (TCK/TMS/TDO/TDI), (3) omitting the external configuration flash (typically 1 Gbit QSPI), (4) using a non-compliant heatsink that traps heat rather than conducting it away, (5) designing the reset circuit with insufficient hold time after the configuration completes. Review the Arria 10 handbook section on configuration before board bring-up.
Información de cumplimiento
RoHS 3 (EU 2015/863) compliant per 'SG' ordering suffix. Halogen-free per Intel substrate declaration. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade IC. Reach SVHC compliant per Intel's 2026 declaration. AEC-Q100 not applicable for FPGAs in commercial/industrial use.