5M2210ZF256C5N - MAX V CPLD 1700MC 201MHz 256-FBGA | Intel
N.º de pieza: 5M2210ZF256C5N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $20.25 | $20,25 |
| 10 | $18.2 | $182,00 |
| 100 | $15.75 | $1.575,00 |
| 500 | $13.5 | $6.750,00 |
| 1.000 | $11.95 | $11.950,00 |
5M2210ZF256C5N Descripción general
A CPLD, or Complex Programmable Logic Device, is a non-volatile programmable logic component that sits between discrete glue logic and larger FPGAs in the programmable logic hierarchy. CPLDs provide instant-on operation, dense I/O, low static power, and secure flash-based configuration, making them ideal for bus interfacing, address decoding, control state machines, and power-up logic. The MAX V family is Intel/Altera's mainstream low-power CPLD line, fabricated on a 0.30 um flash process and positioned beneath the Cyclone FPGA family in the company's programmable logic portfolio.
Key features of the 5M2210ZF256C5N include 1.8V core supply, 203 user I/O pins across 8 I/O banks, 1,700 macrocells distributed across 4 logic array blocks, and flash-based in-system programmability via JTAG (IEEE 1149.1). The device integrates 8 Kbits of user flash memory and supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards. The N suffix denotes lead-free finish and RoHS-compliant assembly suitable for high-volume manufacturing, while the C5 suffix indicates commercial temperature range and speed grade 5 (the fastest commercial speed grade in MAX V).
Architecturally, the MAX V family combines a logic array of product-term macrocells with a non-volatile flash configuration memory, eliminating the need for an external boot PROM. The 256-ball FBGA package offers high pin density and an exposed die paddle for thermal dissipation, with a typical theta_JA of approximately 18 C/W when properly soldered to a 4-layer PCB with thermal vias.
Typical applications for the 5M2210ZF256C5N include industrial control and automation boards, communication infrastructure glue logic, automotive body and infotainment electronics, display interface bridging, sensor aggregation hubs, and general-purpose I/O expansion in FPGA-based systems. Its high I/O count and 7 ns propagation delay enable it to bridge multiple asynchronous logic domains while preserving deterministic timing.
When designing with this device, provide separate VCCINT (1.8V core) and VCCIO (1.2V-3.3V I/O) rails with at least 0.1 uF ceramic decoupling on every supply pin. Reserve a 4-wire JTAG header for in-system programming and board bring-up. The 1.0 mm pitch FBGA-256 requires PCB microvia technology (or 0.8 mm pitch design rules) and a minimum 4-layer stack-up for reliable assembly.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling engineers to evaluate the 5M2210ZF256C5N without visiting multiple sources.
Alternativas directas para 5M2210ZF256C5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 5M2210ZF256C5N (mismo factor de forma y huella) — difiere en Programming Interface, Package, User Flash Memory, Operating Temperature Range, Configuration Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
5M2210ZF256I5N
✅ Sustitución directa✓ En stock
$17.5 / unidad
Ver hoja de datos →5M2210ZF256C8N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
5M2210ZF256C4N
✅ Sustitución directa✓ En stock
$7.29 / unidad
Ver hoja de datos →5M570ZF256C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$13.2 / unidad
Ver hoja de datos →5M240ZF256C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
5M160ZE64C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.95 / unidad
Ver hoja de datos →5M2210ZF256C5N Valores máximos y características eléctricas
| Family | MAX V |
| Device Logic Elements | 2,210 |
| Macrocells | 1,700 |
| User I/Os | 203 |
| Maximum Internal Frequency | 201.1 MHz |
| Typical Propagation Delay (tPD) | 7 ns |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Supply Voltage VCCIO | 1.2 V to 3.3 V |
| User Flash Memory | 8 Kbits |
| Logic Array Blocks | 4 |
| Configuration Memory | Non-volatile flash |
| Programming Interface | JTAG (IEEE 1149.1) - in-system |
| Encapsulado | 256-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Temperatura de funcionamiento | 0 C to +85 C (commercial grade) |
| Speed Grade | 5 (fastest commercial) |
| Lead Finish | Lead-free (N suffix) |
| Estado RoHS | Compliant |
Configuración de pines de 5M2210ZF256C5N
| Pin A1 | I/O — User I/O (bank 1) |
| Pin A2 | I/O — User I/O (bank 1) |
| Pin A3 | I/O — User I/O (bank 1) |
| Pin A4 | I/O — User I/O (bank 1) |
| Pin A5 | GND — Ground |
| Pin A6 | I/O — User I/O (bank 2) |
| Pin A7 | I/O — User I/O (bank 2) |
| Pin A8 | I/O — User I/O (bank 2) |
| Pin A9 | I/O — User I/O (bank 2) |
| Pin A10 | GND — Ground |
| Pin A11 | I/O — User I/O (bank 3) |
| Pin A12 | I/O — User I/O (bank 3) |
| Pin A13 | I/O — User I/O (bank 3) |
| Pin A14 | I/O — User I/O (bank 3) |
| Pin A15 | GND — Ground |
| Pin A16 | I/O — User I/O (bank 4) |
| Pin A17 | I/O — User I/O (bank 4) |
| Pin B1 | I/O — User I/O (bank 1) |
| Pin B2 | I/O — User I/O (bank 1) |
| Pin B3 | VCCIO1 — I/O bank 1 supply voltage |
| Pin B4 | I/O — User I/O (bank 1) |
| Pin B5 | I/O — User I/O (bank 1) |
| Pin B6 | GND — Ground |
| Pin B7 | I/O — User I/O (bank 2) |
| Pin B8 | VCCIO2 — I/O bank 2 supply voltage |
| Pin B9 | I/O — User I/O (bank 2) |
| Pin B10 | I/O — User I/O (bank 2) |
| Pin B11 | GND — Ground |
| Pin B12 | I/O — User I/O (bank 3) |
| Pin B13 | VCCIO3 — I/O bank 3 supply voltage |
| Pin B14 | I/O — User I/O (bank 3) |
| Pin B15 | I/O — User I/O (bank 3) |
| Pin B16 | GND — Ground |
| Pin B17 | I/O — User I/O (bank 4) |
Aplicaciones típicas
5M2210ZF256C5N es adecuado para 6 aplicacións: Industrial Control & Automation Glue Logic, Communication Infrastructure Board Bridging, Automotive Body & Infotainment Electronics, Display Interface Bridging, Sensor Aggregation Hub, I/O Expansion for FPGA-Based Systems.
Industrial Control & Automation Glue Logic
The 5M2210ZF256C5N is well-suited for industrial control boards where it bridges between a host FPGA/MCU and field-side peripherals such as motor drivers, encoders, and isolated sensor front-ends. Its 1,700 macrocells and 203 user I/Os enable simultaneous address decoding for multiple parallel buses (e.g., 16-bit address/data multiplexed bus + SPI/UART glue), while the 7 ns typical propagation delay ensures deterministic response in real-time control loops. The on-chip flash configuration eliminates external boot PROM complexity, reducing BOM cost in PLC and DCS designs. Eight independent VCCIO banks allow direct interfacing with 1.8 V FPGAs, 3.3 V peripherals, and 5 V-tolerant logic without level shifters, and the commercial 0-85 C operating range covers most factory-floor enclosures.
Recomendado
Communication Infrastructure Board Bridging
In communication infrastructure boards (routers, switches, base station fronthaul), the 5M2210ZF256C5N provides deterministic glue logic between ASICs, PHYs, and backplane transceivers. Its 201.1 MHz internal frequency and 7 ns tPD comfortably handle GMII / RGMII / SGMII-side status and clock-crossing logic, MDIO bus decoding, and reset sequencing across multiple subsystems. With 203 I/Os in a 256-ball FBGA, the device can replace several discrete 74-series logic packages, saving PCB area and reducing power consumption. The integrated 8 Kbits of user flash also stores board-level configuration constants (serial numbers, calibration, PHY addresses) without an external EEPROM, while JTAG in-system programming enables field firmware updates without board removal.
Recomendado
Automotive Body & Infotainment Electronics
The 5M2210ZF256C5N serves in automotive body control modules and infotainment head units as a deterministic interface between microcontrollers, display controllers, and sensor clusters. Its 1,700 macrocells handle CAN/LIN bus gating, RGB-to-LVDS bridging glue, and backlight control state machines, while the 1.8 V core and 8 VCCIO banks mix cleanly with 3.3 V displays, 1.8 V application processors, and 5 V-tolerant legacy bus signals. Flash-based configuration supports instant-on behavior critical for body controllers that must be ready within milliseconds of battery connection. For under-hood designs operating above 85 C, the industrial-grade variant 5M2210ZF256I5N (-40 C to +100 C) is pin-compatible.
Recomendado
Display Interface Bridging
The 5M2210ZF256C5N excels at display interface bridging between graphics SoCs and panel drivers, where it implements timing controllers, LVDS/LCD data reordering, and backlight PWM channels. Its 7 ns propagation delay is sufficient for pixel clock reconstruction up to approximately 100 MHz, and 203 user I/Os accommodate wide parallel RGB or split LVDS buses (e.g., 24-bit color at SXGA resolution). Eight VCCIO banks let the device sit between a 1.8 V GPU and 3.3 V panel driver directly. The integrated 8 Kbits user flash stores EDID-like panel calibration tables, removing the need for external EEPROMs on every display variant.
Recomendado
Sensor Aggregation Hub
In multi-sensor IoT edge nodes and industrial sensor hubs, the 5M2210ZF256C5N aggregates data from multiple SPI, I2C, and GPIO sensors before forwarding to a host MCU. Its 203 user I/Os accommodate up to 8 SPI slaves or 12+ I2C sensors with interrupt lines, and its deterministic 7 ns timing simplifies sensor-fusion timestamping. The non-volatile flash configuration means the sensor hub boots deterministically without waiting for an external PROM - critical for time-sensitive sensor arrays. JTAG in-system programming enables firmware updates and recalibration in deployed field units without hardware rework.
Recomendado
I/O Expansion for FPGA-Based Systems
The 5M2210ZF256C5N is frequently paired with mid-range FPGAs as a high-I/O expansion device, taking over bus decoding, legacy protocol bridging, and reset distribution that would otherwise consume valuable FPGA logic and pin resources. Its low static power (~25 mA typical quiescent) and instant-on behavior complement FPGA configuration latency, and 8 independent VCCIO banks let it interface with peripherals at voltages the FPGA does not natively support. For example, in a Cyclone III design, the 5M2210ZF256C5N handles 3.3 V legacy peripherals while the FPGA runs its core at 1.2 V, simplifying PCB routing.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5M2210ZF256C5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5M2210ZF256I5N | 5M2210ZF256C8N | 5M2210ZF256C4N | 5M570ZF256C5N | 5M240ZF256C5N |
|---|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 440 | 192 |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 570 | 240 |
| User I/Os | 203 | 203 | 203 | 203 | 212 | 178 |
| Max Frequency | 201.1 MHz | 201.1 MHz | 152 MHz | 182 MHz | 201.1 MHz | 201.1 MHz |
| Typical tPD | 7 ns | 7 ns | 10 ns | 8.5 ns | 7 ns | 7 ns |
| Speed Grade | 5 (fastest commercial) | 5 | 8 | 4 | 5 | 5 |
| Operating Temperature | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
Diferenciadores clave
- Highest I/O count in MAX V family at 256-ball FBGA (frente a 5M570ZF256C5N (MAX V, 570 LE))
- Speed grade 5 - fastest commercial MAX V variant (frente a 5M2210ZF256C8N (speed grade 8))
- On-chip non-volatile flash - no external boot PROM (frente a Discrete 74-series glue logic equivalent)
Notas de diseño
Provide separate VCCINT (1.71-1.89 V, 1.8 V nominal) and VCCIO (1.2 V to 3.3 V) supplies. Place 0.1 uF ceramic decoupling capacitors within 5 mm of every VCCINT and VCCIO ball. Add a 10 uF bulk tantalum or ceramic capacitor at the supply entry to the CPLD. The MAX V device handbook recommends a 4-layer PCB with a dedicated ground plane; on 2-layer boards, use a star-ground topology and keep digital return currents away from analog sections. Core current consumption scales with fMAX and toggle rate - estimated: at 100 MHz with 50% toggle, expect approximately 35 mA VCCINT plus per-bank VCCIO leakage.
The 1.0 mm pitch FBGA-256 package requires PCB microvia technology (laser-drilled stacked vias or via-in-pad). Use ENIG or immersion-silver surface finish to ensure reliable BGA soldering. Route signals on inner layers to escape the BGA grid, and place the BGA on the top side with all decoupling on the bottom side directly under the supply balls. Maintain a minimum 4-layer stack-up (top signal / GND plane / PWR plane / bottom signal) for controlled impedance. Thermal vias under the center die-attached paddle reduce theta_JA from approximately 35 C/W (no vias) to about 18 C/W (16 thermal vias).
Reserve a 4-wire JTAG header (TCK, TDI, TDO, TMS, plus GND and optional VCCIO reference) on every board using the 5M2210ZF256C5N. Use the Altera/Intel USB-Blaster or Byte-Blaster II for programming. Connect JTAG TCK to a clean clock source with series termination near the CPLD. For multi-device JTAG chains, daisy-chain TDI to TDO with appropriate buffer isolation if chain length exceeds 4 devices. Provide a pull-up on TMS and TDI per IEEE 1149.1 to ensure a known state at power-up.
Do not exceed VCCIO of 3.3 V on any bank - higher voltages can damage the I/O cells. When mixing 1.8 V and 3.3 V logic on the same bank, configure all I/Os to the lower voltage to avoid contention. Avoid leaving unused I/O pins floating - configure them as outputs driving low in the Quartus Prime pin assignments to prevent stray toggling. Do not connect pull-ups stronger than 50 kohm to JTAG signals, as this can interfere with the boundary-scan driver. Finally, ensure the JTAG chain respects the maximum TCK frequency (typically 33 MHz for MAX V) to avoid programming failures.
Información de cumplimiento
RoHS compliant per Alldatasheet product listing. Lead-free finish indicated by N suffix. Not AEC-Q100 qualified - this is commercial grade (C5 suffix). For automotive applications, contact Intel for AEC-Q100 variants. REACH and conflict minerals status per manufacturer declarations.
