A3P600-PQG208I - ProASIC3 Flash FPGA 600K Gates | Microchip
N.º de pieza: A3P600-PQG208I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $90.77 | $90,77 |
| 10 | $86.23 | $862,30 |
| 100 | $79.48 | $7.948,00 |
| 500 | $73.51 | $36.755,00 |
| 1.000 | $68.08 | $68.080,00 |
A3P600-PQG208I Descripción general
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital logic IC -> semiconductor), flash FPGAs occupy the single-chip, instant-on niche: they power up live without a boot sequence and are inherently secure because the bitstream never leaves the device.
Key features include single-chip operation with no external configuration device, reprogrammable flash fabric built on a 130nm process, 7K-class logic elements per distributor listings, and support for soft ARM processor cores per the ProASIC3 family datasheet. The fabric uses an 8-input versatile lookup table architecture that provides high effective logic density, and embedded memory blocks support FIFOs and dual-port RAM implementations.
Architecturally, ProASIC3 combines the low static power and high logic utilization of the Actel-originated flash fabric with 1.5V core operation, advanced I/O standards including LVTTL, LVCMOS, SSTL, and differential standards such as LVDS, and hot-swap capable I/Os. Clock conditioning and PLL resources support the 231 MHz system performance figure cited in market data.
Typical applications include industrial control and automation, space-constrained secure systems, avionics glue logic consolidation, motor drive interfaces, and communications bridging, where instant-on and single-chip configuration security matter more than raw gate count.
Design consideration: verify I/O bank voltage assignment early - each bank must share a compatible VCCI standard, and the PQFP thermal pad requires standard JEDEC footprint copper for dissipation at high toggle rates.
This page synthesizes distributor pricing, drop-in same-package family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para A3P600-PQG208I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3P600-PQG208I (mismo factor de forma y huella) — difiere en Package, Configuration Memory, System Gates, Operating Temperature, Core Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3P600-1PQG208I
✅ Sustitución directa✓ En stock
$68 / unidad
Ver hoja de datos →A3P600-2PQG208I
✅ Sustitución directa✓ En stock
$71.3 / unidad
Ver hoja de datos →A3P600-2PQG208
✅ Sustitución directa✓ En stock
$55.87 / unidad
Ver hoja de datos →A3P600-1PQG208
✅ Sustitución directa✓ En stock
$49.94 / unidad
Ver hoja de datos →A3P600L-1PQG208I
✅ Sustitución directa✓ En stock
$29 / unidad
Ver hoja de datos →A3P1000-2PQG208
✅ Sustitución directa✓ En stock
$65.67 / unidad
Ver hoja de datos →A3P400-2PQG208
✅ Sustitución directa✓ En stock
$56.9 / unidad
Ver hoja de datos →A3P600-PQG208I Valores máximos y características eléctricas
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements | 7KLEs class (per distributor listing) |
| User I/O | 154 |
| Max System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | On-chip flash (single-chip, non-volatile) |
| Encapsulado | 208-BFQFP (PQFP-208) |
| Tipo de montaje | Surface Mount |
| Temperature Grade | I - Industrial |
| Temperatura de funcionamiento | -40C to +100C (ambient, industrial) |
| Terminal Form | Gull Wing |
| Soft CPU Support | Optional soft ARM support (per ProASIC3 datasheet) |
Guía de configuración de pines de A3P600-PQG208I 208-bfqfp (pqfp-208)
Configuración de pines para A3P600-PQG208I (encapsulado 208-bfqfp (pqfp-208)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3P600-PQG208I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3P600-PQG208I es adecuado para 6 aplicacións: Industrial Control and Automation, Secure and Instant-On Systems, Avionics and Aerospace Glue Logic, Communications Bridging and Line Cards, Motor Drive and Power Conversion Interface, Test and Measurement Instrumentation.
Industrial Control and Automation
The A3P600-PQG208I fits industrial control because its I-suffix industrial rating (-40C to +100C) and flash fabric deliver deterministic, live-at-power-up logic without configuration delay - critical for machines that must act within milliseconds of power valid. The 600K gates and 154 user I/Os consolidate PLC I/O conditioning, encoder interfaces, and interlock logic that would otherwise need several CPLDs and glue chips, cutting BOM count and board area. Powered from a 1.5V core with hot-swap capable I/O banks, it tolerates backplane live insertion. The trade-off versus SRAM FPGAs is lower absolute fabric speed (231 MHz system performance class), which is ample for industrial state machines and protocol bridging but not for high-speed DSP. Reconfiguration in the field is done via the JTAG port using Microchip Libero SoC tooling.
Recomendado
Secure and Instant-On Systems
Because the ProASIC3 fabric stores its bitstream in on-chip flash, the A3P600-PQG208I never exposes its configuration externally, providing inherent design security that SRAM FPGAs only achieve with added encryption circuitry. This makes it well suited to security cameras, access-control hardware, and licensed equipment where IP protection matters. Instant-on behavior means the device is functional within microseconds of power, enabling boot-time security arbitration or power sequencing control for companion processors such as the MSP430FR5994. The 600K-gate capacity accommodates crypto accelerators, tamper-detection state machines, and sensor fusion front ends. Designers should still review Microchip flash FPGA security application notes for anti-tamper guidance, since physical security requirements vary by threat model and deployment environment.
Recomendado
Avionics and Aerospace Glue Logic
Flash FPGAs are widely used in aerospace sub-systems because they are single-chip, live at power-up, and immune to configuration upset from radiation-induced configuration-memory flips that affect SRAM devices. The A3P600-PQG208I's 600K gates and 154 I/Os handle backplane interfaces, MIL-STD-style bus bridging, and legacy glue-logic consolidation on retrofit programs where the 208-pin PQFP footprint must be preserved. The industrial temperature grade and wide I/O standard support (LVTTL, LVCMOS, SSTL, LVDS differential) ease integration with mixed-voltage avionics rails. Designers should confirm program-specific screening and qualification beyond the standard I-grade, and Microchip radiation-tolerant variants of this family should be evaluated for orbit applications rather than this commercial-origin catalog part.
Recomendado
Communications Bridging and Line Cards
With 154 user I/Os organized in banks supporting LVTTL, LVCMOS, SSTL, and differential LVDS, the A3P600-PQG208I suits protocol bridging between legacy parallel buses and newer serial links on networking line cards. The 231 MHz system performance class supports parallel data paths at 8-bit x tens-of-MHz rates, while embedded flash memory blocks implement dual-port FIFOs for clock-domain crossing. Single-chip configuration removes the boot-time window during which SRAM FPGAs are offline - useful in redundant systems needing hitless failover. Power designers should budget for I/O bank currents at high toggle rates and follow Microchip's bank voltage rules. For designs migrating upward, the same-footprint A3P1000-2PQG208 doubles capacity without PCB respin, protecting the layout investment.
Recomendado
Motor Drive and Power Conversion Interface
In motor drives, the A3P600-PQG208I implements PWM distribution, dead-time insertion, gate-interface supervision, and protective interlock logic alongside a control DSP such as the TMS320F28035-class or TMS320F28335 devices. Flash-based instant-on operation means protective logic is active before software-controlled devices finish booting, a genuine safety benefit when DC bus capacitors can hold hazardous energy. The industrial temperature rating covers drive cabinet environments, and LVDS-capable I/Os support noisy-environment signaling between control and sensing boards. Designers must respect the PQFP package's power handling: compute I/O ring dissipation from toggle rates and load capacitance, and verify junction temperature against the industrial rating. The soft-logic flexibility allows rapid revision of protection profiles across drive product families sharing one PCB.
Recomendado
Test and Measurement Instrumentation
Bench and rack instrumentation benefits from the A3P600-PQG208I's combination of instant-on deterministic timing, 154 flexible I/Os, and in-field reprogrammability via JTAG. Typical roles include triggering and timing sequencers, channel multiplexing, sensor front-end aggregation, and host interface glue between ADCs and embedded processors. Flash configuration means the instrument presents consistent timing behavior from cold start - important for calibration repeatability - and no external configuration device occupies board space in dense front-end modules. The 600K-gate capacity supports per-channel DSP-lite filtering, and embedded memory blocks form capture FIFOs ahead of the host readout path. Designers should allocate I/O banks so that analog-side digital returns keep switching noise away from precision front ends, following Microchip's I/O bank and ground-return layout guidance.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3P600-PQG208I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3P600-1PQG208I | A3P600-2PQG208I | A3P600L-1PQG208I | A3P400-2PQG208 | A3P1000-2PQG208 |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP-208) | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) |
| System Gates | 600K | 600K | 600K | 600K (low power) | 400K | 1M |
| Speed Grade | Standard (base) | -1 | -2 (fastest) | -1 (low power) | -2 | -2 |
| Temperature Grade | Industrial (I) | Industrial | Industrial | Industrial | Commercial | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V (reduced static power) | 1.5 V | 1.5 V |
| Configuration | On-chip flash, single-chip | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Diferenciadores clave
- Flash configuration, single-chip instant-on (frente a SRAM FPGAs (Xilinx/Altera equivalents))
- Industrial temperature with full I/O bank flexibility (frente a A3P600-2PQG208 (commercial))
- No-footprint-respin capacity scaling (frente a A3P400-2PQG208 / A3P1000-2PQG208)
- Trade-off: lower fabric speed than modern SRAM FPGAs (frente a A3P1000-2PQG208 (or any modern FPGA))
Notas de diseño
ProASIC3 devices use a 1.5V core plus bank-dependent VCCI rails. Estimated: with 154 user I/Os, I/O ring power scales with f * C * V^2 * N - at 50 MHz average toggle, 15 pF loads, and 3.3V banks, I/O dynamic current can reach the hundreds-of-milliamps range, so size the VCCI regulators with margin and decouple each bank locally with at least 0.1 uF per few I/Os plus bulk capacitance. Verify total dissipation against the PQFP thermal resistance in the ProASIC3 family datasheet before committing the power tree.
The 208-pin PQFP has 0.5 mm pitch gull-wing leads - use the JEDEC-style footprint from the Microchip library, with drag-soldering-friendly pads and fiducials at diagonal corners for automated optical alignment. Place 0.1 uF decoupling within 3 mm of alternating VCC/GND pin pairs around the perimeter. JTAG programming header should be routed short with series termination on TCK to avoid ringing at programming clock rates.
Do not mix incompatible I/O standards within one bank - assign VCCI per bank in Libero before finalizing schematic pin assignments, or you will respin the board. Also, when substituting speed grades (e.g., A3P600-1PQG208I for this base-grade part), re-run static timing analysis in Libero SoC: a design near the standard-grade limit may fail timing at -1. Finally, confirm the exact package suffix on purchase orders - PQ208 and PQG208 differ in finish and compliance, per the Xecor comparison of A3P600-PQ208I vs A3P600-PQG208I.
For LVDS or SSTL bank usage on this PQFP part, keep trace lengths matched within the skew budget and reference a continuous ground plane; the relatively large PQFP loop inductance makes stubs and vias more impactful than on fine-pitch BGAs. Estimated: at 231 MHz-class internal performance with parallel I/O above 100 MHz toggle, add series 22-33 ohm resistors on high-drive outputs to tame overshoot into unprotected downstream devices.
Información de cumplimiento
PQG suffix indicates Microchip green/lead-free package nomenclature, but explicit RoHS/REACH certificates were not present in the verified data - confirm on the Microchip product page. Not an automotive AEC-Q100 program part.