DSPIC33CK32MP502-E/2N - 100MHz 16-bit DSC 32KB | Microchip
N.º de pieza: DSPIC33CK32MP502-E/2N ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33CK32MP502-E/2N Descripción general
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and interrupt responsiveness of a microcontroller. In the power-management hierarchy, DSCs sit between general-purpose MCUs and dedicated DSPs, making them the standard choice for closed-loop control systems that need deterministic, cycle-accurate execution of control-law mathematics at high sampling rates.
Key differentiating features include a 100 MHz dsPIC33C core with DSP instruction extensions (MAC, DSP multiply-accumulate), dual-partition Flash supporting live update firmware upgrades, and functional-safety (FuSa) documentation support. The analog integration is notable for a 28-pin device: three on-chip operational amplifiers, three comparators, and 12-bit ADCs reduce external component count in power-conversion designs. High-Resolution PWM and CAN FD connectivity round out the control-oriented peripheral set.
Architecturally, the dsPIC33CK family uses a Modified Harvard architecture with a single-core pipeline executing up to 100 MIPS. Program Flash carries ECC and Memory Built-in Self-Test (MBIST) support on data SRAM, which underpins the family's functional-safety positioning for industrial and automotive control loops. The 28-UQFN exposed-pad package provides short bond wires and a low-inductance ground return, beneficial for fast switching edges generated by the high-resolution PWM peripherals in motor-drive and power-supply applications.
Typical applications include digital power supplies (LLC, totem-pole PFC), BLDC and PMSM motor control, and automotive/industrial sensing and control nodes that require CAN FD communication with extended-temperature reliability.
When designing with this device, verify that 32 KB of Flash and 8 KB of SRAM accommodate your application plus a bootloader; the dual-partition scheme allocates program space across two panels for live update, effectively trading usable Flash capacity for upgrade resilience.
This page synthesizes distributor pricing context, drop-in alternative analysis, and practical design guidance not found in the manufacturer datasheet.
Alternativas directas para DSPIC33CK32MP502-E/2N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33CK32MP502-E/2N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, ADC, Comparators, Core.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33CK32MP502-I/2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.71 / unidad
Ver hoja de datos →DSPIC33CK64MP502-E/2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →DSPIC33CK32MC102T-I/2N
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →DSPIC33CH64MP202-I/2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.31 / unidad
Ver hoja de datos →DSPIC33CK32MP502-E/2N Valores máximos y características eléctricas
| Core Processor | dsPIC33CK 16-bit DSC |
| Core Architecture | Modified Harvard, single-core |
| Maximum Clock Speed | 100 MHz (100 MIPS) |
| Program Flash Size | 32 KB (32K x 8), dual-partition with ECC |
| SRAM Size | 8 KB with MBIST |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +150C |
| Encapsulado | 28-UQFN (6x6 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Connectivity | CAN FD, I2C, SPI, UART/USART, IrDA, LINbus |
| On-chip Op-Amps | 3 |
| Comparators | 3 |
| ADC Resolution | 12-bit |
| PWM | High-Resolution PWM |
| Peripheral Trigger Generator | Yes (PTG) |
| Qualification | AEC-Q100 qualified, Functional Safety (FuSa) supported |
| Standard Package Quantity | 61 (tube) |
| Packaging | Tube |
Guía de configuración de pines de DSPIC33CK32MP502-E/2N 61 (tube)
Configuración de pines para DSPIC33CK32MP502-E/2N (encapsulado 61 (tube)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33CK32MP502-E/2N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33CK32MP502-E/2N es adecuado para 6 aplicacións: Digital Power Supplies (LLC, Totem-Pole PFC), BLDC / PMSM Motor Control, Automotive CAN FD Control Nodes, Advanced Sensing and Signal Conditioning, High-Brightness LED Lighting and Electronic Ballasts, Industrial Control and PLC I/O Modules.
Digital Power Supplies (LLC, Totem-Pole PFC)
The DSPIC33CK32MP502-E/2N fits digital power conversion because its 100 MHz (100 MIPS) core closes voltage/current loops at hundreds of kilohertz while the High-Resolution PWM provides sub-nanosecond duty-cycle granularity needed for LLC phase control. The three on-chip op-amps amplify shunt-resistor current signals without external amplifiers, and the three comparators implement fast cycle-by-cycle overcurrent trip independent of CPU load, keeping protection latency deterministic. Deployed between the input rectifier stage and the power switches, the controller runs control-law math in DSP-enhanced instructions while PTG-triggered ADC sampling aligns feedback capture to the PWM switching instant, minimizing switching-noise corruption of readings. The trade-off versus dedicated power controllers is firmware development effort, repaid by topology flexibility on one silicon platform.
Recomendado
BLDC / PMSM Motor Control
Field-oriented control (FOC) of brushless DC and permanent-magnet synchronous motors is a flagship dsPIC33CK use case: the 100 MHz core executes Clarke/Park transforms and PI current loops well within 20 kHz PWM periods, while the High-Resolution PWM generates three complementary output pairs with dead-time control. The integrated op-amps condition low-side shunt phase currents, and the 12-bit ADC synchronized to PWM samples them at mid-die-time for clean feedback. CAN FD connectivity enables integration into automotive and industrial motor networks with extended-temperature reliability assured by the -40C to +150C AEC-Q100 rating. Compared with discrete gate-driver-plus-MCU approaches, this device reduces BOM count in the 28-pin control node, though higher-phase-count systems should step up to the 48/64-pin family members.
Recomendado
Automotive CAN FD Control Nodes
The AEC-Q100 qualification and -40C to +150C operating range make the DSPIC33CK32MP502-E/2N appropriate for automotive modules mounted in thermally harsh zones such as engine compartments, pumps, and actuators. On-chip CAN FD provides the physical-layer protocol modern vehicle networks require, while ECC on program Flash and MBIST on SRAM support functional-safety development flows (the family is marketed with FuSa support packages). The dual-partition Flash architecture allows field firmware updates via CAN without bricks, a key serviceability requirement in vehicles. In such nodes the DSC typically reads sensors through its 12-bit ADCs, drives loads via PWM or GPIO, and reports diagnostics over CAN FD. Designers must budget the 32 KB Flash against application plus bootloader plus safety diagnostics before committing to this memory density.
Recomendado
Advanced Sensing and Signal Conditioning
The combination of three operational amplifiers, three comparators, and 12-bit ADCs lets the DSPIC33CK32MP502-E/2N condition and digitize sensor signals entirely on-chip. In industrial sensing nodes - pressure, current, and temperature acquisition - the op-amps amplify millivolt-level sensor outputs, the comparators provide threshold alarms without CPU intervention, and the ADCs feed DSP filtering routines (IIR/FIR via the DSP MAC instruction set) running at 100 MHz. LINbus and UART connectivity suit wired sensor networks, while the extended temperature range permits deployment in unconditioned environments. This integration path removes a discrete op-amp/ADC front end from the BOM, but designers should validate op-amp bandwidth and offset against their sensor impedance and accuracy targets using the family datasheet analog specifications.
Recomendado
High-Brightness LED Lighting and Electronic Ballasts
Digital control of LED drivers benefits from the DSPIC33CK32MP502-E/2N's High-Resolution PWM, which achieves the fine dimming resolution that fixed-resolution PWM cannot at high switching frequencies, eliminating visible low-brightness quantization artifacts. The 100 MIPS core implements constant-current regulation, power-factor correction in offline drivers, and fault protection via the on-chip comparators, whose sub-cycle response guards against LED open-circuit and short-circuit events. The -40C to +150C qualification suits enclosed luminaires and automotive lighting where ambient temperatures are extreme, and CAN FD enables addressable architectural and vehicle lighting networks. Compared with analog dimming controllers, this DSC accepts digital dimming protocols natively but demands firmware validation of EMC behavior under high dv/dt switching.
Recomendado
Industrial Control and PLC I/O Modules
For industrial automation I/O, the DSPIC33CK32MP502-E/2N combines deterministic 100 MHz control execution with SPI, I2C, and UART links to host controllers, functioning as a smart peripheral node handling high-rate tasks like encoder decoding, PWM actuation, and analog acquisition. The PTG offloads autonomous trigger sequences from the CPU, keeping the core free for communication protocol stacks and diagnostics. Its dual-partition Flash supports remote firmware reconfiguration over fieldbuses, an increasingly standard maintenance requirement in Industry 4.0 deployments. The -40C to +150C range covers cabinet-mounted and machine-mounted electronics exposed to heat soak. The 8 KB SRAM constrains protocol buffering, so designs with heavy CAN FD traffic should evaluate the higher-RAM dsPIC33CK MP5xx family members before finalizing the architecture.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33CK32MP502-E/2N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33CK32MP502-I/2N | DSPIC33CK64MP502-E/2N | DSPIC33CK32MC102T-I/2N | DSPIC33CH64MP202-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) EP | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33CK 16-bit, 100 MHz | dsPIC33CK 16-bit, 100 MHz | dsPIC33CK 16-bit, 100 MHz | dsPIC33CK 16-bit, 100 MHz | dsPIC33CH dual-core 16-bit, 100 MHz |
| Program Flash | 32 KB (dual-partition, ECC) | 32 KB (dual-partition, ECC) | 64 KB (dual-partition, ECC) | 32 KB (dual-partition, ECC) | 64 KB |
| Temperature Range | -40C to +150C (E grade) | -40C to +125C (I grade) | -40C to +150C (E grade) | -40C to +125C (I grade) | -40C to +125C (I grade) |
| AEC-Q100 Qualification | Qualified | Industrial grade | Qualified (E grade) | Industrial grade | Industrial grade |
| Connectivity | CAN FD, I2C, SPI, UART, IrDA, LIN | CAN FD, I2C, SPI, UART, IrDA, LIN | CAN FD, I2C, SPI, UART, IrDA, LIN | CAN FD, I2C, SPI, UART | CAN FD, I2C, SPI, UART |
Diferenciadores clave
- Extended -40C to +150C automotive range (frente a DSPIC33CK32MP502-I/2N)
- Integrated analog front end (3 op-amps + 3 comparators) (frente a DSPIC33CK32MC102T-I/2N)
- Upgradable Flash on the same PCB (frente a DSPIC33CK64MP502-E/2N)
Notas de diseño
The device operates from 3.0V to 3.6V; in digital power designs the same 3.3V rail must stay within tolerance even during PWM bursts. Decouple each VDD pin with a 100 nF ceramic placed within 2 mm of the pin, plus bulk 4.7-10 uF per rail. The 28-UQFN exposed pad must be soldered to a solid ground plane - it is the primary ground return for the fast switching edges of the High-Resolution PWM, and a floating EP shows up as erratic ADC readings and comparator chatter.
The E/2N extended grade is rated to +150C, so verify junction temperature, not just ambient: Estimated: with theta_JA typical of a 6x6 UQFN on a 2-layer board (order of 40-60 C/W per family data - confirm the exact figure in the manufacturer datasheet thermal table), a 100 mA core current at 3.3 V (~0.33 W internal dissipation) yields roughly a 15-25C rise. Reserve margin so worst-case TJ stays below the absolute maximum; if margin is thin, drop to the I/2N grade or add copper pour under the EP.
Do not treat 32 KB of dual-partition Flash as 32 KB of contiguous application space: live-update schemes split it into two panels, and a bootloader consumes part of that. Size firmware early; if it does not fit, move to the pin-compatible 64 KB DSPIC33CK64MP502-E/2N without a PCB respin. Also configure unused op-amp and comparator pins explicitly at reset - floating integrated analog pins on the MP502 can cause unexplained comparator interrupts during startup.
Información de cumplimiento
AEC-Q100 qualification and -40C to +150C extended temperature grade confirmed by distributor parametric data (datasheets.com: 'automotive aec-q100'). RoHS/REACH/lead-free status must be confirmed via Microchip certificate of conformance for the specific date code.
