DSPIC33CK32MC102T-I/2N - 16-Bit 100MHz DSC 32KB Flash | Microchip
MPN: DSPIC33CK32MC102T-I/2N β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33CK32MC102T-I/2N Overview
A Digital Signal Controller combines the computational capability of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33CK sits between general-purpose MCUs and dedicated digital signal processors, making it ideal for closed-loop control systems that demand fast math execution, deterministic interrupt latency, and specialized analog peripherals on a single chip.
Key features include operation from 3.0 V to 3.6 V, DC to 100 MIPS performance at -40C to +125C (DC to 70 MIPS up to +150C), Flash program memory with ECC and fault-injection testing, and 8 KB SRAM with Memory Built-In Self-Test (MBIST) - attributes that support functional safety (FuSa) designs. The integrated 3 op-amps and 1 comparator offload external analog components in sensing and motor-control signal chains.
Architecturally, the dsPIC33CK core is a modified Harvard, 16-bit DSP engine with DSP instruction support, 4 DMA channels, and high-resolution PWM peripherals. Automotive-qualified (AEC-Q100) and functional-safety support make it suitable for safety-oriented industrial designs as well.
Typical applications include sensorless and sensored motor control (BLDC, PMSM), digital power conversion (PFC, LLC), advanced sensing, touch interfaces, and automotive subsystems requiring AEC-Q100 qualification.
Design consideration: keep the supply within 3.0 V to 3.6 V and derate to 70 MIPS above +125C ambient; the UQFN exposed pad must be soldered to a solid ground pour for thermal and signal-integrity performance.
This page synthesizes distributor availability, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK32MC102T-I/2N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK32MC102T-I/2N (same form factor and footprint) β differing in Core, Operating Temperature, Package, ADC, Comparators.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DSPIC33CK32MC102T-E/2N
β Drop-Inπ Reference alternative (not in catalog)
DSPIC33CK64MC102T-I/2N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33CK32MC102-E/2N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33CK32MP102T-I/2N
β Drop-Inβ In Stock
$3.05 / Unit
View Datasheet βDSPIC33CK32MC102T-I/2N Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (up to 100 MIPS) |
| Program Memory Size | 32 KB Flash |
| RAM Size | 8 KB SRAM |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C (70 MIPS up to +150C) |
| Package | 28-UQFN (6x6 mm), HVQCCN |
| Mounting Type | Surface Mount |
| Number of Terminals | 28 |
| Op-Amps | 3 integrated op-amps |
| Comparators | 1 comparator |
| ADC | 12-bit high-speed ADC |
| DMA Channels | 4 |
| Timers | 3 |
| Serial Interfaces | 3 serial I/O channels |
| Flash ECC | Yes (with fault injection testing) |
| Memory BIST | Yes (MBIST on SRAM) |
| Qualification | AEC-Q100, Functional Safety (FuSa) |
| Program Memory Type | FLASH (24-bit width) |
DSPIC33CK32MC102T-I/2N 28-uqfn (6x6 mm), hvqccn Pin Configuration Guide
Pin configuration for DSPIC33CK32MC102T-I/2N (28-uqfn (6x6 mm), hvqccn package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK32MC102T-I/2N.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK32MC102T-I/2N is suitable for 6 applications: BLDC/PMSM Motor Control, Digital Power Conversion, Advanced Sensing Systems, Touch Sensing Interfaces, Automotive Subsystems, Industrial Automation & Control.
BLDC/PMSM Motor Control
The DSPIC33CK32MC102T-I/2N fits sensorless and sensored motor control because its 100 MHz dsPIC core executes field-oriented control (FOC) loops well beyond typical 10-20 kHz PWM rates, while the integrated 12-bit high-speed ADC samples phase currents with tight trigger-to-conversion latency. The 3 on-chip op-amps condition low-side shunt resistor signals directly, removing external amplifier stages and their offset/drift contributions. In a typical topology, the DSC generates complementary high-resolution PWM for a three-phase inverter, reads current and position feedback through the ADC and comparator peripherals, and runs the FOC inner loop in under one PWM period. The AEC-Q100 qualification and -40C to +125C rating permit deployment in automotive pumps, fans, and actuators. The 4 DMA channels keep ADC results moving to RAM without CPU intervention, preserving cycle headroom for observer algorithms.
Recommended
Digital Power Conversion
For digital power supplies such as PFC, LLC, and buck converter stages, the DSPIC33CK32MC102T-I/2N provides the deterministic control-loop timing that switched-mode converters demand. The 100 MIPS DSP core runs compensator math at switching frequencies of several hundred kHz, while the 12-bit high-speed ADC captures output voltage and current feedback synchronized to the PWM cycle. Integrated analog comparators can implement cycle-by-cycle current limiting in hardware, protecting the power stage within nanoseconds of an overcurrent event - faster than any software path. The /MP sibling variant (DSPIC33CK32MP102T-I/2N) offers enhanced PWM resolution on the same footprint when sub-nanosecond PWM edge control is required. Designers typically place this DSC between the feedback dividers and the gate drivers, closing voltage and current loops digitally and enabling firmware-configurable soft-start, fault handling, and telemetry.
Recommended
Advanced Sensing Systems
The DSPIC33CK32MC102T-I/2N suits advanced sensing nodes because it integrates the full analog front-end chain: 3 op-amps for signal conditioning, 1 comparator for threshold detection, and a 12-bit high-speed ADC for digitization. Sensor signals from pressure, current, or position transducers can be amplified on-chip, then sampled and processed by the 100 MIPS DSP core which supports DSP multiply-accumulate instructions for filtering (FIR/IIR) and FFT-based analysis. The 8 KB SRAM with MBIST and Flash ECC make results trustworthy in safety-relevant monitoring, while the -40C to +125C industrial range covers harsh environments. With 4 DMA channels, continuous ADC streaming into RAM proceeds without CPU load, leaving cycles for protocol handling over its 3 serial interfaces. Typical deployments include industrial condition-monitoring probes and automotive sensor modules requiring AEC-Q100 parts.
Recommended
Touch Sensing Interfaces
Microchip lists touch control among the primary use cases of the dsPIC33CK MC family, and the DSPIC33CK32MC102T-I/2N implements capacitive touch using its charge-transfer measurement scheme driven by the ADC and on-chip op-amps. The 100 MHz core executes the touch-sensing acquisition and decoding algorithms quickly enough to sustain multi-channel scanning with fast response times and robust water/noise rejection. Because the analog peripherals are integrated, external touch controllers are eliminated, reducing BOM cost in appliances, control panels, and automotive interior surfaces where the AEC-Q100 rating adds qualification value. Firmware typically uses Microchip's touch libraries under MPLAB Code Configurator, shortening development. Designers should allocate PCB guard electrodes and follow Microchip touch layout guidelines; the 28-UQFN 6x6 mm package's exposed pad provides a low-inductance ground reference that improves measurement stability in noisy environments.
Recommended
Automotive Subsystems
The DSPIC33CK32MC102T-I/2N is AEC-Q100 qualified and appears in DigiKey's automotive dsPIC33CK category, making it appropriate for automotive auxiliary systems such as pump and fan motor drivers, actuator control, LED lighting control, and sensor conditioning. The -40C to +125C operating range with up to 70 MIPS sustained at +150C gives margin for under-hood and near-engine placement, while Flash ECC with fault injection and SRAM MBIST support ISO 26262-oriented functional safety development under Microchip's FuSa program. The 3.0 V to 3.6 V supply integrates cleanly with automotive 3.3 V rails derived from load-dump-protected regulators. Firmware capitalizes on the 100 MIPS core and DMA-driven ADC for deterministic loop timing. Designers should confirm the specific AEC-Q100 temperature grade against their placement and consult Microchip's functional-safety documentation during system certification.
Recommended
Industrial Automation & Control
In factory automation, the DSPIC33CK32MC102T-I/2N serves as a compact real-time controller for actuator drives, robotics joint control, and process I/O modules. Its 100 MIPS 16-bit DSP core closes servo and current loops deterministically, while 3 serial I/O channels link to supervisors and sensors via UART/SPI/I2C networks. The industrial -40C to +125C rating and AEC-Q100 die-level quality provide robustness on electrically noisy factory floors, and the integrated op-amps plus 12-bit ADC condense analog front-ends for encoders and current sensors into the chip itself. The 32 KB Flash accommodates bootloader plus control firmware, with ECC protecting code integrity. Typical architecture places this DSC under a PLC or gateway, executing millisecond-level control cycles while streaming status over the serial links. DMA offload ensures ADC sampling jitter stays minimal despite communication activity.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK32MC102T-I/2N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK32MC102T-E/2N | DSPIC33CK64MC102T-I/2N | DSPIC33CK32MP102T-I/2N |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Flash Memory | 32 KB | 32 KB | 64 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB |
| Temperature Range | -40C to +125C (industrial /I) | Extended grade (/E) | -40C to +125C (industrial /I) | -40C to +125C (industrial /I) |
| Peripheral Focus | General motor control (MC): 3 op-amps, 1 comp, 12-bit ADC | Identical MC peripheral set | Identical MC peripheral set | Enhanced digital-power PWM (MP variant) |
| Qualification | AEC-Q100, FuSa | AEC-Q100, FuSa | AEC-Q100, FuSa | AEC-Q100, FuSa |
Key Differentiators
- Integrated 3 op-amps reduce external analog BOM (vs DSPIC33CK32MP102T-I/2N)
- Room-to-grow path without PCB change (vs DSPIC33CK64MC102T-I/2N)
- Extended temperature option on same die (vs DSPIC33CK32MC102T-E/2N)
Design Notes
Supply the DSPIC33CK32MC102T-I/2N from a regulated 3.0 V to 3.6 V rail; 3.3 V nominal is standard. Decouple each VDD pin with 0.1 uF ceramic capacitors placed within 2 mm of the pin, plus one bulk 10 uF capacitor near the device. During PWM-heavy motor-control operation, ADC-triggered core current steps create supply ripple that degrades ADC accuracy if decoupling is poor. Follow Microchip's dsPIC33C hardware design guidelines for VCAP pin capacitance, which stabilizes the internal regulator - omitting or using the wrong VCAP capacitor value is a common cause of erratic reset behavior.
The 28-UQFN 6x6 mm package has an exposed thermal pad that must be soldered to a grounded copper pour with an array of thermal vias. Beyond heat dissipation, this pad is the main ground return and its absence raises ground impedance, worsening ADC noise and EMI. Use Microchip-recommended UQFN land-pattern stencil apertures (typically 50-60% coverage) to avoid solder voiding under the pad. Keep the high-speed ADC input traces short, guard them with ground, and route them away from PWM output traces to preserve effective ADC resolution in motor-control layouts.
Two frequent mistakes: (1) exceeding 100 MIPS above +125C ambient - the datasheet derates to DC to 70 MIPS in the +125C to +150C range, so designs placed in hot enclosures must budget clock speed accordingly; (2) assuming cross-variant pin compatibility within the dsPIC33CK family - MC and MP variants share the 28-UQFN footprint but multiplex different peripherals onto shared pins, so verify the pinout table in the Microchip datasheet before reusing a layout across DSPIC33CK32MC102 and DSPIC33CK32MP102 variants.
Compliance Information
DigiKey and Microchip listings classify the part as 'dsPIC Automotive, AEC-Q100, Functional Safety (FuSa)'. RoHS/REACH/lead-free statuses were not stated in the retrieved data and are marked unknown.
