DSPIC33CK64MP502-E/2N - 100MHz 16-bit DSC CAN-FD | Microchip
MPN: DSPIC33CK64MP502-E/2N ✓ Active| Qty | Unit Price | Extended |
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DSPIC33CK64MP502-E/2N Overview
A digital signal controller combines the compute power of a digital signal processor (DSP) with the peripheral integration and control-oriented architecture of a microcontroller (MCU). The dsPIC33CK family sits in the broader hierarchy of digital signal processors within embedded processing ICs, using a modified Harvard architecture with a single-core DSP engine that executes up to 100 MIPS from a 3.0V to 3.6V supply.
Key features include the 100 MHz dsPIC DSC core with DSP instruction extensions, dual-panel program Flash supporting live update firmware switching, CAN Flexible Data (CAN FD) networking for automotive and industrial buses, on-chip operational amplifiers that reduce external analog BOM, and 12-bit ADCs feeding high-resolution PWM modules for digital power conversion. The -E/2N suffix denotes the extended temperature range (-40C to +150C) in the 28-pin UQFN package, and the device is positioned as a Functional Safety (FuSa) capable part.
Architecturally, the modified Harvard core separates program and data buses for simultaneous instruction fetch and data access, while hardware DSP multiply-accumulate operations accelerate control-loop mathematics. The dual-partition Flash with ECC and live update enables safe field firmware updates in digital power products that cannot tolerate downtime.
Typical applications include digital power supplies (totem-pole PFC, LLC converters), brushless DC and PMSM motor control, advanced sensing and control nodes, and CAN FD-connected automotive or industrial subsystems where the 150C rating and integrated analog reduce system cost.
Design consideration: the 3.0V to 3.6V supply window means the 3.3V rail must be well regulated; decouple each VDD pin with 0.1uF ceramics close to the package and follow Microchip layout guidance for the high-resolution PWM outputs to minimize switching-node coupling into the ADC.
This page synthesizes distributor listings, drop-in family alternatives, and application-specific design context not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK64MP502-E/2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK64MP502-E/2N (same form factor and footprint) — differing in Package, ADC, Core, Architecture, Data SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK64MP502-I/2N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33CK64MP503-I/2N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK64MP505-I/2N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK32MP502-I/2N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.71 / Unit
View Datasheet →DSPIC33CK64MC102T-I/2N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK64MP502-E/2N Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC core |
| Core Speed | 100 MHz (up to 100 MIPS) |
| Program Memory | 64 KB (64K x 8) Flash, dual partition with ECC and live update |
| Data SRAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +150C |
| CAN Interface | CAN Flexible Data (CAN FD) |
| ADC | 12-bit ADCs |
| Analog Front End | Integrated op-amps |
| PWM | High-resolution PWM |
| Package | 28-UQFN (6x6 mm) |
| Mounting Type | Surface Mount |
| Architecture | Modified Harvard, single-core with DSP engine |
| Functional Safety | FuSa (Functional Safety) capable device |
| Product Family | dsPIC33CK64MP502 (28/36/48/64/80-pin 16-bit DSC family) |
DSPIC33CK64MP502-E/2N 28-uqfn (6x6 mm) Pin Configuration Guide
Pin configuration for DSPIC33CK64MP502-E/2N (28-uqfn (6x6 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK64MP502-E/2N.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK64MP502-E/2N is suitable for 6 applications: Digital Power Supplies, BLDC and PMSM Motor Control, Automotive CAN FD Nodes, Advanced Sensing and Control, Wireless-Connected Power and IoT Gateways, Embedded Control Replacement for Legacy PIC Designs.
Digital Power Supplies
The DSPIC33CK64MP502-E/2N fits digitally controlled AC-DC and DC-DC power supplies because its 100 MHz core closes voltage and current loops fast enough for totem-pole PFC and LLC topologies, while high-resolution PWM delivers sub-nanosecond-class duty and dead-time adjustment that reduces switching losses and broadens the stable operating range. The 12-bit ADCs sample output voltage, input voltage, and inductor or shunt current each switching cycle, and the integrated op-amps can amplify current-shunt signals on-chip, removing external amplifier ICs from the feedback path. In this role the DSC sits between the sensing dividers and the gate drivers, executing control laws and protection routines (overcurrent, overvoltage, burst mode). The dual-partition Flash with ECC and live update lets manufacturers field-update firmware without dropping output, and the 150C E-grade rating tolerates hot power-supply ambient conditions.
Recommended
BLDC and PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK64MP502-E/2N provides the compute and analog resources field-oriented control demands: the 100 MHz dsPIC33CK core executes Clarke/Park transforms, PI current loops, and speed observers within one PWM period, while the high-resolution PWM module produces fine duty steps and precise dead-time insertion for low torque ripple and quiet operation. The 12-bit ADCs synchronize conversions to the PWM center to sample phase currents at low-noise instants, and on-chip op-amps amplify low-value shunt signals without external parts. The CAN FD interface connects the drive to industrial or automotive networks for command and diagnostics. The extended -40C to +150C rating suits motor-mounted electronics exposed to winding heat, and dual-panel Flash allows firmware updates to deployed drives in the field.
Recommended
Automotive CAN FD Nodes
The DSPIC33CK64MP502-E/2N serves as an intelligent CAN FD node in automotive and heavy-industrial systems where its -40C to +150C operating range and Functional Safety (FuSa) positioning matter. The integrated CAN FD controller handles the larger payloads and faster arbitration/data phases of the CAN FD protocol, offloading the 100 MHz core to run application logic, sensor fusion, or local control loops simultaneously. The 12-bit ADCs and op-amps acquire analog sensor inputs (pressure, temperature, position) locally, while high-resolution PWM can drive actuators or status indicators. Microchip lists the family explicitly for automotive-focused digital control applications. A external CAN FD transceiver such as the MCP2562FD bridges the controller to the physical bus, and the dual-partition Flash with ECC supports secure OTA-style firmware updates on deployed vehicles.
Recommended
Advanced Sensing and Control
In advanced sensing and control systems, the DSPIC33CK64MP502-E/2N combines local signal conditioning with networked intelligence. Its 12-bit ADCs digitize sensor channels, and the integrated op-amps provide gain stages for bridge or shunt sensors directly on-chip, reducing component count versus a discrete amplifier-plus-MCU approach. The 100 MHz DSP core applies digital filtering, FFT, or calibration mathematics to raw samples, and the 8 KB SRAM holds buffering windows for burst-acquisition workflows. Results are streamed over CAN FD or UART/SPI/I2C to a host controller. Microchip positions the dsPIC33CK family specifically for advanced sensing and control applications. The extended temperature range and FuSa capability make the part credible in industrial instrumentation, battery management sensing front-ends, and condition-monitoring nodes where accuracy must be maintained across -40C to +150C ambient swings.
Recommended
Wireless-Connected Power and IoT Gateways
The DSPIC33CK64MP502-E/2N works as the real-time control element in smart power products - server-fan controllers, smart LED drivers, battery chargers, and IoT power gateways - where deterministic PWM control must coexist with network connectivity. The DSC handles the fast control loops with its 100 MHz core and high-resolution PWM, while a companion wireless module or Ethernet controller on SPI/UART provides cloud or network communication. The 12-bit ADCs monitor bus voltage, current, and temperature, and the op-amps condition shunt signals without extra ICs. CAN FD links the node to vehicle or industrial backbones. Per Microchip family positioning, high- is one of the family's target segments. The 150C E-grade and dual-panel live-update Flash are practical advantages in enclosed, thermally stressed smart-power products requiring remote firmware upgrades.
Recommended
Embedded Control Replacement for Legacy PIC Designs
The DSPIC33CK64MP502-E/2N is a strong upgrade path for legacy 8-bit PIC or dsPIC30F designs that have outgrown their compute or peripheral set. It retains the PIC-style development ecosystem - MPLAB X IDE, XC16 compiler, and Curiosity/debug tooling - while multiplying throughput (100 MIPS vs tens of MIPS on dsPIC30F parts such as the DSPIC30F6014A) and adding CAN FD, op-amps, high-resolution PWM, and ECC-protected dual-partition Flash. Because the 28-UQFN (6x6) footprint is compact, it also suits size-constrained board respins. The 3.0V to 3.6V operating window matches standard 3.3V rails used in existing systems. Teams migrating from DSPIC30F6015 or DSPIC30F6014AT designs can reuse much of their control firmware structure while gaining DSP-class MAC throughput and functional-safety-oriented memory features.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK64MP502-E/2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK64MP502-I/2N | DSPIC33CK64MP503-I/2N | DSPIC33CK32MP502-I/2N | DSPIC33CK64MC102T-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6) | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Program Flash | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +150C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Key Differentiators
- Extended temperature to +150C (vs DSPIC33CK64MP502-I/2N)
- Integrated op-amps reduce analog BOM (vs DSPIC33CK64MC102T-I/2N)
- Live-update dual-partition Flash with ECC (vs DSPIC33CK32MP502-I/2N)
Design Notes
The dsPIC33CK64MP502 operates from a narrow 3.0V to 3.6V supply. Regulate the rail with a low-noise LDO or buck rated for the board's ambient (the E-grade part tolerates up to +150C junction environment, so the regulator must be selected to match). Place 0.1uF ceramic decoupling capacitors at every VDD pin within 2 mm of the UQFN-28 pads, plus one bulk 4.7uF to 10uF capacitor near the package. Follow the Microchip dsPIC33CK power-disaggregated supply guidance in the family datasheet and hardware design checklist appnotes.
The 28-UQFN (6x6) has a central exposed thermal pad that must be soldered to a grounded copper pour - it is both the primary thermal path and the VSS return. Use an array of thermal vias (typical 4-6) under the pad to inner ground planes. For digital power layouts, keep the high-resolution PWM traces short and away from ADC input routing; the fine PWM edge resolution means even small ground-bounce artifacts show up in sampled current loops. Separate analog ground returns for the op-amp/ADC pins from power-switching returns.
Three common mistakes when migrating to the dsPIC33CK family: (1) assuming peripheral pin select covers all pins - analog-only functions (ADC inputs, op-amp terminals, comparators) have fixed pins, so verify them in the datasheet pin tables before layout release; (2) forgetting that 64 KB dual-partition Flash effectively splits the code space between two panels when live update is used - budget firmware accordingly; (3) using the I-grade part in designs specified to +150C - only the E-suffix variant such as this DSPIC33CK64MP502-E/2N supports the extended range.
Compliance Information
Compliance data was not present in the provided verified web data; consult the Microchip product page environmental datasheet for RoHS/REACH status.