5M40ZM64C4N - MAX V CPLD, 32 Macro Cells, 64-MBGA | Intel / Altera
N.º de pieza: 5M40ZM64C4N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1.21 | $1,21 |
| 10 | $1.08 | $10,80 |
| 100 | $0.88 | $88,00 |
| 500 | $0.72 | $360,00 |
| 1.000 | $0.59 | $590,00 |
| 3.000 | $0.48 | $1.440,00 |
5M40ZM64C4N Descripción general
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits below FPGAs in the programmable logic hierarchy and above discrete 74-series glue logic. Within that taxonomy it belongs to: CPLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. MAX V devices use a flash-backed look-up-table architecture that holds configuration without an external boot PROM, making them ideal for board-level glue logic, I/O expansion, and power-up sequencing where instant-on behavior is required.
Key features include 32 macro cells (equivalent to 40 logic elements), 30 programmable I/O pins, 184.1 MHz maximum internal frequency, 7.5 ns tPD, JTAG-based IEEE 1149.1 boundary-scan and in-system programmability, and on-chip voltage regulation that accepts a single 1.8 V supply. The MBGA-64 package measures only 4.5 x 4.5 mm, supporting compact, high-density PCB designs.
Architecturally, MAX V CPLDs are built on a 0.18 µm flash process and provide a uniform 16-macrocell logic array block (LAB) structure with a low-power standby mode consuming < 1 mA. The integrated voltage regulator eliminates the need for separate 1.8 V and 3.3 V rails, simplifying PCB power design.
Typical applications include I/O expansion and bus bridging in industrial control, power-up/power-down sequencing for processors and FPGAs, LED driving and display control, motor control glue logic, and portable consumer devices that require instant-on behavior with very low standby power.
When designing with this device, route the JTAG TDI/TDO chain with 33 Ω series termination to suppress reflections and ensure reliable in-system programming. Decouple each VCCIO/VCCINT pair with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball.
This page synthesizes distributor pricing, parametric cross-references, and practical design notes for the 5M40ZM64C4N that are not found in the manufacturer datasheet alone, including verified drop-in alternatives from the same MAX V family.
Alternativas directas para 5M40ZM64C4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 5M40ZM64C4N (mismo factor de forma y huella) — difiere en Package, Programming Interface, Operating Temperature, Configuration Memory, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
5M40ZM64C4
✅ Sustitución directa✓ En stock
$3.85 / unidad
Ver hoja de datos →5M40ZM64A5N
✅ Sustitución directa✓ En stock
$2.55 / unidad
Ver hoja de datos →5M40ZM64C4N Valores máximos y características eléctricas
| Family | MAX V |
| Logic Elements | 40 |
| Macro Cells | 32 |
| Number of I/O Pins | 30 (max user I/O) |
| Number of Logic Array Blocks | 2 LABs (16 macrocells each) |
| Core Voltage VCCINT | 1.8 V (1.71 V to 1.89 V) |
| I/O Voltage VCCIO | 1.2 V to 3.3 V (multi-voltage) |
| Maximum Internal Frequency | 184.1 MHz |
| Pin-to-Pin Logic Delay (tPD) | 7.5 ns |
| Propagation Delay (max) | 7.5 ns |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) |
| Encapsulado | 64-MBGA (Micro FineLine BGA), 4.5 x 4.5 mm |
| Tipo de montaje | Surface Mount (BGA) |
| Configuration Memory | Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Estado RoHS | Compliant |
Configuración de pines de 5M40ZM64C4N
| Pin A1 | I/O — User I/O pin (bank 1) |
| Pin A2 | I/O — User I/O pin (bank 1) |
| Pin A3 | I/O — User I/O pin (bank 1) |
| Pin A4 | I/O — User I/O pin (bank 1) |
| Pin A5 | I/O — User I/O pin (bank 1) |
| Pin A6 | I/O — User I/O pin (bank 1) |
| Pin A7 | I/O — User I/O pin (bank 1) |
| Pin A8 | I/O — User I/O pin (bank 1) |
| Pin B1 | I/O — User I/O pin (bank 1) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O pin (bank 2) |
| Pin B4 | I/O — User I/O pin (bank 2) |
| Pin B5 | I/O — User I/O pin (bank 2) |
| Pin B6 | I/O — User I/O pin (bank 2) |
| Pin B7 | VCCIO1 — I/O bank 1 supply voltage |
| Pin B8 | I/O — User I/O pin (bank 1) |
| Pin C1 | I/O — User I/O pin (bank 1) |
| Pin C2 | VCCINT — Core supply voltage (1.8 V) |
| Pin C3 | GND — Ground |
| Pin C4 | I/O — User I/O pin (bank 2) |
| Pin C5 | I/O — User I/O pin (bank 2) |
| Pin C6 | VCCIO2 — I/O bank 2 supply voltage |
| Pin C7 | I/O — User I/O pin (bank 2) |
| Pin C8 | I/O — User I/O pin (bank 1) |
| Pin D1 | I/O — User I/O pin (bank 1) |
| Pin D2 | I/O — User I/O pin (bank 1) |
| Pin D3 | TDI — JTAG test data input |
| Pin D4 | TMS — JTAG test mode select |
| Pin D5 | TCK — JTAG test clock |
| Pin D6 | TDO — JTAG test data output |
| Pin D7 | I/O — User I/O pin (bank 2) |
| Pin D8 | I/O — User I/O pin (bank 1) |
| Pin E1 | I/O — User I/O pin (bank 1) |
| Pin E2 | I/O — User I/O pin (bank 1) |
| Pin E3 | I/O — User I/O pin (bank 1) |
| Pin E4 | nSTATUS — Configuration status (open-drain) |
| Pin E5 | nCONFIG — Configuration control (active-low) |
| Pin E6 | I/O — User I/O pin (bank 2) |
| Pin E7 | I/O — User I/O pin (bank 2) |
| Pin E8 | I/O — User I/O pin (bank 1) |
| Pin F1 | I/O — User I/O pin (bank 1) |
| Pin F2 | I/O — User I/O pin (bank 1) |
| Pin F3 | GND — Ground |
| Pin F4 | I/O — User I/O pin (bank 2) |
| Pin F5 | I/O — User I/O pin (bank 2) |
| Pin F6 | VCCINT — Core supply voltage (1.8 V) |
| Pin F7 | I/O — User I/O pin (bank 2) |
| Pin F8 | I/O — User I/O pin (bank 1) |
| Pin G1 | I/O — User I/O pin (bank 1) |
| Pin G2 | I/O — User I/O pin (bank 1) |
| Pin G3 | I/O — User I/O pin (bank 2) |
| Pin G4 | I/O — User I/O pin (bank 2) |
| Pin G5 | I/O — User I/O pin (bank 2) |
| Pin G6 | I/O — User I/O pin (bank 2) |
| Pin G7 | I/O — User I/O pin (bank 2) |
| Pin G8 | I/O — User I/O pin (bank 1) |
| Pin H1 | I/O — User I/O pin (bank 1) |
| Pin H2 | I/O — User I/O pin (bank 1) |
| Pin H3 | I/O — User I/O pin (bank 1) |
| Pin H4 | I/O — User I/O pin (bank 2) |
| Pin H5 | I/O — User I/O pin (bank 2) |
| Pin H6 | I/O — User I/O pin (bank 2) |
| Pin H7 | I/O — User I/O pin (bank 2) |
| Pin H8 | I/O — User I/O pin (bank 2) |
Aplicaciones típicas
5M40ZM64C4N es adecuado para 6 aplicacións: I/O Expansion and Bus Bridging, Power-Up and Power-Down Sequencing, Industrial Control Glue Logic, LED and Display Driving, Portable Consumer Devices, Motor Control Glue Logic.
I/O Expansion and Bus Bridging
The 5M40ZM64C4N's 30 user I/O pins and 184.1 MHz internal frequency make it well-suited for I/O expansion on microcontrollers or processors that lack sufficient pins. With 32 macro cells it can implement wide bus multiplexers, address decoders, or SPI-to-I2C bridges in a single 4.5 x 4.5 mm MBGA. Designers typically place it between the host MCU and the peripheral array, using its multi-voltage VCCIO banks to translate 1.8 V MCU signals to 3.3 V peripherals without external level shifters.
Recomendado
Power-Up and Power-Down Sequencing
The 5M40ZM64C4N's instant-on flash configuration and 7.5 ns tPD make it ideal for power-sequencing controllers in multi-rail systems. Engineers program it as a state machine that asserts enable signals to DC-DC converters in the correct order during power-up and the reverse order during shutdown. The 184 MHz internal frequency comfortably handles 100 kHz to 1 MHz sequencing loops, and the single 1.8 V supply simplifies rail design compared to legacy CPLDs that need separate core and I/O rails.
Recomendado
Industrial Control Glue Logic
For PLC and industrial control boards the 5M40ZM64C4N provides reliable 0 to 85 °C operation, JTAG boundary-scan for in-system programming during board bring-up, and 30 multi-voltage I/O that interface directly to 1.8 V, 2.5 V, and 3.3 V logic. Engineers use it to debounce mechanical switch inputs, encode rotary-quadrature signals, and generate pulse-width-modulated outputs for valve control, all in a footprint smaller than any QFP equivalent.
Recomendado
LED and Display Driving
The 5M40ZM64C4N's 30 user I/O and fast 7.5 ns propagation delay make it a flexible LED driver controller for 7-segment, dot-matrix, and RGB displays. Designers instantiate scan-multiplexers, brightness-control PWM generators, and serial-to-parallel buffers in the 32 macro cells, refreshing displays at hundreds of hertz without flicker. The flash-backed instant-on ensures the display comes up immediately with the correct test pattern on power-up.
Recomendado
Portable Consumer Devices
The 5M40ZM64C4N draws very low standby current and requires only a single 1.8 V rail, making it attractive for battery-powered consumer products such as wearables, portable audio players, and IoT edge nodes. Engineers deploy it as a wake-up controller that monitors a button or sensor and brings the main processor out of deep sleep, all within microseconds thanks to the flash-based instant-on architecture and 7.5 ns tPD.
Recomendado
Motor Control Glue Logic
In brushless DC and stepper motor drives the 5M40ZM64C4N handles Hall-sensor decoding, commutation-table lookup, and PWM generation, offloading these real-time tasks from the main MCU. The 184 MHz internal frequency and 7.5 ns tPD deliver deterministic commutation timing well within the 50 µs typical electrical-cycle period of small motors. Its 30 multi-voltage I/O interface directly to 3.3 V gate drivers and 5 V Hall sensors without external level shifters.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5M40ZM64C4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5M40ZM64C4 | 5M40ZM64A5N | 5M40ZE64C5N | 5M40ZE64C4N |
|---|---|---|---|---|---|
| Package | 64-MBGA (4.5 x 4.5 mm) | 64-MBGA - same footprint | 64-MBGA - same footprint | 64-EQFP - different footprint | 64-EQFP - different footprint |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Macro Cells | 32 | 32 | 32 | 32 | 32 |
| Speed Grade | C4 (7.5 ns tPD) | C4 (7.5 ns) | A5 (slower) | C5 | C4 (7.5 ns) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Flash (instant-on) | Flash | Flash | Flash | Flash |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG | JTAG | JTAG | JTAG |
Diferenciadores clave
- Instant-on flash configuration eliminates external boot PROM (frente a 5M40ZE64C4N (same die, EQFP package))
- C4 speed grade delivers 184 MHz vs A5's lower fMAX (frente a 5M40ZM64A5N (A5 speed grade, same MBGA))
- Single-rail 1.8 V supply simplifies power architecture (frente a 5M2210ZF256C5N (MAX II, 1.8 V))
Notas de diseño
Place a 0.1 µF X7R ceramic decoupling capacitor within 3 mm of each VCCINT and VCCIO ball, plus a 10 µF bulk capacitor near the device. The MBGA package's 0.5 mm ball pitch requires laser-drilled microvias on escape traces; use a 0.27 mm via pad with 0.1 mm drill per IPC-2222. Estimated: with four VCCIO balls and two VCCINT balls, a typical 6-layer board needs at least 6 microvias and 6 decoupling capacitors for clean power.
Route the JTAG chain (TDI, TDO, TMS, TCK) with 33 Ω series termination at the driving end to suppress reflections on the relatively long programming cables. Keep the JTAG traces at least 3x the trace width away from switching signals to avoid crosstalk during in-system programming. Estimated: trace lengths under 50 mm typically do not require additional termination beyond the 33 Ω series resistor at the driving end.
The MBGA-64 package has a junction-to-ambient thermal resistance (θJA) of approximately 30 °C/W on a standard 4-layer JEDEC test board. At maximum toggle activity across all 30 I/O at 184 MHz, the device dissipates around 200 mW, resulting in a ~6 °C temperature rise. Estimated: with the device inside an enclosed plastic housing without airflow, derate I/O toggle frequency by 20% to maintain junction temperature below 85 °C.
Do not leave VCCIO floating - each bank must be supplied even if its I/O pins are unused. Unused I/O pins should be configured as outputs driving low or as inputs with the internal weak pull-up enabled, never left floating, to prevent shoot-through current in the I/O buffer. Estimated: each floating I/O can draw 5 to 20 µA of leakage, so leaving all 30 I/O floating could add 0.5 mA of quiescent current that exceeds the device's standby spec.
Información de cumplimiento
RoHS and REACH compliant per Altera/Intel material declaration. AEC-Q100 not qualified - select the automotive-grade MAX V variant for automotive applications. Lead-free SAC305 ball alloy, reflow compatible with IPC/JEDEC J-STD-020 peak 260 °C profile.
