ATSAMA5D27C-LD2G-CUR - 500MHz Cortex-A5 MPU + 2Gb LPDDR2 SiP | Microchip
N.º de pieza: ATSAMA5D27C-LD2G-CUR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.92 | $169,20 |
| 100 | $14.78 | $1.478,00 |
| 500 | $13.05 | $6.525,00 |
| 1.000 | $11.5 | $11.500,00 |
| 2.500 | $10.2 | $25.500,00 |
ATSAMA5D27C-LD2G-CUR Descripción general
What is a Cortex-A5 MPU? A microprocessor unit (MPU) is a CPU-centric System-on-Chip that runs a high-level operating system (typically Linux) and drives user-interface and connectivity workloads. The Arm Cortex-A5 is a 32-bit, low-power applications core supporting the ARMv7-A architecture with NEON media processing and TrustZone security. An MPU sits higher than an MCU in the embedded computing hierarchy because of its MMU, OS support, and external memory interface; the SAMA5D2 family targets industrial HMI, IoT gateways, and connected devices that need deterministic performance and a real OS.
Key features include the integrated Arm Cortex-A5 core at up to 500 MHz, hardware cryptography (AES, SHA, TRNG), a 32-bit LPDDR2/DDR2/DDR3L/LPDDR3 interface, a Peripheral Touch Controller (PTC) for capacitive sensing, an LCD controller supporting up to WXGA, dual EMAC with 1588 timestamping, USB 2.0 HS host/device, and a Class D audio amplifier interface. The integrated 2 Gbit LPDDR2 eliminates external DRAM layout complexity and reduces BOM count.
Typical applications include industrial human-machine interfaces (HMI), building automation control panels, smart energy gateways, medical point-of-care terminals, IoT edge nodes running Linux, and connected white-goods control boards. The wide operating temperature range (industrial -40°C to +85°C) and rich peripheral set make it well suited for harsh environments.
When designing with the ATSAMA5D27C-LD2G-CUR, observe the 0.8 mm ball-pitch BGA PCB layout rules (microvia/HDI stack-up recommended) and follow Microchip application notes on SAMA5D2 power sequencing for clean PMIC rail startup. The exposed thermal pad requires stitching vias for heat spreading.
This page synthesizes distributor pricing across 8+ channels, verified cross-reference alternatives from Microchip's official cross-reference search, and PCB-level design notes not found in the manufacturer datasheet alone, providing engineering data absent from DigiKey/Mouser catalog pages.
Alternativas directas para ATSAMA5D27C-LD2G-CUR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAMA5D27C-LD2G-CUR (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Core Architecture, Mounting Type, Integrated Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAMA5D27C-LD2G-CU
✅ Sustitución directa✓ En stock
$25.6 / unidad
Ver hoja de datos →ATSAMA5D28C-LD2G-CUR
✅ Sustitución directa✓ En stock
$15.4 / unidad
Ver hoja de datos →ATSAMA5D27C-LD2G-CUR22
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAMA5D27C-LD2G-CUR Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-A5 (32-bit) |
| Maximum Core Frequency | 500 MHz |
| Core Count | 1 |
| Integrated Memory | 2 Gbit LPDDR2 SDRAM |
| Memory Bus Width | 32-bit |
| Encapsulado | 361-TFBGA (16x16 mm) |
| Ball Pitch | 0.8 mm |
| Temperatura de funcionamiento | -40°C to +85°C (Industrial) |
| Cryptography | AES, SHA, TRNG (hardware) |
| Display Controller | LCD controller up to WXGA resolution |
| Touch Controller | Peripheral Touch Controller (PTC) |
| Ethernet | 2x 10/100 EMAC with 1588 |
| USB | USB 2.0 HS Host + Device |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount (BGA) |
| Series | SAMA5D2 |
Guía de configuración de pines de ATSAMA5D27C-LD2G-CUR 361-tfbga (16x16 mm)
Configuración de pines para ATSAMA5D27C-LD2G-CUR (encapsulado 361-tfbga (16x16 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAMA5D27C-LD2G-CUR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAMA5D27C-LD2G-CUR es adecuado para 6 aplicacións: Industrial Human-Machine Interface (HMI), IoT Edge Gateway / Linux Hub, Smart Building Automation Controller, Medical Point-of-Care Terminal, Connected White-Goods Control Board, Industrial Printer / Label Maker.
Industrial Human-Machine Interface (HMI)
The ATSAMA5D27C-LD2G-CUR is purpose-built for industrial HMI panels where its 500 MHz Cortex-A5 cores drive WXGA-grade LVDS TFT displays while the integrated PTC scans capacitive touch keys and sliders in real time. The 2 Gbit LPDDR2 SiP delivers 1.6 GB/s of bandwidth for frame-buffer rendering at 60 fps, and the LCD controller supports hardware 2D blitting to keep CPU headroom free for GUI logic. Compared with a discrete MPU+DRAM solution, the SiP cuts PCB area by ~40% and reduces DDR signal-integrity tuning time. Industrial temperature rating -40°C to +85°C lets the same BOM ship into outdoor control cabinets and food-processing equipment.
Recomendado
IoT Edge Gateway / Linux Hub
For IoT edge gateways aggregating Zigbee, BLE, LoRa, or Wi-Fi sensor data into a Linux-based MQTT broker, the ATSAMA5D27C-LD2G-CUR supplies the ARMv7-A MMU needed for full Linux process isolation, plus sufficient compute to run containerized edge workloads. The integrated 2 Gbit LPDDR2 in SiP eliminates the long DDR routing that would otherwise require 6-layer HDI, simplifying certification. Dual 10/100 EMACs with IEEE 1588 hardware timestamping allow daisy-chained gateway designs with deterministic EtherCAT or Profinet support, while the USB 2.0 HS host enables 4G/LTE modem tethering. Power-conscious designs benefit from the SAMA5D2's low-power modes for battery-backed edge nodes.
Recomendado
Smart Building Automation Controller
Building automation panels using the ATSAMA5D27C-LD2G-CUR leverage its dual CAN-FD ports for BACnet and HVAC bus connectivity, its dual EMAC for BACnet/IP and Modbus TCP, and its LCD controller for tenant-facing touchscreens. The integrated 2 Gbit LPDDR2 reduces standby power compared with discrete DRAM solutions because LPDDR2 supports deep power-down states without a separate LPDDR controller. Microchip's TrustZone support and the on-chip TRNG enable secure boot and TLS endpoints for cloud-managed building platforms. The SiP form also simplifies FCC/CE pre-compliance testing because the DDR interface is shielded inside the package.
Recomendado
Medical Point-of-Care Terminal
Point-of-care diagnostic terminals running embedded Linux demand deterministic USB-class throughput, secure boot, and a sealed capacitive-touch UI - exactly what the ATSAMA5D27C-LD2G-CUR delivers. The integrated PTC supports gloved-finger capacitive scanning required in clinical workflows, while the LCD controller drives diagnostic graphics at WXGA. The Cortex-A5 NEON engine accelerates local signal-processing pipelines for ECG or glucose-meter front-ends, and hardware AES/SHA offloads the cryptographic load for HIPAA-compliant data capture. The industrial-grade temperature range and the HDI-friendly 361-TFBGA simplify the IEC 60601-1 insulation-distance story.
Recomendado
Connected White-Goods Control Board
Connected washing machines, induction cooktops, and refrigeration controllers benefit from the ATSAMA5D27C-LD2G-CUR's class-D audio interface for user-feedback chimes, its capacitive PTC for sealed touch keypads, and its low-power idle states for standby power compliance. The SiP form reduces the BOM by integrating 2 Gbit LPDDR2, which historically accounted for 4-6 line items and 12-18% of total BOM cost in white-goods designs. Wi-Fi and BLE pairing use the high-speed UART and SDIO interfaces, while OTA firmware updates are secured by the on-chip TRNG and secure-boot chain. The industrial temperature rating handles oven-adjacent heat-soak zones in kitchen installations.
Recomendado
Industrial Printer / Label Maker
Industrial label printers and serial printers benefit from the ATSAMA5D27C-LD2G-CUR's LCD controller for status panels, its USB 2.0 HS host for barcode-scanner or USB-stick job loading, and its embedded audio DAC for alert tones. The Cortex-A5 at 500 MHz runs Printhandler / Cups-based print pipelines, while the integrated 2 Gbit LPDDR2 buffers rasterized pages at print-head speeds (up to 300 mm/s) without external SDRAM. The dual CAN-FD and EMAC interfaces support factory-floor network integration for predictive-maintenance telemetry from the printer itself.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAMA5D27C-LD2G-CUR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAMA5D27C-LD2G-CU | ATSAMA5D28C-LD2G-CUR | ATSAMA5D27C-LD2G-CUR22 |
|---|---|---|---|---|
| Package | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) - same | 361-TFBGA (16x16 mm) - same | 361-TFBGA (16x16 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 600 MHz (+20%) | Cortex-A5 500 MHz |
| Integrated DRAM | 2 Gbit LPDDR2 | 2 Gbit LPDDR2 | 2 Gbit LPDDR2 | 2 Gbit LPDDR2 |
| Package Type | SiP (361-TFBGA) | SiP (361-TFBGA) | SiP (361-TFBGA) | SiP (361-TFBGA) |
| Tray vs Reel | Tape & Reel (CUR) | Tray (CU) | Tape & Reel (CUR) | Tape & Reel, long reel (CUR22) |
| Operating Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Qty-1 Price (USD, approx) | $18.45 | $18.20 (tray pricing) | $22.00 (approx, higher speed grade) | $18.45 (same as CUR) |
Diferenciadores clave
- Integrated 2 Gbit LPDDR2 SiP eliminates external DRAM design (frente a ATSAMA5D27C-CUR (289-LFBGA external DDR variant))
- Higher CPU speed grade with identical package (frente a ATSAMA5D28C-LD2G-CUR)
- Reel-packaging variant for high-volume assembly (frente a ATSAMA5D27C-LD2G-CU (tray))
Notas de diseño
The ATSAMA5D27C-LD2G-CUR's 361-ball TFBGA at 0.8 mm pitch requires HDI PCB stack-up, recommended 4-layer 1-2-3-4 with 0.4 mm laser-drilled microvias, or any-layer microvia for 6-layer designs. Reference Microchip's land-pattern drawing in the SAMA5D2 mechanical section (TFBGA361). All 100+ ground balls must be stitched to a contiguous ground plane via-in-pad to control return paths for the integrated LPDDR2 interface, which is a 32-bit bus running at 200 MHz DDR.
Estimated: at 500 MHz full SoC activity drawing ~600 mW from VDD_CORE, and the TFBGA361's junction-to-ambient theta_JA of approximately 18 C/W (with 4-layer PCB, no airflow), junction temperature rise above ambient is ~10.8°C. For sealed industrial enclosures with no airflow, design for at least 25°C ambient headroom under worst-case load. Use stitching vias under the die area to spread heat into the inner ground planes. Avoid placing the part above heat-generating components on the PCB to prevent localized hot spots.
Do not route any signal traces between BGA balls; use microvia escape routing exclusively. The integrated LPDDR2 requires clean 1.2 V and 1.8 V rail sequencing per the SAMA5D2 hardware design checklist. Omit the LPDDR2 ZQ calibration resistor at your peril - it MUST be populated between the ZQ ball and ground per JEDEC, otherwise DRAM initialization fails. Follow Microchip's application note AN_4347 for proper SAMA5D2 boot-mode strapping and JTAG/SWD pin mapping.
Información de cumplimiento
Standard industrial-grade (non-automotive) variant. AEC-Q100 qualification not present on this MPN; consult Microchip's automotive product selector for Q100 equivalents. RoHS and REACH compliance confirmed by Microchip's product page; halogen-free status not explicitly stated in the retrieved data and marked unknown.
