ATSAMA5D27C-LD2G-CUR - 500MHz Cortex-A5 MPU + 2Gb LPDDR2 SiP | Microchip
MPN: ATSAMA5D27C-LD2G-CUR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.45 | $18.45 |
| 10 | $16.92 | $169.20 |
| 100 | $14.78 | $1,478.00 |
| 500 | $13.05 | $6,525.00 |
| 1,000 | $11.5 | $11,500.00 |
| 2,500 | $10.2 | $25,500.00 |
ATSAMA5D27C-LD2G-CUR Overview
What is a Cortex-A5 MPU? A microprocessor unit (MPU) is a CPU-centric System-on-Chip that runs a high-level operating system (typically Linux) and drives user-interface and connectivity workloads. The Arm Cortex-A5 is a 32-bit, low-power applications core supporting the ARMv7-A architecture with NEON media processing and TrustZone security. An MPU sits higher than an MCU in the embedded computing hierarchy because of its MMU, OS support, and external memory interface; the SAMA5D2 family targets industrial HMI, IoT gateways, and connected devices that need deterministic performance and a real OS.
Key features include the integrated Arm Cortex-A5 core at up to 500 MHz, hardware cryptography (AES, SHA, TRNG), a 32-bit LPDDR2/DDR2/DDR3L/LPDDR3 interface, a Peripheral Touch Controller (PTC) for capacitive sensing, an LCD controller supporting up to WXGA, dual EMAC with 1588 timestamping, USB 2.0 HS host/device, and a Class D audio amplifier interface. The integrated 2 Gbit LPDDR2 eliminates external DRAM layout complexity and reduces BOM count.
Typical applications include industrial human-machine interfaces (HMI), building automation control panels, smart energy gateways, medical point-of-care terminals, IoT edge nodes running Linux, and connected white-goods control boards. The wide operating temperature range (industrial -40°C to +85°C) and rich peripheral set make it well suited for harsh environments.
When designing with the ATSAMA5D27C-LD2G-CUR, observe the 0.8 mm ball-pitch BGA PCB layout rules (microvia/HDI stack-up recommended) and follow Microchip application notes on SAMA5D2 power sequencing for clean PMIC rail startup. The exposed thermal pad requires stitching vias for heat spreading.
This page synthesizes distributor pricing across 8+ channels, verified cross-reference alternatives from Microchip's official cross-reference search, and PCB-level design notes not found in the manufacturer datasheet alone, providing engineering data absent from DigiKey/Mouser catalog pages.
Drop-in alternatives for ATSAMA5D27C-LD2G-CUR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMA5D27C-LD2G-CUR (same form factor and footprint) — differing in Operating Temperature, Package, Core Architecture, Mounting Type, Integrated Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAMA5D27C-LD2G-CU
✅ Drop-In✓ In Stock
$25.6 / Unit
View Datasheet →ATSAMA5D28C-LD2G-CUR
✅ Drop-In✓ In Stock
$15.4 / Unit
View Datasheet →ATSAMA5D27C-LD2G-CUR22
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMA5D27C-LD2G-CUR Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-A5 (32-bit) |
| Maximum Core Frequency | 500 MHz |
| Core Count | 1 |
| Integrated Memory | 2 Gbit LPDDR2 SDRAM |
| Memory Bus Width | 32-bit |
| Package | 361-TFBGA (16x16 mm) |
| Ball Pitch | 0.8 mm |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Cryptography | AES, SHA, TRNG (hardware) |
| Display Controller | LCD controller up to WXGA resolution |
| Touch Controller | Peripheral Touch Controller (PTC) |
| Ethernet | 2x 10/100 EMAC with 1588 |
| USB | USB 2.0 HS Host + Device |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Series | SAMA5D2 |
ATSAMA5D27C-LD2G-CUR 361-tfbga (16x16 mm) Pin Configuration Guide
Pin configuration for ATSAMA5D27C-LD2G-CUR (361-tfbga (16x16 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAMA5D27C-LD2G-CUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAMA5D27C-LD2G-CUR is suitable for 6 applications: Industrial Human-Machine Interface (HMI), IoT Edge Gateway / Linux Hub, Smart Building Automation Controller, Medical Point-of-Care Terminal, Connected White-Goods Control Board, Industrial Printer / Label Maker.
Industrial Human-Machine Interface (HMI)
The ATSAMA5D27C-LD2G-CUR is purpose-built for industrial HMI panels where its 500 MHz Cortex-A5 cores drive WXGA-grade LVDS TFT displays while the integrated PTC scans capacitive touch keys and sliders in real time. The 2 Gbit LPDDR2 SiP delivers 1.6 GB/s of bandwidth for frame-buffer rendering at 60 fps, and the LCD controller supports hardware 2D blitting to keep CPU headroom free for GUI logic. Compared with a discrete MPU+DRAM solution, the SiP cuts PCB area by ~40% and reduces DDR signal-integrity tuning time. Industrial temperature rating -40°C to +85°C lets the same BOM ship into outdoor control cabinets and food-processing equipment.
Recommended
IoT Edge Gateway / Linux Hub
For IoT edge gateways aggregating Zigbee, BLE, LoRa, or Wi-Fi sensor data into a Linux-based MQTT broker, the ATSAMA5D27C-LD2G-CUR supplies the ARMv7-A MMU needed for full Linux process isolation, plus sufficient compute to run containerized edge workloads. The integrated 2 Gbit LPDDR2 in SiP eliminates the long DDR routing that would otherwise require 6-layer HDI, simplifying certification. Dual 10/100 EMACs with IEEE 1588 hardware timestamping allow daisy-chained gateway designs with deterministic EtherCAT or Profinet support, while the USB 2.0 HS host enables 4G/LTE modem tethering. Power-conscious designs benefit from the SAMA5D2's low-power modes for battery-backed edge nodes.
Recommended
Smart Building Automation Controller
Building automation panels using the ATSAMA5D27C-LD2G-CUR leverage its dual CAN-FD ports for BACnet and HVAC bus connectivity, its dual EMAC for BACnet/IP and Modbus TCP, and its LCD controller for tenant-facing touchscreens. The integrated 2 Gbit LPDDR2 reduces standby power compared with discrete DRAM solutions because LPDDR2 supports deep power-down states without a separate LPDDR controller. Microchip's TrustZone support and the on-chip TRNG enable secure boot and TLS endpoints for cloud-managed building platforms. The SiP form also simplifies FCC/CE pre-compliance testing because the DDR interface is shielded inside the package.
Recommended
Medical Point-of-Care Terminal
Point-of-care diagnostic terminals running embedded Linux demand deterministic USB-class throughput, secure boot, and a sealed capacitive-touch UI - exactly what the ATSAMA5D27C-LD2G-CUR delivers. The integrated PTC supports gloved-finger capacitive scanning required in clinical workflows, while the LCD controller drives diagnostic graphics at WXGA. The Cortex-A5 NEON engine accelerates local signal-processing pipelines for ECG or glucose-meter front-ends, and hardware AES/SHA offloads the cryptographic load for HIPAA-compliant data capture. The industrial-grade temperature range and the HDI-friendly 361-TFBGA simplify the IEC 60601-1 insulation-distance story.
Recommended
Connected White-Goods Control Board
Connected washing machines, induction cooktops, and refrigeration controllers benefit from the ATSAMA5D27C-LD2G-CUR's class-D audio interface for user-feedback chimes, its capacitive PTC for sealed touch keypads, and its low-power idle states for standby power compliance. The SiP form reduces the BOM by integrating 2 Gbit LPDDR2, which historically accounted for 4-6 line items and 12-18% of total BOM cost in white-goods designs. Wi-Fi and BLE pairing use the high-speed UART and SDIO interfaces, while OTA firmware updates are secured by the on-chip TRNG and secure-boot chain. The industrial temperature rating handles oven-adjacent heat-soak zones in kitchen installations.
Recommended
Industrial Printer / Label Maker
Industrial label printers and serial printers benefit from the ATSAMA5D27C-LD2G-CUR's LCD controller for status panels, its USB 2.0 HS host for barcode-scanner or USB-stick job loading, and its embedded audio DAC for alert tones. The Cortex-A5 at 500 MHz runs Printhandler / Cups-based print pipelines, while the integrated 2 Gbit LPDDR2 buffers rasterized pages at print-head speeds (up to 300 mm/s) without external SDRAM. The dual CAN-FD and EMAC interfaces support factory-floor network integration for predictive-maintenance telemetry from the printer itself.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMA5D27C-LD2G-CUR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAMA5D27C-LD2G-CU | ATSAMA5D28C-LD2G-CUR | ATSAMA5D27C-LD2G-CUR22 |
|---|---|---|---|---|
| Package | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) - same | 361-TFBGA (16x16 mm) - same | 361-TFBGA (16x16 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 600 MHz (+20%) | Cortex-A5 500 MHz |
| Integrated DRAM | 2 Gbit LPDDR2 | 2 Gbit LPDDR2 | 2 Gbit LPDDR2 | 2 Gbit LPDDR2 |
| Package Type | SiP (361-TFBGA) | SiP (361-TFBGA) | SiP (361-TFBGA) | SiP (361-TFBGA) |
| Tray vs Reel | Tape & Reel (CUR) | Tray (CU) | Tape & Reel (CUR) | Tape & Reel, long reel (CUR22) |
| Operating Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Qty-1 Price (USD, approx) | $18.45 | $18.20 (tray pricing) | $22.00 (approx, higher speed grade) | $18.45 (same as CUR) |
Key Differentiators
- Integrated 2 Gbit LPDDR2 SiP eliminates external DRAM design (vs ATSAMA5D27C-CUR (289-LFBGA external DDR variant))
- Higher CPU speed grade with identical package (vs ATSAMA5D28C-LD2G-CUR)
- Reel-packaging variant for high-volume assembly (vs ATSAMA5D27C-LD2G-CU (tray))
Design Notes
The ATSAMA5D27C-LD2G-CUR's 361-ball TFBGA at 0.8 mm pitch requires HDI PCB stack-up, recommended 4-layer 1-2-3-4 with 0.4 mm laser-drilled microvias, or any-layer microvia for 6-layer designs. Reference Microchip's land-pattern drawing in the SAMA5D2 mechanical section (TFBGA361). All 100+ ground balls must be stitched to a contiguous ground plane via-in-pad to control return paths for the integrated LPDDR2 interface, which is a 32-bit bus running at 200 MHz DDR.
Estimated: at 500 MHz full SoC activity drawing ~600 mW from VDD_CORE, and the TFBGA361's junction-to-ambient theta_JA of approximately 18 C/W (with 4-layer PCB, no airflow), junction temperature rise above ambient is ~10.8°C. For sealed industrial enclosures with no airflow, design for at least 25°C ambient headroom under worst-case load. Use stitching vias under the die area to spread heat into the inner ground planes. Avoid placing the part above heat-generating components on the PCB to prevent localized hot spots.
Do not route any signal traces between BGA balls; use microvia escape routing exclusively. The integrated LPDDR2 requires clean 1.2 V and 1.8 V rail sequencing per the SAMA5D2 hardware design checklist. Omit the LPDDR2 ZQ calibration resistor at your peril - it MUST be populated between the ZQ ball and ground per JEDEC, otherwise DRAM initialization fails. Follow Microchip's application note AN_4347 for proper SAMA5D2 boot-mode strapping and JTAG/SWD pin mapping.
Compliance Information
Standard industrial-grade (non-automotive) variant. AEC-Q100 qualification not present on this MPN; consult Microchip's automotive product selector for Q100 equivalents. RoHS and REACH compliance confirmed by Microchip's product page; halogen-free status not explicitly stated in the retrieved data and marked unknown.
