A3P600L-1FG144I - ProASIC3L FPGA 600K Gates | Microchip
MPN: A3P600L-1FG144I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $39.97 | $39.97 |
| 10 | $36.5 | $365.00 |
| 100 | $34.2 | $3,420.00 |
| 500 | $33.1 | $16,550.00 |
| 1,000 | $32.16 | $32,160.00 |
Drop-in alternatives for A3P600L-1FG144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600L-1FGG144I
✅ Drop-In✓ In Stock
$59.8 / Unit
View Datasheet →A3P600L-1FG144
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$25.73 / Unit
View Datasheet →A3P600L-FG144I
✅ Drop-In✓ In Stock
$35.2 / Unit
View Datasheet →A3P600L-FGG144I
✅ Drop-In✓ In Stock
$33.95 / Unit
View Datasheet →A3P600L-FG144
✅ Drop-In✓ In Stock
$48.34 / Unit
View Datasheet →A3P1000L-1FG144
✅ Drop-In✓ In Stock
$119 / Unit
View Datasheet →A3P600L-1FG144I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| System Gates | 600000 gates |
| User I/O | 97 |
| Embedded RAM | 110592 bit |
| Core Supply Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm flash-based |
| Configuration Memory | Nonvolatile flash, single-chip |
| Package | 144-LBGA (FBGA-144) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (TJ), industrial |
| Supply Voltage Range | 1.14 V to 1.575 V |
| Programmability | In-system reprogrammable |
| RoHS Status | Compliant |
| Speed Grade | -1 |
A3P600L-1FG144I 144-lbga (fbga-144) Pin Configuration Guide
Complete pinout information for A3P600L-1FG144I (144-lbga (fbga-144) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600L-1FG144I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600L-1FG144I is suitable for 6 applications: Industrial Control and Automation, Aerospace and Defense Subsystems, Battery-Powered Portable Instrumentation, Communications Bridging and Protocol Conversion, Test and Measurement Equipment, Security and Surveillance Systems.
Industrial Control and Automation
The A3P600L-1FG144I fits industrial control and factory automation systems because its 600K flash-based gates consolidate PLC glue logic, motor-control sequencing, and I/O expansion into one instant-on device, while the industrial -40C to +100C temperature rating survives harsh cabinet environments. With a 1.2 V core and nonvolatile configuration, it draws low static power and needs no configuration PROM, improving cabinet reliability. Implemented as a sequencer between a host MCU and field I/O, it provides 97 user I/Os and 110592 bits of RAM for buffering; the trade-off versus a CPLD is more routing delay but far greater logic density per footprint.
Recommended
Aerospace and Defense Subsystems
The flash-based ProASIC3L architecture suits aerospace and defense applications where configuration readback protection and single-chip, instant-on operation are required. Unlike SRAM FPGAs that load configuration from external memory at power-up - exposing a vulnerability window - the A3P600L-1FG144I is active within microseconds of power application and stores its bitstream in on-chip flash, immune to SEU-driven configuration upset. The 144-FBGA package saves board area in payload modules, and 97 I/Os interface sensor arrays and telemetry buses. The -1 speed grade limits maximum toggle rates, so reserve this part for control-plane rather than high-throughput datapath functions.
Recommended
Battery-Powered Portable Instrumentation
Portable and battery-powered instruments benefit from the 'L' in ProASIC3L: the 1.2 V core voltage cuts dynamic power roughly proportional to V-squared versus 1.5 V core ProASIC3 devices, extending battery life in handheld analyzers and dataloggers. Nonvolatile flash configuration means the instrument is ready the instant the power switch closes - no boot delay - which users notice directly. With 600K gates and 110592 bits of embedded RAM, the device implements acquisition sequencing, display interfacing, and communication bridges around a low-power MCU. The industrial temperature rating also covers equipment left in vehicles or field conditions well beyond office ambient ranges.
Recommended
Communications Bridging and Protocol Conversion
The A3P600L-1FG144I implements protocol bridges between legacy serial interfaces and modern buses in networking and telecom line cards. Its 97 user I/Os span multiple banks for mixed-voltage interfaces, and the 110592-bit embedded RAM provides FIFO buffering that decouples asynchronous clock domains at the bridge boundary. Flash-based configuration is valuable in remote telecom cabinets where losing the configuration file would require a site visit - the bitstream is stored on-chip and survives power cycling indefinitely. Timing performance of the -1 speed grade comfortably covers UART, SPI, I2C, and parallel bus rates, but check static timing for anything approaching hundreds of MHz.
Recommended
Test and Measurement Equipment
Bench and modular test instruments use the A3P600L-1FG144I for timing generation, trigger logic, and instrument backplane interfacing. The 600K gate capacity accommodates counters, pattern generators, and state machines, while the flash configuration guarantees the instrument is functional immediately at power-up - a visible advantage over SRAM FPGAs that need several hundred milliseconds to configure. Low 1.2 V core power keeps instrument internal temperature rise modest, protecting calibration stability. The 144-ball FBGA footprint fits standard instrument main boards, and Libero SoC supports design iteration during product development with full in-system reprogrammability.
Recommended
Security and Surveillance Systems
Surveillance and access-control equipment leverages the readback-protected flash configuration of the A3P600L-1FG144I, since the configuration bitstream cannot be dumped from the device - protecting proprietary image-processing or encryption logic embedded in the fabric. The single-chip design removes the external configuration flash that an attacker could otherwise intercept or clone. With 600K gates and 97 I/Os, the device handles camera interface bridging, sensor fusion, and tamper-detection logic, while the industrial temperature range covers outdoor camera housings from -40C to +100C. Power consumption at a 1.2 V core suits PoE-powered cameras with tight power budgets.
Recommended
Recommended Products Summary
Engineering reference data for A3P600L-1FG144I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-1FGG144I | A3P600L-FG144I | A3P600L-1FG144 | A3P1000L-1FG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FG144) | 144-FBGA (FGG144) - same footprint | 144-FBGA (FG144) - same | 144-FBGA (FG144) - same | 144-FBGA (FG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 1000K |
| User I/O | 97 | 97 | 97 | 97 | [DATA_NEEDED] |
| Embedded RAM | 110592 bit | 110592 bit | 110592 bit | 110592 bit | [DATA_NEEDED] |
| Speed Grade | -1 | -1 | Standard | -1 | -1 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +70C (commercial) | [DATA_NEEDED] |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Configuration | Nonvolatile flash, single-chip | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
Key Differentiators
- Low-power 1.2 V core in the L family (vs A3P600-FG144I (standard ProASIC3))
- Industrial temperature in the -1 speed grade (vs A3P600L-1FG144)
- Same-footprint density upgrade path (vs A3P1000L-1FG144)
Design Notes
Estimated: the ProASIC3L low-power core at 1.2 V reduces dynamic power by roughly (1.2/1.5)^2 = 64% versus a 1.5 V core for the same toggle rate, so always design the core rail at 1.2 V when battery life matters; reserve 1.5 V for designs needing extra timing margin. Distributor data specifies the operating range as 1.14 V to 1.575 V, giving useful regulator tolerance, but dynamic power scales with V^2 so a 1.5 V setting on a 1.2 V design raises power nearly 56%.
The 144-FBGA requires a controlled ball-out: before routing, lock I/O bank assignments in Microchip Libero SoC so that all I/O standards in one bank share a compatible VCCI rail - mixing 3.3 V and 1.8 V standards within one bank causes bank-voltage conflicts that Libero flags at layout. Use the manufacturer's reference ball map in the family datasheet; keep a solid VCCI plane per bank and decouple each supply pin with 0.1 uF ceramic capacitors placed within 2 mm of the ball via.
Do not treat the -1 speed grade as interchangeable with the standard grade in timing-critical paths: static timing analysis in Libero must pass at the -1 corner before selecting the cheaper -1 device. Also note that FG and FGG packages share the footprint but differ in ball finish (lead-bearing vs lead-free); RoHS-mandated builds must specify the FGG suffix. Verify configuration security settings before production - flash readback protection is enabled through Libero, not by default.
Compliance Information
RoHS compliance listed on distributor pages. Lead-free finish is explicitly associated with FGG suffix variants (e.g., A3P600L-FGG144I); FG suffix finish details not stated in provided data. AEC-Q100 qualification not indicated.
