10CX220YF780I5G - Cyclone 10 GX 220K LE FPGA | Intel | F780
MPN: 10CX220YF780I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2420 | $242,000.00 |
| 500 | $2210 | $1,105,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
Drop-in alternatives for 10CX220YF780I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CX220YF780I6G
✅ Drop-In✓ In Stock
$121.83 / Unit
View Datasheet →10CX220YF780E5G
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$615 / Unit
View Datasheet →10CX220YF780E6G
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$1720 / Unit
View Datasheet →10CX220YF780I5G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| DSP Blocks | 284 (variable-precision) |
| Maximum User I/O | 284 |
| Transceivers | Up to 12 channels at up to 12.5 Gbps |
| Hard IP | PCIe Gen2 hard IP, hard memory controllers |
| Process Technology | 20 nm |
| Package | 780-BBGA, FCBGA (F780) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | 5 (industrial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Schemes | AS, PS, JTAG, FPP |
10CX220YF780I5G 780-bbga, fcbga (f780) Pin Configuration Guide
Complete pinout information for 10CX220YF780I5G (780-bbga, fcbga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YF780I5G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX220YF780I5G is suitable for 7 applications: Industrial Machine Vision, 4K UHD Video Capture and Processing, Factory Automation and Motor Control, Software Defined Radio (SDR) Platform, PCIe Accelerator Cards for Edge Computing, Medical Imaging and Diagnostics, Aerospace Avionics and UAV Payloads.
Industrial Machine Vision
The 10CX220YF780I5G is ideal for industrial machine vision and image processing pipelines requiring high-speed parallel sensor interfaces. The 220K logic elements and 284 DSP blocks deliver real-time processing for Bayer demosaicing, color correction, and edge detection on streams up to 4K at 60 fps. The 12.5 Gbps transceivers accept MIPI CSI-2, SLVS-EC, or sub-LVDS sensor data via FPGA PHY bridges. Compared to ASSP vision processors, the Cyclone 10 GX delivers deterministic latency and field-upgradable algorithms while consuming less than 8 W typical. The industrial temperature grade (-40C to +100C) supports factory floor deployment without additional thermal management. Companion MPNs include image sensor serializers and external DRAM.
Recommended
4K UHD Video Capture and Processing
Broadcast and professional video capture cards leverage the 10CX220YF780I5G for SDI/HDMI/DisplayPort bridging and color-space conversion. The hard PCIe Gen2 x4 endpoint IP delivers up to 20 Gbps host throughput, sufficient for uncompressed 4K 60p video ingest. Embedded memory (13.75 Mbits) and 284 DSP blocks implement real-time scaling, sharpening, and overlay composition. The transceiver channels support 12G-SDI and DisplayPort 1.2 at full rate without external reclockers. Designers pair the FPGA with HDMI 2.0 receivers and SDI adaptive cable equalizers. Compared to ASIC solutions, the Cyclone 10 GX enables protocol upgrades via bitstream reload.
Recommended
Factory Automation and Motor Control
The 10CX220YF780I5G drives multi-axis motor control and real-time industrial Ethernet in factory automation. The 220K logic elements implement field-oriented control (FOC), SVPWM, and EtherCAT/CANopen/EtherNet/IP protocol stacks in soft logic. The 284 user I/O pins connect to multiple encoder inputs, gate drivers, and current/voltage sensors without external muxing. The industrial temperature grade (-40C to +100C) ensures operation in unconditioned cabinets. Transceivers enable PROFINET IRT and SERCOS III at 100 Mbps. Compared to microcontrollers, the FPGA delivers deterministic sub-microsecond control loop timing critical for high-speed servo control.
Recommended
Software Defined Radio (SDR) Platform
Software defined radio designs use the 10CX220YF780I5G for wideband ADC/DAC interfacing, digital up/down-conversion (DUC/DDC), and channelization. The 12 transceiver channels operating up to 12.5 Gbps accept JESD204B/C data from RF ADCs like the AD9234 or AD9680 at full sample rate. The 284 DSP blocks implement polyphase filterbanks, FFTs, and digital pre-distortion (DPD) for transmit chains. Hard memory controllers feed external DDR3/DDR4 for capture buffers. Compared to GPU-based SDR, the Cyclone 10 GX delivers deterministic low-latency processing with lower power. The industrial temperature grade supports outdoor tactical and aerospace adjacent deployments.
Recommended
PCIe Accelerator Cards for Edge Computing
Edge computing accelerator cards use the 10CX220YF780I5G as a low-cost FPGA host for inference and signal preprocessing. The hard PCIe Gen2 x4 IP block in endpoint mode delivers up to 20 Gbps host interconnect for low-latency data transfer. The 220K logic elements implement quantized CNN inference engines, FFT pipelines, or protocol offload. The 780-FCBGA package provides ample I/O for QSFP28 network interfaces and DDR4 SODIMM memory expansion. Compared to high-end Stratix 10 devices, the Cyclone 10 GX offers lower static power (~3 W typical) for thermally constrained edge enclosures. The 'I5G' speed/temperature grade supports industrial edge servers.
Recommended
Medical Imaging and Diagnostics
The 10CX220YF780I5G serves medical imaging systems including ultrasound, endoscopy, and digital X-ray detector readout. The 284 DSP blocks deliver real-time beamforming for 64-channel ultrasound with sub-degree phase resolution. The 13.75 Mbit embedded memory and external DDR3 interface store raw RF frame buffers before compression. Transceivers accept LVDS data from TFT detector panels at multi-Gbps rates. The industrial temperature grade supports operating-room and field-deployment environments. Compared to DSP-only solutions, the FPGA enables field upgrades for new imaging modes without hardware redesign. Compliance with IEC 60601-1 is the integrator's responsibility.
Recommended
Aerospace Avionics and UAV Payloads
Unmanned aerial vehicle (UAV) and avionics payloads use the 10CX220YF780I5G for sensor fusion, video encoding, and low-latency communication links. The transceiver channels support SDR datalinks, MIL-STD-1553B bridges, and ARINC 429 interfaces via soft IP. The 220K logic elements implement H.264/H.265 encoding for full-HD video downlink. The industrial temperature grade (-40C to +100C) handles avionics bay and high-altitude conditions. The 780-FCBGA package offers mechanical robustness for vibration profiles per DO-160. Compared to ASIC-based solutions, the FPGA enables post-deployment algorithm updates via partial reconfiguration.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YF780I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YF780I6G | 10CX220YF780E5G | 10CX220YF780E6G | 10CX220YF672I5G | 10CX220YF672I6G |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 672-BBGA, FCBGA (F672) - different | 672-BBGA, FCBGA (F672) - different |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 |
| Speed Grade | 5 | 6 (faster) | 5 | 6 (faster) | 5 | 6 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +85C) | Extended (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 |
| DSP Blocks | 284 | 284 | 284 | 284 | 284 | 284 |
| Max Transceiver Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Pin-to-Pin Drop-In Compatible | Reference | Yes - identical ball map, only speed grade differs | Yes - identical ball map, only temp grade differs | Yes - identical ball map, temp and speed differ | No - 672-BBGA vs 780-BBGA, requires PCB redesign | No - 672-BBGA vs 780-BBGA, requires PCB redesign |
Key Differentiators
- 12.5 Gbps transceiver bandwidth at lowest power in its class (vs 10CL120YF780I7G (Cyclone V))
- Hard PCIe Gen2 IP block eliminates soft-logic overhead (vs 10CX150YF780I5G (lower-density sibling))
- 780-FCBGA package offers maximum I/O density in Cyclone 10 GX family (vs 10CX220YF672I5G (F672 package))
Design Notes
Estimated: Cyclone 10 GX 10CX220 at full resource utilization (~85% LE, all transceivers active) dissipates approximately 5-8 W typical and up to 12 W peak. The 780-FCBGA package thermal resistance theta_JB is approximately 2.1 C/W (junction-to-board). For typical 8 W dissipation at 100C ambient, junction-to-board temperature rise is ~17C, leaving ~63C headroom for board-level thermal design. Recommended: use a 6-layer PCB with a dedicated inner ground plane stitched with thermal vias (0.3 mm pitch, 0.2 mm drill) under the BGA for heat spreading. Above 10 W dissipation, attach a small heatsink via thermal interface material.
The 780-FBGA package uses a 1.0 mm ball pitch. PCB design requires microvia (laser-drilled, 0.1 mm) stack-up to break out the inner rows. Use a 1-2-1 or 1-2-2-1 HDI stack-up with 0.4 mm core. Maintain 50 ohm single-ended and 100 ohm differential controlled impedance for high-speed transceiver channels. Length-match + and - pairs within 150 microns for 12.5 Gbps signals. Keep AC-coupling capacitors within 4 mm of the FPGA receiver balls. Reference Cyclone 10 GX device family pin connection guidelines for unused-pin handling.
Common pitfall: leaving JTAG TCK floating causes spurious configuration attempts. Always tie TCK to GND via 1-10 kohm pulldown if unused. Pitfall: failing to provide a clean core voltage ramp (VCCINT 0.95V) within 100 ms risks CMOS latch-up; use a soft-start controller like the LTC3026 or Intel's recommended power sequencer. Pitfall: for production boards, do not rely on Active Serial (AS) configuration without external watchdog - add a configuration reset supervisor to recover from brownouts. Always validate bitstream with Quartus Prime 18.1 or later for Cyclone 10 GX support.
The 10CX220 requires multiple supply rails: VCCINT (0.95V core), VCCD_PLL (1.0V for PLLs), VCCPT (1.0V for transceiver digital), VCCA_PLL, VCC_HSSI (1.0-1.2V for transceivers), VCCIO (1.2V-3.3V depending on I/O bank standard). Recommended power solution: Intel's Cyclone 10 GX power management reference uses the LTC3026 (core), ISL80015 (transceiver), and a DDR termination regulator. Use a 4-6 phase controller if paralleling regulators for high-transceiver designs. Estimated typical total power budget at 8 W: 5.5 A on VCCINT, 1.2 A on VCC_HSSI.
Compliance Information
RoHS compliant per Altera/Intel product page ('G' suffix = lead-free). AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. Refer to Intel automotive product lines for AEC-Q100 equivalents.
