ATSAM3S2CA-CU - 64MHz ARM Cortex-M3 MCU 128KB Flash | Microchip
N.º de pieza: ATSAM3S2CA-CU ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.23 | $5,23 |
| 10 | $4.75 | $47,50 |
| 100 | $4.3 | $430,00 |
| 500 | $3.95 | $1.975,00 |
| 1.000 | $3.6 | $3.600,00 |
ATSAM3S2CA-CU Descripción general
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded-system hierarchy above discrete logic and below application processors. The SAM3S family belongs to the ARM Cortex-M3 class of 32-bit MCUs, widely used where deterministic performance, low power, and rich analog/digital peripherals are required at moderate cost.
Key features include the ARM Cortex-M3 core with Thumb-2 instruction set and nested vectored interrupt controller (NVIC), 1.62V to 3.6V single-supply operation, a USB 2.0 full-speed device port, multiple USART/SPI/TWI serial interfaces, a 12-bit ADC, and an internal RC oscillator option set (4/8/12 MHz plus 32 kHz) that can remove the need for an external crystal in cost-sensitive designs.
Architecturally, the device integrates a multi-layer bus matrix and peripheral DMA channels, allowing peripherals such as the ADC and USARTs to transfer data without CPU intervention. The flash accelerator keeps effective execution close to the 64 MHz core speed, while power management controllers with multiple sleep and wait modes support battery-operated designs.
Typical applications include industrial control panels, consumer appliances, data-logging and sensor-gateway products, and USB-connected portable equipment where the full-speed USB device controller and generous USART count (up to 7 UART-class ports) simplify connectivity.
Design consideration: the TFBGA (9x9) ball-grid package demands controlled-impedance multilayer PCB layout and reflow assembly; teams requiring hand soldering or simpler inspection should evaluate the pin-compatible LQFP counterpart within the SAM3S family before committing to the BGA footprint.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, drop-in same-package alternatives across the SAM3S flash-density ladder, and practical design notes for BGA layout and power-supply decoupling.
Alternativas directas para ATSAM3S2CA-CU — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAM3S2CA-CU (mismo factor de forma y huella) — difiere en SRAM, Flash Memory, Core Processor, Package, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAM3S1CA-CU
✅ Sustitución directa✓ En stock
$3.05 / unidad
Ver hoja de datos →ATSAM3S4CA-CU
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.95 / unidad
Ver hoja de datos →ATSAM3S8CA-CU
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.25 / unidad
Ver hoja de datos →ATSAM3SD8CA-CU
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.41 / unidad
Ver hoja de datos →ATSAM3S2CA-CU Valores máximos y características eléctricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 32 KB (32K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Encapsulado | 100-TFBGA (9x9 mm) |
| Pin/Ball Count | 100 |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| UART/USART Count | 7 |
| SPI Count | 4 |
| I2C (TWI) Count | 3 |
| USB | USB 2.0 Full-Speed Device |
| Internal Oscillator | 4/8/12 MHz RC + 32 kHz RC |
| Crypto Engine | No |
Guía de configuración de pines de ATSAM3S2CA-CU 100-tfbga (9x9 mm)
Configuración de pines para ATSAM3S2CA-CU (encapsulado 100-tfbga (9x9 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAM3S2CA-CU.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAM3S2CA-CU es adecuado para 6 aplicacións: Industrial Control Panels, USB Data Loggers and Gateways, Consumer Appliance Control, Sensor Network Nodes, Motor Control Interface Boards, Test and Measurement Accessories.
Industrial Control Panels
The ATSAM3S2CA-CU fits industrial HMI and control-panel controllers because its seven UART-class ports, four SPI and three I2C interfaces connect PLC front-ends, touch controllers, and field displays simultaneously on one 64 MHz Cortex-M3 core. The 128 KB flash accommodates a state-machine application plus a Modbus or custom protocol stack, while 32 KB SRAM buffers communication frames. Operating from 1.62V to 3.6V, it runs directly from a 3.3V industrial rail, and the industrial -40C to +85C rating covers cabinet environments. Peripheral DMA offloads serial transfers so the CPU can dedicate cycles to control loops, and the TFBGA-100's dense 9x9 mm footprint conserves PCB area in modular panel controllers.
Recomendado
USB Data Loggers and Gateways
Data-logging products benefit from the ATSAM3S2CA-CU's integrated USB 2.0 full-speed device controller, which enumerates as CDC or MSC without an external USB chip, cutting BOM cost. Sensor data captured via the 12-bit ADC or TWI-connected sensors is buffered in 32 KB SRAM and streamed over USB or stored in external SPI flash via one of the four SPI peripherals. The 64 MHz Cortex-M3 with Thumb-2 code density keeps firmware compact within 128 KB flash. Multi-mode power management allows sleep between samples, extending battery life in portable loggers, and the internal RC oscillators enable crystal-less designs where timing accuracy requirements are relaxed.
Recomendado
Consumer Appliance Control
Appliance control boards - coffee machines, air-conditioner user interfaces, small kitchen equipment - use the ATSAM3S2CA-CU to drive segment LCDs or serial displays, read capacitive touch via TWI-attached controllers, and manage relays through GPIO with adequate drive configuration. The 9x9 mm TFBGA-100 saves board space in compact appliance PCBs, while the 1.62V-3.6V single-supply range simplifies power design from a mains-derived 3.3V rail. Internal 4/8/12 MHz RC oscillators remove crystal cost in applications with loose timing tolerances. Industrial temperature rating adds margin for near-heat-source mounting, and 128 KB flash holds UI firmware, Unicode font tables, and OTA-updatable logic.
Recomendado
Sensor Network Nodes
Wired sensor nodes and gateways leverage the ATSAM3S2CA-CU's seven USARTs and three TWI ports to aggregate multiple sensor streams into a single uplink. The 12-bit ADC samples analog sensors directly, and peripheral DMA moves results to SRAM without CPU wake-ups, reducing average current in sleep-dominated duty cycles. At 64 MHz the Cortex-M3 executes protocol stacks (Modbus RTU, custom framing) with headroom, while 128 KB flash supports in-field firmware updates over the same serial links. The 1.62V-3.6V supply range tolerates long-cable rail droop, and the -40C to +85C industrial rating suits outdoor and rooftop enclosures.
Recomendado
Motor Control Interface Boards
As the supervisory controller in motor-driven systems, the ATSAM3S2CA-CU communicates with dedicated motor drivers over SPI or USART, samples current shunts through its 12-bit ADC, and enforces safety interlocks with fast GPIO interrupt response from the Cortex-M3 NVIC. While the SAM3S lacks dedicated motor-control PWM peripherals of the SAM3X/ATSAM4C families, 128 KB flash and 32 KB SRAM comfortably host a supervision state machine, fault logging, and host protocol. The 64 MHz core provides deterministic interrupt latency, and the TFBGA-100's many GPIO support encoder inputs and limit-switch monitoring in compact drive-interface PCBs.
Recomendado
Test and Measurement Accessories
USB instrument accessories - calibration adapters, multi-port serial probes, bench data front-ends - use the ATSAM3S2CA-CU because the full-speed USB device port plus abundant UARTs let one MCU bridge a PC application to several targets. Thumb-2 code density and 128 KB flash hold command parsers and DSP-style filtering, while 32 KB SRAM buffers waveform captures from the 12-bit ADC at moderate sample rates. Peripheral DMA sustains continuous streaming to USB without CPU stalls. Operation from a single 3.3V rail drawn over USB bus power keeps accessory hardware simple, and the industrial temperature spec tolerates bench-top thermal variation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAM3S2CA-CU — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAM3S1CA-CU | ATSAM3S4CA-CU | ATSAM3S8CA-CU | ATSAM3SD8CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology (Atmel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 128 KB | 64 KB | 256 KB | 512 KB | 512 KB |
| Supply Voltage | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V |
| USB | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device (high-speed-capable family variant) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Balanced memory density for cost-optimized designs (frente a ATSAM3S8CA-CU)
- Headroom against flash ceiling (frente a ATSAM3S1CA-CU)
- Integrated full-speed USB device (frente a ATSAM3N4BA-MU)
Notas de diseño
The 9x9 mm TFBGA-100 uses a 0.8 mm ball pitch. Plan a 4-layer minimum stackup with via-in-pad or dog-bone fanout and an unbroken ground plane under the device. Solder-mask-defined pads with non-solder-mask-defined via capture improve assembly yield. BGA assembly requires reflow; budget for X-ray or optical inspection and rework capability before committing to the -CU package instead of the -AU LQFP equivalent.
Supply the VDDIO/VDDCORE rails from a clean 3.3V source within the 1.62V-3.6V range. Place 100 nF ceramic capacitors within 2 mm of each supply ball pair, plus bulk 10 uF near the regulator. Follow Microchip's SAM3S hardware design application note for internal-regulator capacitor requirements on VDDCORE; omitting or misplacing this capacitor is a common cause of brown-out during flash writes.
Do not assume the -CU (TFBGA) and -AU (LQFP) variants are interchangeable: identical silicon, different footprints. Also verify USB full-speed routing with 90-ohm differential impedance and keep the 1.5 kOhm pull-up per USB device spec handled by the on-chip transceiver. When using internal RC oscillators for cost savings, remember flash self-write timing and USB accuracy requirements may still mandate the external crystal.
Información de cumplimiento
Compliance data was not present in the provided verified web data. The -CU suffix generally denotes lead-free/halogen-free processing for Microchip parts, but RoHS/REACH status must be confirmed from the official Microchip product page before release.
