10CX220YF672I6G - Cyclone 10 GX 220K LE FPGA, 672-FCBGA | Intel
MPN: 10CX220YF672I6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462 | $4,620.00 |
| 100 | $425 | $42,500.00 |
| 500 | $392 | $196,000.00 |
| 1,000 | $365 | $365,000.00 |
10CX220YF672I6G Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, routing, and I/O can be reconfigured by the end user after manufacture. Within the broader semiconductor taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside ASICs and CPLDs, occupying the niche between fixed-function ASICs and software-driven processors. The Cyclone 10 GX family is Intel's (formerly Altera's) low-power, transceiver-equipped line that targets high-throughput serial interfaces without the power envelope of the high-end Stratix series.
Key features of the 10CX220YF672I6G include up to 12.5 Gbps transceiver capability, hard PCIe Gen2 IP blocks, hard memory controllers for DDR3/DDR4/LPDDR3, variable-precision DSP blocks, and 1.4 Gbps LVDS support. The FCBGA-672 package provides a compact 27x27 mm footprint suitable for space-constrained PCIe cards, vision processing boards, and broadcast video bridges. Power is supplied through dedicated VCC, VCCP, VCCERAM, VCCBAT, and transceiver rails requiring careful sequencing per the Intel pin connection guidelines.
The 10CX220YF672I6G uses a logic-structure architecture based on adaptive logic modules (ALMs) feeding into a segmented routing fabric, with dedicated hardware for transceivers, memory interfaces, and DSP multiplication. This heterogeneous mix allows the same die to simultaneously drive multi-gigabit serial links, perform block-RAM-backed image buffering, and run fixed-point DSP filtering, all under hard real-time latency guarantees that no general-purpose processor can match.
Typical applications include industrial machine vision and frame-grabber boards, broadcast video processing, low-cost PCIe acceleration cards, factory automation controllers, and protocol bridging for medical imaging or test equipment. The 672-ball BGA footprint supports designs requiring up to 12 high-speed transceiver channels alongside moderate logic capacity.
When designing with this device, observe Intel's recommended decoupling scheme of 100 nF and 10 uF capacitors near every power pin, maintain a continuous ground plane beneath the BGA, and route all high-speed transceiver channels with reference-controlled differential impedance per Intel's PCB guidelines. Configuration via JTAG, AS, or PS modes must use the appropriate Intel Quartus Prime programmer.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single reference for the 10CX220YF672I6G.
Drop-in alternatives for 10CX220YF672I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10CX220YF672I6G (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX220YF672I5G
✅ Drop-In✓ In Stock
$600 / Unit
View Datasheet →10CX220YF672E6G
✅ Drop-In✓ In Stock
$925 / Unit
View Datasheet →10CX220YF672E5G
✅ Drop-In✓ In Stock
$342 / Unit
View Datasheet →10CX150YF672I6G
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →10CX150YF672I5G
✅ Drop-In✓ In Stock
$278.4 / Unit
View Datasheet →10CX105YF672I6G
✅ Drop-In✓ In Stock
$338 / Unit
View Datasheet →10CX085YF672I6G
✅ Drop-In✓ In Stock
$255 / Unit
View Datasheet →10CX220YF672I6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 220,000 |
| Adaptive Logic Modules (ALM) | 82,760 |
| Total Memory Bits | 13,752,320 |
| M20K Memory Blocks | 236 |
| 18x19 Multipliers | 236 |
| Variable-Precision DSP Blocks | Yes |
| Maximum Transceiver Data Rate | 12.5 Gbps |
| Transceiver Channels | Up to 12 |
| Hard Memory Controller | DDR3/DDR4/LPDDR3 |
| Hard PCIe Gen2 IP Blocks | Yes |
| Package | 672-ball FCBGA (F672), 27x27 mm |
| Process Technology | TSMC 20 nm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Supply Voltage Rails | VCC, VCCP, VCCERAM, VCCBAT, VCCRT, VCCEHT, VCCCHIP |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) |
| RoHS Status | Compliant |
10CX220YF672I6G 672-ball fcbga (f672), 27x27 mm Pin Configuration Guide
Pin configuration for 10CX220YF672I6G (672-ball fcbga (f672), 27x27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YF672I6G.
Refer to the datasheet for full pin configuration.
Typical Applications
10CX220YF672I6G is suitable for 6 applications: Industrial Machine Vision Frame Grabbers, Broadcast Video Processing and Format Conversion, Low-Cost PCIe Acceleration Cards, Factory Automation and Protocol Bridging, Medical Imaging and Diagnostic Equipment, Test and Measurement Instrumentation.
Industrial Machine Vision Frame Grabbers
The 10CX220YF672I6G is well-suited to multi-channel industrial machine vision pipelines where its 220,000 logic elements, 236 M20K memory blocks (13,752,320 bits), and 236 18x19 multipliers can run Bayer demosaic, gamma correction, and edge detection on parallel image streams. The 12.5 Gbps transceivers accept CoaXPress or GigE Vision links directly into the FPGA, while the 672-ball FCBGA exposes enough LVDS pairs for parallel image sensors. Power dissipation for a typical 4-channel 1080p60 processing load is on the order of 5 to 8 W, comfortably handled with forced-air cooling on a PCIe form-factor board. The industrial -40C to +100C temperature grade permits deployment in unconditioned factory-floor cabinets.
Recommended
Broadcast Video Processing and Format Conversion
For broadcast studios handling SDI ingest and 4K format conversion, the 10CX220YF672I6G delivers the logic density to handle multi-stream scaling, deinterlacing, and color-space conversion in a single device. The 12.5 Gbps transceivers carry 12G-SDI directly without external reclockers, and the 13.7 Mbit of embedded RAM supports 4K line buffers in single-pass conversion pipelines. The DDR4 hard memory controller removes the need for external memory-controller IP, freeing ALM cycles for processing. Engineers typically run the device at the industrial speed grade 5 variant (10CX220YF672I5G) when meeting tight broadcast frame-rate budgets.
Recommended
Low-Cost PCIe Acceleration Cards
The 10CX220YF672I6G integrates hard PCIe Gen2 IP blocks, allowing direct PCIe x4 endpoint implementation without consuming ALM logic for the PCIe controller. Designers use the 220K LE fabric to host custom accelerators for compression, encryption, or DSP offload from the host CPU, while the 12.5 Gbps transceivers drive the PCIe link. The 672-ball FCBGA's 27x27 mm footprint fits standard low-profile PCIe cards with on-board DDR3 or DDR4 memory attached through the hard memory controller. Compared with host-side software acceleration, a typical FPGA implementation delivers 5x to 20x throughput at 10-15 W total card power.
Recommended
Factory Automation and Protocol Bridging
Factory automation backplanes often require protocol bridges between EtherCAT, PROFINET, EtherNet/IP, and legacy fieldbus segments, and the 10CX220YF672I6G's mix of logic density and transceiver channels is a strong fit. The 220K LE fabric can host several deterministic real-time protocol stacks simultaneously, while 13.7 Mbit of block RAM buffers high-speed process I/O. The industrial -40C to +100C temperature grade allows operation inside sealed control cabinets. Reference designs from Intel demonstrate dual-protocol gateways using under 60K ALMs, leaving substantial headroom for customer-specific extensions.
Recommended
Medical Imaging and Diagnostic Equipment
Ultrasound, endoscopy, and digital X-ray systems rely on FPGAs to perform beamforming, pixel-rate filtering, and image reconstruction in real time. The 10CX220YF672I6G's 236 DSP blocks (18x19 multipliers) deliver the multiply-accumulate throughput required for channel-domain beamforming on 64 to 128 element probes, while 13.7 Mbit of block RAM holds sample-line buffers. The 12.5 Gbps transceivers connect directly to high-speed ADC and DAC companion chips used in the analog front-end. Industrial temperature grade and long-life Intel silicon make this device a stable platform for medical OEM designs with multi-year field deployment windows.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators benefit from the 10CX220YF672I6G's combination of high-speed transceivers and generous DSP capacity. The 12.5 Gbps transceivers accept PCIe Gen2, USB 3.0 PHY, and multi-gigabit serial protocols directly, while 236 multipliers perform real-time FFTs, PRBS generation, and signal-conditioning math. The DDR4 hard controller buffers deep acquisition memory, and the 672-ball FCBGA exposes sufficient user I/O for multi-channel analog front-end integration. Industrial temperature grade ensures stable operation in lab and field environments.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YF672I6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YF672I5G | 10CX220YF672E6G | 10CX220YF672E5G | 10CX150YF672I6G | 10CX105YF672I6G |
|---|---|---|---|---|---|---|
| Package | 672-ball FCBGA (F672) | 672-ball FCBGA (F672) - same | 672-ball FCBGA (F672) - same | 672-ball FCBGA (F672) - same | 672-ball FCBGA (F672) - same | 672-ball FCBGA (F672) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 | 105,000 |
| Total Memory Bits | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 8,388,608 | 5,898,240 |
| 18x19 Multipliers | 236 | 236 | 236 | 236 | 156 | 108 |
| Max Transceiver Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended | Extended | Industrial | Industrial |
| Speed Grade | 6 | 5 (faster) | 6 | 5 (faster) | 6 | 6 |
| Process Technology | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
Key Differentiators
- High logic density in 672-ball FCBGA with mid-power envelope (vs 10CX150YF672I6G)
- Industrial temperature grade available (vs 10CX220YF672E6G)
- Cyclone 10 GX silicon is mature and supported by current Quartus Prime (vs Older Cyclone V FPGAs)
Design Notes
Cyclone 10 GX devices require multiple independent supply rails (VCC, VCCP, VCCERAM, VCCBAT, VCCRT, VCCEHT, VCCCHIP) with specific power-up and power-down sequencing as defined in the Intel Cyclone 10 GX power user guide. Place 100 nF and 10 uF decoupling capacitors within the package footprint of every power pin pair, with the smallest capacitor closest to the BGA ball. Estimate: a fully-loaded 10CX220YF672I6G design with 12 active transceiver channels at 10.3125 Gbps typically consumes 8 to 12 W total; use Intel's Early Power Estimator (EPE) spreadsheet before committing to a thermal solution.
The 672-ball FCBGA requires a 1.0 mm ball pitch and a host PCB with high-density interconnect (HDI) stack-up. Use microvia-in-pad technology (laser-drilled stacked vias) on all signal layers beneath the BGA to escape the inner-row balls, and assign at least one solid ground reference plane directly beneath the package. Match high-speed transceiver channels to 100 ohm differential impedance with a maximum intra-pair skew of 0.15 ps according to the Intel PCB design guidelines for Cyclone 10 GX.
The F672 package has a theta_JA of approximately 12 C/W with a 4x4 forced-air airflow at 200 LFM, per the Intel Cyclone 10 GX packaging thermal model. Estimated: at 10 W total dissipation the junction temperature rises 120 C above ambient with no airflow, exceeding the 100 C industrial limit, so at least 200 LFM of forced-air cooling is required for full transceiver utilization. Mount the BGA to a thermal land array on the host PCB and consider a heat-spreader lid for sealed enclosures.
Do not confuse the F672 (672-ball) and F780 (780-ball) FCBGA packages - they share the same Cyclone 10 GX family but have different ball maps and are NOT pin-to-pin compatible; a board designed for F672 cannot accept F780 without redesign. Also ensure VCCBAT (battery-backup RAM supply) is connected even if your design does not use the volatile key store - leaving it floating causes configuration errors during AS mode boot. Always regenerate the pin assignments in Quartus Prime when substituting between speed grades 5 and 6, as some high-speed transceiver channels have different placement restrictions.
All 12.5 Gbps transceiver channels require AC-coupled capacitive interconnects (typically 100 nF) at the FPGA transmitter output to block DC bias. Match the transceiver reference clock to within +/-300 ppm accuracy using a low-jitter oscillator or clock synthesizer; Intel's Cyclone 10 GX transceiver user guide recommends a clock jitter below 150 fs RMS for 10 Gbps links. Route each transceiver channel on the top PCB layer with a continuous ground reference plane, keeping the channel length below 100 mm when possible to minimize insertion loss.
Compliance Information
RoHS lead-free compliant per Intel product page. Industrial temperature grade, not AEC-Q100 automotive qualified. Conflict-minerals statement available from Intel's CSR report.
