A3P600-PQG208I - ProASIC3 Flash FPGA 600K Gates | Microchip
부품 번호: A3P600-PQG208I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $90.77 | $90.77 |
| 10 | $86.23 | $862.30 |
| 100 | $79.48 | $7,948.00 |
| 500 | $73.51 | $36,755.00 |
| 1,000 | $68.08 | $68,080.00 |
A3P600-PQG208I 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital logic IC -> semiconductor), flash FPGAs occupy the single-chip, instant-on niche: they power up live without a boot sequence and are inherently secure because the bitstream never leaves the device.
Key features include single-chip operation with no external configuration device, reprogrammable flash fabric built on a 130nm process, 7K-class logic elements per distributor listings, and support for soft ARM processor cores per the ProASIC3 family datasheet. The fabric uses an 8-input versatile lookup table architecture that provides high effective logic density, and embedded memory blocks support FIFOs and dual-port RAM implementations.
Architecturally, ProASIC3 combines the low static power and high logic utilization of the Actel-originated flash fabric with 1.5V core operation, advanced I/O standards including LVTTL, LVCMOS, SSTL, and differential standards such as LVDS, and hot-swap capable I/Os. Clock conditioning and PLL resources support the 231 MHz system performance figure cited in market data.
Typical applications include industrial control and automation, space-constrained secure systems, avionics glue logic consolidation, motor drive interfaces, and communications bridging, where instant-on and single-chip configuration security matter more than raw gate count.
Design consideration: verify I/O bank voltage assignment early - each bank must share a compatible VCCI standard, and the PQFP thermal pad requires standard JEDEC footprint copper for dissipation at high toggle rates.
This page synthesizes distributor pricing, drop-in same-package family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: A3P600-PQG208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-PQG208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, System Gates, Operating Temperature, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-1PQG208I
✅ 드롭인✓ 재고 있음
$68 / 개
데이터시트 보기 →A3P600-2PQG208I
✅ 드롭인✓ 재고 있음
$71.3 / 개
데이터시트 보기 →A3P600-2PQG208
✅ 드롭인✓ 재고 있음
$55.87 / 개
데이터시트 보기 →A3P600-1PQG208
✅ 드롭인✓ 재고 있음
$49.94 / 개
데이터시트 보기 →A3P600L-1PQG208I
✅ 드롭인✓ 재고 있음
$29 / 개
데이터시트 보기 →A3P1000-2PQG208
✅ 드롭인✓ 재고 있음
$65.67 / 개
데이터시트 보기 →A3P400-2PQG208
✅ 드롭인✓ 재고 있음
$56.9 / 개
데이터시트 보기 →A3P600-PQG208I 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements | 7KLEs class (per distributor listing) |
| User I/O | 154 |
| Max System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | On-chip flash (single-chip, non-volatile) |
| 패키지 | 208-BFQFP (PQFP-208) |
| 실장 유형 | Surface Mount |
| Temperature Grade | I - Industrial |
| 동작 온도 | -40C to +100C (ambient, industrial) |
| Terminal Form | Gull Wing |
| Soft CPU Support | Optional soft ARM support (per ProASIC3 datasheet) |
A3P600-PQG208I 208-bfqfp (pqfp-208) 핀 구성 가이드
A3P600-PQG208I(208-bfqfp (pqfp-208) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-PQG208I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-PQG208I 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Secure and Instant-On Systems, Avionics and Aerospace Glue Logic, Communications Bridging and Line Cards, Motor Drive and Power Conversion Interface, Test and Measurement Instrumentation.
Industrial Control and Automation
The A3P600-PQG208I fits industrial control because its I-suffix industrial rating (-40C to +100C) and flash fabric deliver deterministic, live-at-power-up logic without configuration delay - critical for machines that must act within milliseconds of power valid. The 600K gates and 154 user I/Os consolidate PLC I/O conditioning, encoder interfaces, and interlock logic that would otherwise need several CPLDs and glue chips, cutting BOM count and board area. Powered from a 1.5V core with hot-swap capable I/O banks, it tolerates backplane live insertion. The trade-off versus SRAM FPGAs is lower absolute fabric speed (231 MHz system performance class), which is ample for industrial state machines and protocol bridging but not for high-speed DSP. Reconfiguration in the field is done via the JTAG port using Microchip Libero SoC tooling.
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Secure and Instant-On Systems
Because the ProASIC3 fabric stores its bitstream in on-chip flash, the A3P600-PQG208I never exposes its configuration externally, providing inherent design security that SRAM FPGAs only achieve with added encryption circuitry. This makes it well suited to security cameras, access-control hardware, and licensed equipment where IP protection matters. Instant-on behavior means the device is functional within microseconds of power, enabling boot-time security arbitration or power sequencing control for companion processors such as the MSP430FR5994. The 600K-gate capacity accommodates crypto accelerators, tamper-detection state machines, and sensor fusion front ends. Designers should still review Microchip flash FPGA security application notes for anti-tamper guidance, since physical security requirements vary by threat model and deployment environment.
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Avionics and Aerospace Glue Logic
Flash FPGAs are widely used in aerospace sub-systems because they are single-chip, live at power-up, and immune to configuration upset from radiation-induced configuration-memory flips that affect SRAM devices. The A3P600-PQG208I's 600K gates and 154 I/Os handle backplane interfaces, MIL-STD-style bus bridging, and legacy glue-logic consolidation on retrofit programs where the 208-pin PQFP footprint must be preserved. The industrial temperature grade and wide I/O standard support (LVTTL, LVCMOS, SSTL, LVDS differential) ease integration with mixed-voltage avionics rails. Designers should confirm program-specific screening and qualification beyond the standard I-grade, and Microchip radiation-tolerant variants of this family should be evaluated for orbit applications rather than this commercial-origin catalog part.
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Communications Bridging and Line Cards
With 154 user I/Os organized in banks supporting LVTTL, LVCMOS, SSTL, and differential LVDS, the A3P600-PQG208I suits protocol bridging between legacy parallel buses and newer serial links on networking line cards. The 231 MHz system performance class supports parallel data paths at 8-bit x tens-of-MHz rates, while embedded flash memory blocks implement dual-port FIFOs for clock-domain crossing. Single-chip configuration removes the boot-time window during which SRAM FPGAs are offline - useful in redundant systems needing hitless failover. Power designers should budget for I/O bank currents at high toggle rates and follow Microchip's bank voltage rules. For designs migrating upward, the same-footprint A3P1000-2PQG208 doubles capacity without PCB respin, protecting the layout investment.
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Motor Drive and Power Conversion Interface
In motor drives, the A3P600-PQG208I implements PWM distribution, dead-time insertion, gate-interface supervision, and protective interlock logic alongside a control DSP such as the TMS320F28035-class or TMS320F28335 devices. Flash-based instant-on operation means protective logic is active before software-controlled devices finish booting, a genuine safety benefit when DC bus capacitors can hold hazardous energy. The industrial temperature rating covers drive cabinet environments, and LVDS-capable I/Os support noisy-environment signaling between control and sensing boards. Designers must respect the PQFP package's power handling: compute I/O ring dissipation from toggle rates and load capacitance, and verify junction temperature against the industrial rating. The soft-logic flexibility allows rapid revision of protection profiles across drive product families sharing one PCB.
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Test and Measurement Instrumentation
Bench and rack instrumentation benefits from the A3P600-PQG208I's combination of instant-on deterministic timing, 154 flexible I/Os, and in-field reprogrammability via JTAG. Typical roles include triggering and timing sequencers, channel multiplexing, sensor front-end aggregation, and host interface glue between ADCs and embedded processors. Flash configuration means the instrument presents consistent timing behavior from cold start - important for calibration repeatability - and no external configuration device occupies board space in dense front-end modules. The 600K-gate capacity supports per-channel DSP-lite filtering, and embedded memory blocks form capture FIFOs ahead of the host readout path. Designers should allocate I/O banks so that analog-side digital returns keep switching noise away from precision front ends, following Microchip's I/O bank and ground-return layout guidance.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600-PQG208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-1PQG208I | A3P600-2PQG208I | A3P600L-1PQG208I | A3P400-2PQG208 | A3P1000-2PQG208 |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP-208) | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) |
| System Gates | 600K | 600K | 600K | 600K (low power) | 400K | 1M |
| Speed Grade | Standard (base) | -1 | -2 (fastest) | -1 (low power) | -2 | -2 |
| Temperature Grade | Industrial (I) | Industrial | Industrial | Industrial | Commercial | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V (reduced static power) | 1.5 V | 1.5 V |
| Configuration | On-chip flash, single-chip | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Flash configuration, single-chip instant-on (vs SRAM FPGAs (Xilinx/Altera equivalents))
- Industrial temperature with full I/O bank flexibility (vs A3P600-2PQG208 (commercial))
- No-footprint-respin capacity scaling (vs A3P400-2PQG208 / A3P1000-2PQG208)
- Trade-off: lower fabric speed than modern SRAM FPGAs (vs A3P1000-2PQG208 (or any modern FPGA))
설계 노트
ProASIC3 devices use a 1.5V core plus bank-dependent VCCI rails. Estimated: with 154 user I/Os, I/O ring power scales with f * C * V^2 * N - at 50 MHz average toggle, 15 pF loads, and 3.3V banks, I/O dynamic current can reach the hundreds-of-milliamps range, so size the VCCI regulators with margin and decouple each bank locally with at least 0.1 uF per few I/Os plus bulk capacitance. Verify total dissipation against the PQFP thermal resistance in the ProASIC3 family datasheet before committing the power tree.
The 208-pin PQFP has 0.5 mm pitch gull-wing leads - use the JEDEC-style footprint from the Microchip library, with drag-soldering-friendly pads and fiducials at diagonal corners for automated optical alignment. Place 0.1 uF decoupling within 3 mm of alternating VCC/GND pin pairs around the perimeter. JTAG programming header should be routed short with series termination on TCK to avoid ringing at programming clock rates.
Do not mix incompatible I/O standards within one bank - assign VCCI per bank in Libero before finalizing schematic pin assignments, or you will respin the board. Also, when substituting speed grades (e.g., A3P600-1PQG208I for this base-grade part), re-run static timing analysis in Libero SoC: a design near the standard-grade limit may fail timing at -1. Finally, confirm the exact package suffix on purchase orders - PQ208 and PQG208 differ in finish and compliance, per the Xecor comparison of A3P600-PQ208I vs A3P600-PQG208I.
For LVDS or SSTL bank usage on this PQFP part, keep trace lengths matched within the skew budget and reference a continuous ground plane; the relatively large PQFP loop inductance makes stubs and vias more impactful than on fine-pitch BGAs. Estimated: at 231 MHz-class internal performance with parallel I/O above 100 MHz toggle, add series 22-33 ohm resistors on high-drive outputs to tame overshoot into unprotected downstream devices.
규정 준수 정보
PQG suffix indicates Microchip green/lead-free package nomenclature, but explicit RoHS/REACH certificates were not present in the verified data - confirm on the Microchip product page. Not an automotive AEC-Q100 program part.