ATSAM3S2CA-CU - 64MHz ARM Cortex-M3 MCU 128KB Flash | Microchip
MPN： ATSAM3S2CA-CU ✓ 啟用中ATSAM3S2CA-CU 概覽
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded-system hierarchy above discrete logic and below application processors. The SAM3S family belongs to the ARM Cortex-M3 class of 32-bit MCUs, widely used where deterministic performance, low power, and rich analog/digital peripherals are required at moderate cost.
Key features include the ARM Cortex-M3 core with Thumb-2 instruction set and nested vectored interrupt controller (NVIC), 1.62V to 3.6V single-supply operation, a USB 2.0 full-speed device port, multiple USART/SPI/TWI serial interfaces, a 12-bit ADC, and an internal RC oscillator option set (4/8/12 MHz plus 32 kHz) that can remove the need for an external crystal in cost-sensitive designs.
Architecturally, the device integrates a multi-layer bus matrix and peripheral DMA channels, allowing peripherals such as the ADC and USARTs to transfer data without CPU intervention. The flash accelerator keeps effective execution close to the 64 MHz core speed, while power management controllers with multiple sleep and wait modes support battery-operated designs.
Typical applications include industrial control panels, consumer appliances, data-logging and sensor-gateway products, and USB-connected portable equipment where the full-speed USB device controller and generous USART count (up to 7 UART-class ports) simplify connectivity.
Design consideration: the TFBGA (9x9) ball-grid package demands controlled-impedance multilayer PCB layout and reflow assembly; teams requiring hand soldering or simpler inspection should evaluate the pin-compatible LQFP counterpart within the SAM3S family before committing to the BGA footprint.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, drop-in same-package alternatives across the SAM3S flash-density ladder, and practical design notes for BGA layout and power-supply decoupling.
直接替換替代品，適用於 ATSAM3S2CA-CU — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAM3S2CA-CU （相同外形與佔位） — 差異在於 SRAM, Flash Memory, Core Processor, Package, Operating Temperature.
ATSAM3S1CA-CU
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3S4CA-CU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAM3S8CA-CU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAM3SD8CA-CU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAM3S2CA-CU 最大額定值與電氣特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 32 KB (32K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| 封裝 | 100-TFBGA (9x9 mm) |
| Pin/Ball Count | 100 |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | -40C to +85C (Industrial) |
| UART/USART Count | 7 |
| SPI Count | 4 |
| I2C (TWI) Count | 3 |
| USB | USB 2.0 Full-Speed Device |
| Internal Oscillator | 4/8/12 MHz RC + 32 kHz RC |
| Crypto Engine | No |
ATSAM3S2CA-CU 100-tfbga (9x9 mm) 腳位配置指南
ATSAM3S2CA-CU（100-tfbga (9x9 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAM3S2CA-CU.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAM3S2CA-CU 適用於 6 應用s: Industrial Control Panels, USB Data Loggers and Gateways, Consumer Appliance Control, Sensor Network Nodes, Motor Control Interface Boards, Test and Measurement Accessories.
Industrial Control Panels
The ATSAM3S2CA-CU fits industrial HMI and control-panel controllers because its seven UART-class ports, four SPI and three I2C interfaces connect PLC front-ends, touch controllers, and field displays simultaneously on one 64 MHz Cortex-M3 core. The 128 KB flash accommodates a state-machine application plus a Modbus or custom protocol stack, while 32 KB SRAM buffers communication frames. Operating from 1.62V to 3.6V, it runs directly from a 3.3V industrial rail, and the industrial -40C to +85C rating covers cabinet environments. Peripheral DMA offloads serial transfers so the CPU can dedicate cycles to control loops, and the TFBGA-100's dense 9x9 mm footprint conserves PCB area in modular panel controllers.
推薦
USB Data Loggers and Gateways
Data-logging products benefit from the ATSAM3S2CA-CU's integrated USB 2.0 full-speed device controller, which enumerates as CDC or MSC without an external USB chip, cutting BOM cost. Sensor data captured via the 12-bit ADC or TWI-connected sensors is buffered in 32 KB SRAM and streamed over USB or stored in external SPI flash via one of the four SPI peripherals. The 64 MHz Cortex-M3 with Thumb-2 code density keeps firmware compact within 128 KB flash. Multi-mode power management allows sleep between samples, extending battery life in portable loggers, and the internal RC oscillators enable crystal-less designs where timing accuracy requirements are relaxed.
推薦
Consumer Appliance Control
Appliance control boards - coffee machines, air-conditioner user interfaces, small kitchen equipment - use the ATSAM3S2CA-CU to drive segment LCDs or serial displays, read capacitive touch via TWI-attached controllers, and manage relays through GPIO with adequate drive configuration. The 9x9 mm TFBGA-100 saves board space in compact appliance PCBs, while the 1.62V-3.6V single-supply range simplifies power design from a mains-derived 3.3V rail. Internal 4/8/12 MHz RC oscillators remove crystal cost in applications with loose timing tolerances. Industrial temperature rating adds margin for near-heat-source mounting, and 128 KB flash holds UI firmware, Unicode font tables, and OTA-updatable logic.
推薦
Sensor Network Nodes
Wired sensor nodes and gateways leverage the ATSAM3S2CA-CU's seven USARTs and three TWI ports to aggregate multiple sensor streams into a single uplink. The 12-bit ADC samples analog sensors directly, and peripheral DMA moves results to SRAM without CPU wake-ups, reducing average current in sleep-dominated duty cycles. At 64 MHz the Cortex-M3 executes protocol stacks (Modbus RTU, custom framing) with headroom, while 128 KB flash supports in-field firmware updates over the same serial links. The 1.62V-3.6V supply range tolerates long-cable rail droop, and the -40C to +85C industrial rating suits outdoor and rooftop enclosures.
推薦
Motor Control Interface Boards
As the supervisory controller in motor-driven systems, the ATSAM3S2CA-CU communicates with dedicated motor drivers over SPI or USART, samples current shunts through its 12-bit ADC, and enforces safety interlocks with fast GPIO interrupt response from the Cortex-M3 NVIC. While the SAM3S lacks dedicated motor-control PWM peripherals of the SAM3X/ATSAM4C families, 128 KB flash and 32 KB SRAM comfortably host a supervision state machine, fault logging, and host protocol. The 64 MHz core provides deterministic interrupt latency, and the TFBGA-100's many GPIO support encoder inputs and limit-switch monitoring in compact drive-interface PCBs.
推薦
Test and Measurement Accessories
USB instrument accessories - calibration adapters, multi-port serial probes, bench data front-ends - use the ATSAM3S2CA-CU because the full-speed USB device port plus abundant UARTs let one MCU bridge a PC application to several targets. Thumb-2 code density and 128 KB flash hold command parsers and DSP-style filtering, while 32 KB SRAM buffers waveform captures from the 12-bit ADC at moderate sample rates. Peripheral DMA sustains continuous streaming to USB without CPU stalls. Operation from a single 3.3V rail drawn over USB bus power keeps accessory hardware simple, and the industrial temperature spec tolerates bench-top thermal variation.
推薦
推薦產品摘要
工程參考資料，適用於 ATSAM3S2CA-CU — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAM3S1CA-CU | ATSAM3S4CA-CU | ATSAM3S8CA-CU | ATSAM3SD8CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology (Atmel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 128 KB | 64 KB | 256 KB | 512 KB | 512 KB |
| Supply Voltage | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V |
| USB | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device (high-speed-capable family variant) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主要差異化特點
- Balanced memory density for cost-optimized designs (對比ATSAM3S8CA-CU)
- Headroom against flash ceiling (對比ATSAM3S1CA-CU)
- Integrated full-speed USB device (對比ATSAM3N4BA-MU)
設計說明
The 9x9 mm TFBGA-100 uses a 0.8 mm ball pitch. Plan a 4-layer minimum stackup with via-in-pad or dog-bone fanout and an unbroken ground plane under the device. Solder-mask-defined pads with non-solder-mask-defined via capture improve assembly yield. BGA assembly requires reflow; budget for X-ray or optical inspection and rework capability before committing to the -CU package instead of the -AU LQFP equivalent.
Supply the VDDIO/VDDCORE rails from a clean 3.3V source within the 1.62V-3.6V range. Place 100 nF ceramic capacitors within 2 mm of each supply ball pair, plus bulk 10 uF near the regulator. Follow Microchip's SAM3S hardware design application note for internal-regulator capacitor requirements on VDDCORE; omitting or misplacing this capacitor is a common cause of brown-out during flash writes.
Do not assume the -CU (TFBGA) and -AU (LQFP) variants are interchangeable: identical silicon, different footprints. Also verify USB full-speed routing with 90-ohm differential impedance and keep the 1.5 kOhm pull-up per USB device spec handled by the on-chip transceiver. When using internal RC oscillators for cost savings, remember flash self-write timing and USB accuracy requirements may still mandate the external crystal.
合規資訊
Compliance data was not present in the provided verified web data. The -CU suffix generally denotes lead-free/halogen-free processing for Microchip parts, but RoHS/REACH status must be confirmed from the official Microchip product page before release.
