A3P600L-1FG144I - ProASIC3L FPGA 600K Gates | Microchip
N.º de pieza: A3P600L-1FG144I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $39.97 | $39,97 |
| 10 | $36.5 | $365,00 |
| 100 | $34.2 | $3.420,00 |
| 500 | $33.1 | $16.550,00 |
| 1.000 | $32.16 | $32.160,00 |
A3P600L-1FG144I Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that the designer wires together after manufacturing. Within the programmable logic hierarchy, it sits above CPLDs and below high-density FPGA families, providing single-chip system integration without the NRE cost of an ASIC. The ProASIC3L variant of the ProASIC3 family adds a low-power core operating from 1.2 V to 1.5 V for reduced dynamic power consumption.
Key differentiating features include flash-based, nonvolatile configuration (no external boot PROM required, instant-on at power-up), a 1.2 V to 1.5 V core voltage for low power operation, and secure, single-chip implementation that resists configuration readback. The 130 nm flash process gives this family inherent radiation tolerance advantages over SRAM FPGAs and eliminates configuration load time.
Technically, the device integrates 600K system gates with versatile logic elements, embedded RAM blocks totaling 110592 bits for FIFOs and buffers, and 97 I/Os supporting common single-ended standards with industrial-grade drive. Microchip (formerly Actel/Microsemi) Libero SoC design software supports synthesis, place-and-route, and programming.
Typical applications include industrial control, aerospace and defense subsystems, portable and battery-powered instrumentation, communications bridging, and power-sensitive glue-logic consolidation where an SRAM FPGA would consume excessive static power.
Design consideration: the 144-FBGA package requires careful ball-mapped PCB layout; verify I/O bank voltage assignments in Libero before routing to avoid bank-conflict errors.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para A3P600L-1FG144I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3P600L-1FG144I (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Technology, Family, System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3P600L-1FGG144I
✅ Sustitución directa✓ En stock
$59.8 / unidad
Ver hoja de datos →A3P600L-1FG144
✅ Sustitución directa✓ En stock
$25.73 / unidad
Ver hoja de datos →A3P600L-FG144I
✅ Sustitución directa✓ En stock
$35.2 / unidad
Ver hoja de datos →A3P600L-FGG144I
✅ Sustitución directa✓ En stock
$33.95 / unidad
Ver hoja de datos →A3P600L-FG144
✅ Sustitución directa✓ En stock
$48.34 / unidad
Ver hoja de datos →A3P1000L-1FG144
✅ Sustitución directa✓ En stock
$119 / unidad
Ver hoja de datos →A3P600L-1FG144I Valores máximos y características eléctricas
| Family | ProASIC3L |
| System Gates | 600000 gates |
| User I/O | 97 |
| Embedded RAM | 110592 bit |
| Core Supply Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm flash-based |
| Configuration Memory | Nonvolatile flash, single-chip |
| Encapsulado | 144-LBGA (FBGA-144) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (TJ), industrial |
| Supply Voltage Range | 1.14 V to 1.575 V |
| Programmability | In-system reprogrammable |
| Estado RoHS | Compliant |
| Speed Grade | -1 |
Guía de configuración de pines de A3P600L-1FG144I 144-lbga (fbga-144)
Configuración de pines para A3P600L-1FG144I (encapsulado 144-lbga (fbga-144)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3P600L-1FG144I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3P600L-1FG144I es adecuado para 6 aplicacións: Industrial Control and Automation, Aerospace and Defense Subsystems, Battery-Powered Portable Instrumentation, Communications Bridging and Protocol Conversion, Test and Measurement Equipment, Security and Surveillance Systems.
Industrial Control and Automation
The A3P600L-1FG144I fits industrial control and factory automation systems because its 600K flash-based gates consolidate PLC glue logic, motor-control sequencing, and I/O expansion into one instant-on device, while the industrial -40C to +100C temperature rating survives harsh cabinet environments. With a 1.2 V core and nonvolatile configuration, it draws low static power and needs no configuration PROM, improving cabinet reliability. Implemented as a sequencer between a host MCU and field I/O, it provides 97 user I/Os and 110592 bits of RAM for buffering; the trade-off versus a CPLD is more routing delay but far greater logic density per footprint.
Recomendado
Aerospace and Defense Subsystems
The flash-based ProASIC3L architecture suits aerospace and defense applications where configuration readback protection and single-chip, instant-on operation are required. Unlike SRAM FPGAs that load configuration from external memory at power-up - exposing a vulnerability window - the A3P600L-1FG144I is active within microseconds of power application and stores its bitstream in on-chip flash, immune to SEU-driven configuration upset. The 144-FBGA package saves board area in payload modules, and 97 I/Os interface sensor arrays and telemetry buses. The -1 speed grade limits maximum toggle rates, so reserve this part for control-plane rather than high-throughput datapath functions.
Recomendado
Battery-Powered Portable Instrumentation
Portable and battery-powered instruments benefit from the 'L' in ProASIC3L: the 1.2 V core voltage cuts dynamic power roughly proportional to V-squared versus 1.5 V core ProASIC3 devices, extending battery life in handheld analyzers and dataloggers. Nonvolatile flash configuration means the instrument is ready the instant the power switch closes - no boot delay - which users notice directly. With 600K gates and 110592 bits of embedded RAM, the device implements acquisition sequencing, display interfacing, and communication bridges around a low-power MCU. The industrial temperature rating also covers equipment left in vehicles or field conditions well beyond office ambient ranges.
Recomendado
Communications Bridging and Protocol Conversion
The A3P600L-1FG144I implements protocol bridges between legacy serial interfaces and modern buses in networking and telecom line cards. Its 97 user I/Os span multiple banks for mixed-voltage interfaces, and the 110592-bit embedded RAM provides FIFO buffering that decouples asynchronous clock domains at the bridge boundary. Flash-based configuration is valuable in remote telecom cabinets where losing the configuration file would require a site visit - the bitstream is stored on-chip and survives power cycling indefinitely. Timing performance of the -1 speed grade comfortably covers UART, SPI, I2C, and parallel bus rates, but check static timing for anything approaching hundreds of MHz.
Recomendado
Test and Measurement Equipment
Bench and modular test instruments use the A3P600L-1FG144I for timing generation, trigger logic, and instrument backplane interfacing. The 600K gate capacity accommodates counters, pattern generators, and state machines, while the flash configuration guarantees the instrument is functional immediately at power-up - a visible advantage over SRAM FPGAs that need several hundred milliseconds to configure. Low 1.2 V core power keeps instrument internal temperature rise modest, protecting calibration stability. The 144-ball FBGA footprint fits standard instrument main boards, and Libero SoC supports design iteration during product development with full in-system reprogrammability.
Recomendado
Security and Surveillance Systems
Surveillance and access-control equipment leverages the readback-protected flash configuration of the A3P600L-1FG144I, since the configuration bitstream cannot be dumped from the device - protecting proprietary image-processing or encryption logic embedded in the fabric. The single-chip design removes the external configuration flash that an attacker could otherwise intercept or clone. With 600K gates and 97 I/Os, the device handles camera interface bridging, sensor fusion, and tamper-detection logic, while the industrial temperature range covers outdoor camera housings from -40C to +100C. Power consumption at a 1.2 V core suits PoE-powered cameras with tight power budgets.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3P600L-1FG144I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3P600L-1FGG144I | A3P600L-FG144I | A3P600L-1FG144 | A3P1000L-1FG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FG144) | 144-FBGA (FGG144) - same footprint | 144-FBGA (FG144) - same | 144-FBGA (FG144) - same | 144-FBGA (FG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 1000K |
| Speed Grade | -1 | -1 | Standard | -1 | -1 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Configuration | Nonvolatile flash, single-chip | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
Diferenciadores clave
- Low-power 1.2 V core in the L family (frente a A3P600-FG144I (standard ProASIC3))
- Industrial temperature in the -1 speed grade (frente a A3P600L-1FG144)
- Same-footprint density upgrade path (frente a A3P1000L-1FG144)
Notas de diseño
Estimated: the ProASIC3L low-power core at 1.2 V reduces dynamic power by roughly (1.2/1.5)^2 = 64% versus a 1.5 V core for the same toggle rate, so always design the core rail at 1.2 V when battery life matters; reserve 1.5 V for designs needing extra timing margin. Distributor data specifies the operating range as 1.14 V to 1.575 V, giving useful regulator tolerance, but dynamic power scales with V^2 so a 1.5 V setting on a 1.2 V design raises power nearly 56%.
The 144-FBGA requires a controlled ball-out: before routing, lock I/O bank assignments in Microchip Libero SoC so that all I/O standards in one bank share a compatible VCCI rail - mixing 3.3 V and 1.8 V standards within one bank causes bank-voltage conflicts that Libero flags at layout. Use the manufacturer's reference ball map in the family datasheet; keep a solid VCCI plane per bank and decouple each supply pin with 0.1 uF ceramic capacitors placed within 2 mm of the ball via.
Do not treat the -1 speed grade as interchangeable with the standard grade in timing-critical paths: static timing analysis in Libero must pass at the -1 corner before selecting the cheaper -1 device. Also note that FG and FGG packages share the footprint but differ in ball finish (lead-bearing vs lead-free); RoHS-mandated builds must specify the FGG suffix. Verify configuration security settings before production - flash readback protection is enabled through Libero, not by default.
Información de cumplimiento
RoHS compliance listed on distributor pages. Lead-free finish is explicitly associated with FGG suffix variants (e.g., A3P600L-FGG144I); FG suffix finish details not stated in provided data. AEC-Q100 qualification not indicated.
