A3P1000L-1FG144 - ProASIC3L Flash FPGA 97 I/O | Microchip
MPN: A3P1000L-1FG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $161.99 | $161.99 |
| 10 | $149.5 | $1,495.00 |
| 100 | $138 | $13,800.00 |
| 500 | $128.5 | $64,250.00 |
| 1,000 | $119 | $119,000.00 |
Drop-in alternatives for A3P1000L-1FG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P1000L-1FGG144
✅ Drop-In✓ In Stock
$29.9 / Unit
View Datasheet →A3P1000L-1FGG144I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P1000-1FGG144T
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$75 / Unit
View Datasheet →A3P1000-2FGG144I
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$27.2 / Unit
View Datasheet →A3P1000-FG144
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$27.2 / Unit
View Datasheet →A3P600L-1FG144
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$25.73 / Unit
View Datasheet →A3P600L-1FGG144
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$29.4 / Unit
View Datasheet →A3P1000L-1FG144 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash FPGA) |
| Logic Elements | 11K LEs |
| Logic Cells (CLBs) | 24576 |
| System Gates | 1000000 |
| User I/O | 97 |
| Embedded Flash Memory | 147456 bits |
| Core Voltage | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Low Power Technology | Flash*Freeze |
| Package | 144-LBGA (FBGA-144), 13 x 13 mm, 1 mm pitch, 1.45 mm height |
| Mounting Type | Surface Mount |
| Technology | CMOS flash-based FPGA |
A3P1000L-1FG144 144-lbga (fbga-144), 13 x 13 mm, 1 mm pitch, 1.45 mm height Pin Configuration Guide
Complete pinout information for A3P1000L-1FG144 (144-lbga (fbga-144), 13 x 13 mm, 1 mm pitch, 1.45 mm height package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P1000L-1FG144.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000L-1FG144 is suitable for 6 applications: Portable & Battery-Powered Instruments, Industrial Control & Automation, Secure Embedded Systems, Communications Line Cards & Networking, Medical & Diagnostic Devices, Aerospace-Adjacent & Rugged Commercial Systems.
Portable & Battery-Powered Instruments
The A3P1000L-1FG144 fits portable instrumentation because the ProASIC3L 'L' die was purpose-built for low static power, and Flash*Freeze technology freezes I/O and internal register state while cutting dynamic power dramatically during idle periods - ideal for handheld meters, data loggers, and field test equipment that sleep between measurements. With a 1.2 V core option and non-volatile on-chip flash configuration, there is zero boot energy spent loading an external configuration device, which also removes one component from the battery-powered BOM. Place the device between an MCU and front-end circuitry to implement glue logic, timing, and sensor interfacing; wake latency from Flash*Freeze is near-instant, preserving responsive user experience while extending battery life compared with always-on SRAM FPGAs.
Recommended
Industrial Control & Automation
In industrial control panels and automation nodes, the A3P1000L-1FG144 consolidates PLC I/O logic, encoder interfaces, and safety interlocks into a single flash FPGA whose configuration survives power cycling instantly - critical for machinery that must be live at power-up. The 97 user I/Os at 13 x 13 mm provide dense interface integration for 24 V industrial signaling through appropriate level shifters, and the on-chip flash configuration resists configuration corruption in electrically noisy factory environments. Because the -1 speed grade targets cost-optimized designs, moderate-speed sequencing and I/O expansion tasks run comfortably while static power stays low in 24/7 operation. Designers should verify DDR and timing-critical interfaces in Libero SoC against the -1 grade before finalizing the board.
Recommended
Secure Embedded Systems
Flash-based FPGAs like the A3P1000L-1FG144 offer a security advantage over SRAM FPGAs: the bitstream is stored on-chip in non-volatile flash and never needs to be streamed from an external device at power-up, eliminating the most common bitstream-intercept attack surface. This makes the part suitable for secure embedded controllers, authentication nodes, and defense-adjacent commercial equipment where design IP must be protected. The single-chip solution also reduces the bill of materials to one programmable device, shrinking the physical attack surface of the board. Combine the FPGA with a secure MCU for key storage and attestation; the FPGA handles interface logic while configuration remains on-die, and Live-at-Power-Up behavior means security-critical logic is active before an external processor completes boot.
Recommended
Communications Line Cards & Networking
The A3P1000L-1FG144 serves as control-plane glue logic on communications line cards and networking equipment, handling board management, I2C/SPI fan-out, status aggregation, and hot-swap sequencing while the main data path uses dedicated PHYs or switch silicon. With 97 user I/Os and 147,456 bits of embedded flash, it integrates former CPLD and discrete glue functions into one 13 x 13 mm device. Live-at-power-up flash configuration lets the FPGA assert management signals before host processors boot, which is often required by backplane standards for inrush and presence signaling. The low static power of the ProASIC3L die matters in rack equipment where idle-card power budgets are audited. Verify -1 speed grade timing for any high-rate interface and consider A3P1000-2FGG144I when faster fabric is needed.
Recommended
Medical & Diagnostic Devices
Medical diagnostic equipment - patient monitors, portable analyzers, and imaging front-ends - benefits from the A3P1000L-1FG144's combination of instant-on configuration, low idle power, and 97 flexible I/Os for sensor arrays. The non-volatile flash fabric removes configuration-device failure as a single point of failure in devices where availability is safety-relevant, and Flash*Freeze lets battery-operated diagnostic units maintain sensor state between acquisition windows at minimal power. The FPGA implements deterministic timing for ADC readout and actuator control that a general MCU alone may not sustain. Designers should observe medical EMC and leakage-current budgets at the system level; the FPGA's 1.2-1.5 V core helps limit internal dissipation, and I/O banks can be run at low voltages suited to analog front-end interfaces.
Recommended
Aerospace-Adjacent & Rugged Commercial Systems
While the commercial A3P1000L-1FG144 is not radiation-hardened, its flash-based configuration fabric is inherently immune to configuration upset from single-event effects in a way SRAM FPGAs are not, making the architecture attractive for rugged commercial drones, avionics-adjacent test rigs, and high-altitude platforms where configuration corruption is a system risk. The single-chip flash design also tolerates vibration and thermal cycling better than solutions relying on a separate configuration PROM soldered connection. With 1M gates of usable fabric, designers implement sensor fusion, motor control sequencing, and telemetry formatting on one 13 x 13 mm, 1 mm-pitch device. For programs requiring guaranteed temperature grades, specify the A3P1000L-1FGG144I industrial variant with the identical footprint for drop-in thermal-range upgrade.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000L-1FG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000L-1FGG144 | A3P1000-1FGG144T | A3P600L-1FG144 |
|---|---|---|---|---|
| Package | 144-FBGA (13 x 13 mm, 1 mm pitch) | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | ~11K LEs | ~11K LEs | ~11K LEs | ~6K LEs |
| User I/O | 97 | 97 | 97 | [DATA_NEEDED] |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.5 V (standard ProASIC3) | 1.2 V to 1.5 V |
| Flash*Freeze Low-Power Mode | Yes (ProASIC3L) | Yes | No (standard ProASIC3) | Yes |
| Speed Grade | -1 | -1 | -1 | -1 |
| Configuration | On-chip flash, single chip | On-chip flash - same | On-chip flash - same | On-chip flash - same |
| Embedded Flash | 147456 bits | 147456 bits | 147456 bits | [DATA_NEEDED] |
Key Differentiators
- Flash*Freeze low-power mode (vs A3P1000-1FGG144T)
- Green lead-free package availability (vs A3P1000L-1FG144 (base))
- Larger fabric than same-footprint smaller sibling (vs A3P600L-1FG144)
- Trade-off: slowest speed grade (vs A3P1000-2FGG144I)
Design Notes
The A3P1000L-1FG144 core accepts 1.2 V to 1.5 V; choose 1.2 V when minimum static power matters (battery devices) and up to 1.5 V when timing margin at the -1 speed grade is tight - core voltage directly affects fabric speed. Decouple each supply with bulk capacitance near the ball array plus 0.1 uF ceramics at corner balls. Because configuration is non-volatile, there is no inrush from a configuration PROM, simplifying hot-swap and brown-out behavior. Verify I/O bank voltages against your level plan before routing.
The 144-FBGA has 1 mm pitch and a 13 x 13 mm body - routing is feasible on 4 layers with 0.15 mm via-in-pad or dog-bone escapes on the perimeter rows. Place the FPGA so power balls face the regulator section and high-speed I/O face connectors to minimize crossing traces. Ball escape on inner rows is limited; plan signal assignments in Libero SoC pin constraints early to avoid respins, since most I/O balls are user-assignable within fixed VDD/VSS/JTAG positions.
The -1 speed grade is the slowest ProASIC3L grade - do not assume -2 fabric timing when evaluating DDR interfaces or fast state machines; run static timing in Libero before committing. Another common pitfall: the base 'FG' part may not be the green/lead-free variant; if RoHS compliance is mandated, order A3P1000L-1FGG144 instead. Finally, do not rely on the plain FG part for industrial temperature ranges - specify the 'I' suffix variant (A3P1000L-1FGG144I), which is footprint-identical.
Use Flash*Freeze mode intentionally: entry requires all monitored I/O held static, so add pull resistors or switch isolation on asynchronous inputs entering the FPGA to prevent spurious state corruption during freeze. Exit latency is short but not zero - design wake-up sequencing in the host MCU accordingly. Estimated: for typical low-power portable duty cycles (active 10%, frozen 90%), most system energy savings come from the freeze mode rather than the static supply current difference versus standard ProASIC3.
Compliance Information
The 'GG' suffix variant (A3P1000L-1FGG144) is the green/lead-free package per Microchip ordering conventions; compliance documents for the exact ordering code should be pulled from the Microchip product page. No explicit RoHS/REACH statement appeared in the retrieved data for the base FG part.
