EP1AGX20CF780I6N - Arria GX FPGA 20K LE 780-FBGA | Intel
N.º de pieza: EP1AGX20CF780I6N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $407.52 | $407,52 |
| 10 | $380 | $3.800,00 |
| 100 | $345 | $34.500,00 |
| 250 | $318 | $79.500,00 |
| 500 | $295 | $147.500,00 |
EP1AGX20CF780I6N Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O behaviour are configured by the user after manufacture via a hardware description language. FPGAs sit at the top of the programmable logic hierarchy - below ASICs (which are application-specific and fixed) but above CPLDs in density - and are widely used for parallel data processing, high-speed serial interfacing, and hardware-accelerated DSP. The Arria GX family specifically targets mid-range applications requiring integrated transceivers for protocols such as PCIe, Gigabit Ethernet, Serial RapidIO, and SDI.
Key features include 21,580 logic elements (often cited as 21,580 cells/CLBs), 4 embedded transceivers operating up to 3.125 Gbps, embedded multiplier blocks for DSP, and configurable I/O supporting multiple single-ended and differential standards. The device includes dedicated PLL clock management blocks and on-chip memory blocks distributed across the fabric, enabling deterministic data-path implementation.
Architecturally, the EP1AGX20CF780I6N combines a LUT-based logic fabric with hard IP for transceivers and memory, a hybrid that delivers higher DSP throughput per logic element than pure SRAM-based competitors of the same era. The Arria GX architecture is optimised for serial connectivity rather than raw logic density, making it well-suited for bridging parallel processing to high-speed serial links.
Typical applications include telecommunications line cards, video broadcast equipment, industrial imaging and machine vision, military radar signal processing, and wireless base-station baseband preprocessing. The 780-FBGA package supports high signal count and controlled-impedance routing required for multi-gigabit serial links.
When designing with this part, ensure that PCB layout meets the transceiver channel requirements including controlled differential impedance, length matching, and AC-coupling capacitor placement. The industrial temperature grade (-40C to +100C) makes the device suitable for uncontrolled thermal environments.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and selecting the Arria GX family.
Alternativas directas para EP1AGX20CF780I6N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1AGX20CF780I6N (mismo factor de forma y huella) — difiere en Speed Grade, Package, Operating Temperature, Family, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1AGX20CF780C6N
✅ Sustitución directa✓ En stock
$38.95 / unidad
Ver hoja de datos →EP1AGX20CF780I6
✅ Sustitución directa✓ En stock
$195 / unidad
Ver hoja de datos →EP1AGX20CF780C6
✅ Sustitución directa✓ En stock
$175.4 / unidad
Ver hoja de datos →EP1AGX20CF780C5N
✅ Sustitución directa✓ En stock
$305 / unidad
Ver hoja de datos →EP1AGX35CF780I6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$278.75 / unidad
Ver hoja de datos →EP1AGX20CF780I6N Valores máximos y características eléctricas
| Family | Arria GX |
| Logic Elements / Cells | 21,580 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Transceivers | 4 channels, up to 3.125 Gbps |
| Maximum User I/O | 341 |
| Encapsulado | 780-pin FC-FBGA |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Lead Free | Yes |
| Tipo de montaje | Surface Mount (BGA) |
| Configuration | Field-Programmable Gate Array |
| Estado RoHS | Compliant |
Guía de configuración de pines de EP1AGX20CF780I6N 29 x 29 mm
Configuración de pines para EP1AGX20CF780I6N (encapsulado 29 x 29 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1AGX20CF780I6N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1AGX20CF780I6N es adecuado para 6 aplicacións: Telecommunications Line Cards, Video Broadcast Equipment, Industrial Imaging and Machine Vision, Wireless Base Station Baseband, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP1AGX20CF780I6N is well-suited for telecom line card designs requiring integrated multi-gigabit serial connectivity. Its 4 transceivers at 3.125 Gbps natively support PCIe Gen1, Gigabit Ethernet, and Serial RapidIO protocols commonly found in ATCA/AMC backplanes. The 21,580 logic elements provide sufficient capacity for packet classification, traffic shaping, and SERDES bridging functions, while the 780-FBGA package supports the high signal count required for multi-channel baseband interfaces. Designers benefit from hard PCIe IP cores that simplify protocol compliance verification.
Recomendado
Video Broadcast Equipment
Broadcast video routers, format converters, and SDI distribution amplifiers benefit from the EP1AGX20CF780I6N's SDI-capable transceivers and DSP blocks. The integrated multiplier blocks accelerate colour-space conversion and scaling operations typical in broadcast processing pipelines. The 1.2 V core and industrial temperature range enable deployment in studio equipment racks with ambient temperatures exceeding commercial spec. Combined with external DDR2 memory controllers, the device handles real-time uncompressed SDI routing across multiple feeds.
Recomendado
Industrial Imaging and Machine Vision
Machine vision systems use the EP1AGX20CF780I6N to aggregate multiple Camera Link or CoaXPress channels and preprocess frames before forwarding to a host processor. The 341 user I/O pins support wide parallel sensor interfaces (LVDS, sub-LVDS, SLVS), and the transceiver channels enable CoaXPress uplink to industrial PCs. The Arria GX fabric delivers deterministic latency required for synchronised multi-camera capture in automated optical inspection (AOI) stations, while the industrial temperature grade supports factory floor deployment.
Recomendado
Wireless Base Station Baseband
Wireless base-station baseband cards leverage the EP1AGX20CF780I6N for CPRI/OBSAI fronthaul serial links (1.2288 Gbps, 2.4576 Gbps, 3.072 Gbps) connecting the radio unit to the baseband unit. The hard transceivers and on-chip DSP blocks handle channel coding, rate matching, and IQ sample processing for LTE and WiMAX. The device's industrial temperature grade and lead-free packaging support outdoor cabinet deployment and RoHS compliance for carrier-grade equipment.
Recomendado
Military and Aerospace Signal Processing
Defense applications such as radar front-end preprocessing, electronic warfare receivers, and secure communications use the EP1AGX20CF780I6N for high-throughput DSP and cryptographic offload. The 4 integrated transceivers handle multi-channel IF digitisation links to ADC/DAC converters, while the logic fabric implements FFT, beamforming, and encryption algorithms in parallel. Industrial temperature range supports MIL-STD-810 environment requirements when paired with conformal coating and ruggedised PCB design.
Recomendado
Test and Measurement Instrumentation
High-end test instruments (BERT, protocol analysers, oscilloscopes with serial decoding) use the EP1AGX20CF780I6N to implement pattern generation, error injection, and protocol-aware triggering. The Arria GX transceivers drive and receive high-speed serial test signals (PCIe, USB 3.0, SATA, SAS) up to 3.125 Gbps, while the logic fabric implements custom protocol state machines. The 780-FBGA package supports the high pin density required for parallel acquisition memory interfaces in mid-range instruments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1AGX20CF780I6N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1AGX20CF780C6N | EP1AGX20CF780I6 | EP1AGX20CF780C6 | EP1AGX20CF780C5N | EP1AGX35CF780I6N |
|---|---|---|---|---|---|---|
| Package | 780-pin FC-FBGA (29x29 mm) | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 21,580 | 21,580 - same | 21,580 - same | 21,580 - same | 21,580 - same | ~33,000 |
| Transceivers | 4 channels, 3.125 Gbps | 4 channels, 3.125 Gbps - same | 4 channels, 3.125 Gbps - same | 4 channels, 3.125 Gbps - same | 4 channels, 3.125 Gbps - same | 8 channels, 3.125 Gbps |
| User I/O | 341 | 341 - same | 341 - same | 341 - same | 341 - same | 341 - same |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial - same |
| Speed Grade | 6 | 6 - same | 6 - same | 6 - same | 5 (slower) | 6 - same |
| Lead Free (N suffix) | Yes | Yes | No (non-N suffix) | No (non-N suffix) | Yes | Yes |
| Core Voltage | 1.2 V | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same |
Diferenciadores clave
- Industrial temperature grade with lead-free finish (frente a EP1AGX20CF780C6N)
- Drop-in compatible across all temperature and speed grades (frente a EP1AGX35CF780I6N)
- Speed grade 6 offers highest transceiver performance in family (frente a EP1AGX20CF780C5N)
Notas de diseño
The 780-FBGA package with 1.0 mm pitch demands a minimum of 6 PCB layers with controlled impedance for transceiver channels. Use a stack-up with dedicated ground planes adjacent to high-speed signal layers, and place AC-coupling capacitors (0.01 uF to 0.1 uF) within 1 cm of each transceiver differential pair. Microvia or via-in-pad technology is strongly recommended for BGA break-out routing to maintain signal integrity on multi-gigabit links.
Estimated: With 21,580 LE at full utilisation and 4 transceivers at 3.125 Gbps, the EP1AGX20CF780I6N dissipates approximately 3-5 W typical. Industrial-grade FC-FBGA-780 packages rely on PCB copper pour for cooling - allocate at least 4 square inches of unbroken inner-plane copper connected to the package thermal balls. For sealed enclosures, derate maximum ambient by 10C to account for reduced convective cooling.
The 'N' suffix indicates lead-free (Pb-free) finish; using the non-N variant in RoHS-compliant designs is a common compliance violation. Verify the exact ordering code matches your BOM requirement before PCB assembly. Additionally, the Arria GX family is in NNRD status - confirm supply availability with the distributor before committing to new production runs.
Place configuration EEPROM (EPCS16 or compatible) within 5 cm of the FPGA DATA, DCLK, nCS, and ASDO pins to ensure reliable AS configuration mode boot. Decouple each transceiver supply pin (VCCRT, VCCT) with 0.1 uF and 10 uF capacitors placed as close as physically possible to the BGA balls. Avoid routing any high-speed signals across BGA break-out vias to minimise crosstalk.
Información de cumplimiento
Lead-free per Altera/Intel product page (N suffix). RoHS compliant per FindIC listing. AEC-Q100 not applicable (FPGA is not an automotive-qualified discrete). REACH, halogen-free, and conflict minerals compliance not explicitly stated in verified web data.
