Intel

EP1C6F256I7N - Cyclone FPGA, 5980 LE, 256-FBGA | Intel

N.º de pieza: EP1C6F256I7N ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
1.5 V (1.425 V to 1.575 V) Vdss 256-BGA (FBGA, 17 x 17 mm, 1.0 mm pitch) Package 250 MHz Speed
Desde $27.94 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-06
Precios por volumen
Cant. Precio unitario Total
1 $41.87 $41,87
10 $39.42 $394,20
100 $35.18 $3.518,00
500 $31.65 $15.825,00
1.000 $27.94 $27.940,00
ℹ️ Todos los precios están en USD

EP1C6F256I7N Descripción general

The Intel (formerly Altera) EP1C6F256I7N is a Cyclone-family Field Programmable Gate Array (FPGA) integrating 5,980 logic elements, 92,160 bits of embedded RAM, and 185 user I/Os in a 256-ball FineLine BGA package measuring 17 x 17 mm with 1.0 mm pitch. Built on a 130 nm CMOS process, the device operates from a 1.5 V core supply (1.425 V to 1.575 V) and supports commercial-to-industrial temperature grades per the I7N speed/temperature suffix. Maximum internal operating frequency is specified up to 250 MHz with PLL support for clock multiplication and phase shifting.

What is an FPGA? A Field Programmable Gate Array is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, PLLs, and I/O serializers. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and PALs, and provide a hardware-parallel alternative to microcontrollers and DSPs for high-throughput, low-latency digital signal processing. The Cyclone family specifically targets cost-sensitive, high-volume applications by trimming unused features of Altera's Stratix line while retaining the Quartus II design-tool ecosystem.

Key features include two embedded PLLs, up to 20 global clock networks, dedicated DDR SDRAM interface support, 2 True-LVDS differential I/O pairs, and a passive serial configuration interface that loads bitstreams from low-cost EPCS configuration flash. The 1.5 V core and 3.3 V/2.5 V/1.8 V multi-voltage I/O banks are supplied through independent VCCINT, VCCIO, and VCCA pins, simplifying mixed-voltage board designs. The -I7 speed grade specifies a -40 C to +100 C industrial junction operating range.

The Cyclone I architecture uses 4-input look-up tables (LUTs) arranged in Logic Array Blocks (LABs) of 10 LUTs each, with embedded M4K RAM blocks (4 Kbit each, true dual-port) and 18 x 18 hardware multipliers distributed across the fabric. The LE-to-RAM ratio makes the EP1C6 well-suited for glue-logic replacement, custom bus bridges, motor-control state machines, and low-channel-count video processing.

Typical applications include industrial motor control, factory automation I/O expansion, low-density video capture/display bridging, medical instrumentation front-ends, and legacy parallel-bus-to-GPI/Ethernet bridging. The 185 user I/Os are sufficient for 32-bit parallel camera interfaces, RGB888 LCD panels, or multi-bank UART/SPI expansion. The wide operating temperature range also makes the device a popular choice for automotive interior modules and outdoor signage controllers.

When designing with the EP1C6F256I7N, pay particular attention to the multi-rail decoupling scheme: a minimum of one 100 uF bulk plus 0.1 uF + 1 nF ceramics per VCCINT/VCCIO pin pair is recommended. The exposed die paddle of the FBGA-256 package must be soldered to a thermal pad with adequate vias for heat extraction, especially at sustained toggle rates above 100 MHz on more than 50 percent of the I/O.

This page synthesizes distributor pricing, drop-in same-package alternatives within the Cyclone family, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers and procurement teams make faster, more confident sourcing decisions.

Alternativas directas para EP1C6F256I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EP1C6F256I7N (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Process Technology, Speed Grade, Family.

Intel
Operating Temperature: -40°C to +100°C (industrial)
Package: 256-BGA FineLine
Process Technology: 0.13 μm SRAM-based
Comparar con EP1C6F256I7N →
Altera
Operating Temperature: 0C to +85C (commercial)
Package: 256-pin FineLine BGA (FBGA-256)
Process Technology: 130 nm SRAM
Comparar con EP1C6F256I7N →
Altera
Operating Temperature: -40 °C to +85 °C (Industrial)
Package: 256-ball FBGA (FineLine BGA), 1.00 mm pitch
Process Technology: 0.13 µm SRAM CMOS
Comparar con EP1C6F256I7N →
Altera
Operating Temperature: -40 °C to +85 °C (commercial)
Package: 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch
Process Technology: 0.13 µm SRAM
Comparar con EP1C6F256I7N →
Intel
Operating Temperature: 0 °C to 85 °C (commercial)
Package: 256-ball FineLine BGA (FBGA)
Process Technology: 0.13 µm SRAM
Comparar con EP1C6F256I7N →
Altera
Operating Temperature: 0 °C to +85 °C (commercial, N suffix indicates lead-free)
Package: 256-ball FineLine BGA (FBGA)
Process Technology: 0.13 µm SRAM
Comparar con EP1C6F256I7N →
Intel
Operating Temperature: 0C to +85C (commercial)
Process Technology: 0.13 µm SRAM, all-layer copper
Speed Grade: -7 (C7)
Comparar con EP1C6F256I7N →
Intel
Operating Temperature: 0 °C to +85 °C (Commercial)
Package: 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch
Speed Grade: 8
Comparar con EP1C6F256I7N →
Intel
Operating Temperature: -40C to +100C (industrial)
Package: 256-ball FBGA (F256)
Process Technology: 130 nm
Comparar con EP1C6F256I7N →
Intel
Operating Temperature: -40C to +100C (Industrial)
Package: 256-ball FineLine BGA (FBGA-256)
Process Technology: 0.13 um SRAM
Comparar con EP1C6F256I7N →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EP1C6F256I7

✅ Sustitución directa
Intel
📦 FBGA-256
Cyclone · 5,980 · 598 · 92,160 · 20 · 2 · 185 · 130 nm

✓ En stock

$23.8 / unidad

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EP1C6F256C7N

✅ Sustitución directa
Intel
📦 FBGA-256
Cyclone · Intel (formerly Altera) · 5,980 · 92,160 · 185 · 2

✓ En stock

$18.2 / unidad

Ver hoja de datos →

EP1C6F25617N

✅ Sustitución directa
Altera
📦 FBGA-256
Cyclone (Cyclone I) · 5,980 · 92,160 · 13 · 20 · 2 · 185 · 8

✓ En stock

$9.2 / unidad

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EP1C6F256C8N

✅ Sustitución directa
Intel
📦 FBGA-256
Cyclone · Cyclone I · 5,980 · 92,160 · 185 · 2 · 1.5 V · 0 °C to +85 °C (Commercial)

✓ En stock

$21.4 / unidad

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EP1C12F256I7N

✅ Sustitución directa
Intel
📦 FBGA-256
Cyclone (EP1C12) · 12,060 · 239,616 · 52 (128 x 36 bits each) · 185 · 2 · 256-BGA FineLine · -40°C to +100°C (industrial)

✓ En stock

$47.85 / unidad

Ver hoja de datos →

EP1C6F256I7N Valores máximos y características eléctricas

Family Cyclone
Logic Elements (LE) 5,980
Logic Array Blocks (LAB) 598
Embedded RAM Bits 92,160 (90 Kbit M4K blocks)
User I/Os 185
Process Technology 130 nm CMOS
Core Voltage (VCCINT) 1.5 V (1.425 V to 1.575 V)
Maximum Operating Frequency 250 MHz
PLLs 2
Global Clock Networks Up to 20
Differential I/O Pairs (LVDS) 2 True-LVDS
Hardware Multipliers (18x18) 20
Encapsulado 256-BGA (FBGA, 17 x 17 mm, 1.0 mm pitch)
Temperatura de funcionamiento -40 C to +100 C (industrial)
Tipo de montaje Surface Mount
Estado RoHS Compliant (Pb-free)
Configuration Interface Passive Serial (EPCS flash)

Guía de configuración de pines de EP1C6F256I7N 256-bga (fbga, 17 x 17 mm, 1.0 mm pitch)

Configuración de pines para EP1C6F256I7N (encapsulado 256-bga (fbga, 17 x 17 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 256-bga (fbga, 17 x 17 mm, 1.0 mm pitch) para EP1C6F256I7N

No hay datos detallados de patillaje disponibles para EP1C6F256I7N.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

EP1C6F256I7N es adecuado para 6 aplicacións: Industrial Motor Control, Video Bridge / LCD Controller, Legacy Bus-to-Ethernet Bridge, Medical Instrumentation Front-End, Automotive Interior Electronics, Test & Measurement Instrumentation.

🏭

Industrial Motor Control

The EP1C6F256I7N is well suited to industrial motor-control applications where deterministic hardware parallelism outperforms microcontroller-based solutions. With 5,980 logic elements, 20 dedicated 18 x 18 multipliers, and 2 PLLs, the fabric can simultaneously execute field-oriented control (FOC) loops, SVPWM generation, and encoder decoding at switching frequencies above 50 kHz. The 185 user I/Os accommodate multi-axis encoder inputs, gate-driver outputs, and isolated communication interfaces. The -40 C to +100 C industrial temperature grade ensures operation in cabinet-enclosed or outdoor drive environments. The device's passive-serial configuration from low-cost EPCS flash also enables fast factory programming without external boot logic.

📺

Video Bridge / LCD Controller

The EP1C6F256I7N serves as a low-cost video format converter or LCD timing controller in industrial display products. The 185 available I/Os support 24-bit parallel RGB interfaces plus control signals for TFT panels up to SVGA resolution. The 92,160 embedded M4K RAM bits provide line buffers sufficient for color-space conversion and partial frame storage without external memory. Hardware multipliers accelerate image scaling, gamma correction, and chroma resampling. Designers appreciate the integrated True-LVDS outputs for direct LVDS panel drive, eliminating external serializer ICs and reducing BOM cost in panel-integrated designs.

🌐

Legacy Bus-to-Ethernet Bridge

Industrial retrofitting projects commonly require bridging parallel buses (ISA, PC/104, VME, or proprietary backplanes) to modern Ethernet or serial links. The EP1C6F256I7N delivers enough I/O density for 16-bit or 32-bit parallel bus capture plus MAC-side connectivity, while its 130 nm process and 250 MHz fabric support 100 Mbit Ethernet MAC implementations in soft logic. The two PLLs enable independent clocking of the legacy bus and Ethernet PHY domains, simplifying multi-rate bridging. The industrial temperature grade and rugged FBGA-256 package meet factory-floor reliability requirements.

💊

Medical Instrumentation Front-End

Patient-monitoring and laboratory-instrument designs leverage the EP1C6F256I7N to preprocess analog-front-end data before handing off to DSPs or microcontrollers. The 20 hardware 18 x 18 multipliers and high I/O count enable parallel multi-channel digital filtering (FIR/IIR), QRS detection in ECG, or pulse-oximetry envelope extraction at low latency. The 92,160 embedded RAM bits hold filter coefficients and circular sample buffers. The industrial temperature range accommodates clinical-cart and bedside-monitor environments, while the FBGA-256 footprint's small 17 x 17 mm outline supports compact PCB layouts.

🚗

Automotive Interior Electronics

Inside automotive cabins, the EP1C6F256I7N serves as a flexible gateway between infotainment clusters, head-up displays, and body-control modules. Its industrial temperature grade handles the elevated thermal environment of dashboard-mounted enclosures, while the 185 I/Os accommodate multi-protocol bridging (CAN, LIN, SPI, I2C, UART) and LVDS display links. The embedded multipliers accelerate audio DSP for active-noise-cancellation or hands-free echo suppression. Note that EP1C6F256I7N is not AEC-Q100 qualified; for safety-critical under-hood or ADAS applications use AEC-Q100 parts such as the Cyclone IV EP4CE6F17I7N or specific AEC-Q100 automotive-grade FPGA families.

🔧

Test & Measurement Instrumentation

Bench-top and modular test equipment benefits from the EP1C6F256I7N's parallel I/O bandwidth and reconfigurable logic. The fabric can implement custom protocol decoders, parallel-pattern generators, mixed-signal capture timing engines, and high-speed glue logic between ADCs/DACs and a host processor. The two PLLs provide independent clock domains for sample-rate generation and USB/Ethernet communication interfaces. The industrial temperature grade and FBGA-256 package meet laboratory and field-test deployment requirements, while Quartus II compatibility allows design reuse across the Cyclone I, II, and IV generations.

Resumen de productos recomendados

EP1C6F256I7N Intel Se usa en: Industrial Motor Control, Video Bridge / LCD Controller, Legacy Bus-to-Ethernet Bridge, Medical Instrumentation Front-End, Automotive Interior Electronics, Test & Measurement Instrumentation EPCS4SI8N Configuration flash memory Se usa en: Industrial Motor Control, Medical Instrumentation Front-End, Automotive Interior Electronics IR2104 Half-bridge gate driver Se usa en: Industrial Motor Control EPCS16SI8N Altera Se usa en: Video Bridge / LCD Controller EP1C3T100C8N Intel Se usa en: Video Bridge / LCD Controller EP1C4F324I7N Intel Se usa en: Legacy Bus-to-Ethernet Bridge, Test & Measurement Instrumentation DP83848I 10/100 Ethernet PHY Se usa en: Legacy Bus-to-Ethernet Bridge ADS1258 24-bit low-noise ADC Se usa en: Medical Instrumentation Front-End TJA1042 NXP Semiconductors Se usa en: Automotive Interior Electronics ADS54J60 High-speed ADC Se usa en: Test & Measurement Instrumentation
What is the operating voltage of EP1C6F256I7N?
The EP1C6F256I7N core supply (VCCINT) operates from 1.425 V to 1.575 V, with a nominal value of 1.5 V. I/O banks (VCCIO) support 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails independently. According to the Cyclone device handbook, VCCA_PLL must be held at 2.5 V regardless of VCCIO setting. Decoupling requires 100 uF bulk plus 0.1 uF and 1 nF ceramics per supply pin pair.
How many logic elements does EP1C6F256I7N have?
The EP1C6F256I7N contains 5,980 logic elements organized into 598 Logic Array Blocks (LABs), each consisting of 10 four-input look-up tables. The fabric also includes 92,160 bits of embedded M4K RAM (true dual-port, 4 Kbit blocks), 20 dedicated 18 x 18 hardware multipliers, and 2 PLLs. This LE/RAM/multiplier mix targets glue-logic and moderate-throughput DSP workloads.
What package does EP1C6F256I7N use and how big is it?
The EP1C6F256I7N is supplied in a 256-ball FineLine BGA (FBGA-256) measuring 17 mm x 17 mm with 1.0 mm ball pitch. The package suffix 'F256' encodes both the FBGA-256 outline and the pin count. The exposed die paddle must be soldered to a PCB thermal pad with an array of thermal vias for reliable operation at sustained high toggle rates.
Where to buy EP1C6F256I7N online?
The EP1C6F256I7N can be purchased from authorized distributors including DigiKey, Mouser, Heisener, and Octopart-listed vendors. Heisener shows approximately in stock at a unit price of $41.87 (as of 2026-09-06). Because this part is flagged NCNR (Not Recommended for New Designs), verify lead-time and lifecycle status with the distributor before placing volume orders.
What is the current price of EP1C6F256I7N?
The EP1C6F256I7N lists at approximately $41.87 per unit at qty-1, dropping to about $27.94 at qty-1000 as of 2026-09-06 from authorized distributor Heisener. Pricing varies with market conditions and stocking distributor; Octopart aggregates real-time distributor quotes for comparison. Because the part is NCNR, spot-market pricing may fluctuate significantly above or below published tiers.
What is the lead time for EP1C6F256I7N?
Authorized distributor Heisener reports the EP1C6F256I7N can ship immediately with estimated delivery of 2 to 5 business days for expedited orders (as of 2026-09-06). Because the device is NCNR, lead times can extend during inventory draws, so request firm delivery commitments before placing production POs. For long-life-cycle designs, evaluate current Cyclone IV or Cyclone 10 LP replacements.
Is EP1C6F256I7N in stock at distributors?
Yes, Heisener reports approximately 29,880 pieces of the EP1C6F256I7N in stock as of 2026-09-06. DigiKey and Mouser historically listed the part as well; check their live inventory feeds for current qty and tape-and-reel availability. Because Intel has classified this MPN as NCNR, future inventory draws are not replenished, so plan purchases carefully.
EP1C6F256I7N vs EP1C6F256C8N - which is better for industrial designs?
The EP1C6F256I7N is an industrial-temperature grade (-40 C to +100 C) at speed grade 7, while the EP1C6F256C8N is commercial-temperature (0 C to +85 C) at the faster speed grade 8. For industrial or outdoor applications, the EP1C6F256I7N is the correct choice despite its slightly lower Fmax; the C8N variant can fail at sub-zero temperatures. Both share the FBGA-256 footprint, enabling drop-in PCB reuse.
What is the difference between EP1C6F256I7N and EP1C6F256I7?
The EP1C6F256I7N and EP1C6F256I7 share the same Cyclone-I die, FBGA-256 package, and industrial temperature grade; the 'N' suffix typically denotes lead-free / Pb-free terminal finish versus a standard tin-lead finish on the bare suffix variant. Functionally, both parts are interchangeable on the same PCB footprint, but the 'N' suffix ensures RoHS compliance. Choose the 'N' variant for any RoHS-bound product.
Can EP1C6Q240I7N replace EP1C6F256I7N without PCB redesign?
No, the EP1C6Q240I7N is supplied in a different 240-pin PQFP package, not the FBGA-256 of the EP1C6F256I7N. Although both devices share the same 5,980 LE Cyclone-I die, the Q240 package has only 185 usable I/Os versus the F256's 185 with different pin mapping. A PCB redesign is required; this is a functional equivalent only, not a drop-in replacement.
When should I choose EP1C6F256I7N over a Cyclone IV EP4CE6?
Choose the EP1C6F256I7N when you already have a Cyclone I design that needs last-time-buy replenishment, when the FBGA-256 PCB layout is fixed, or when the 130 nm process is acceptable for your volume pricing. Choose a Cyclone IV EP4CE6 for new designs because it offers more LE, lower core voltage (1.2 V), better DSP blocks, and active lifecycle support through 2028+. The two are pin-incompatible.
What is the best drop-in replacement for EP1C6F256I7N?
The best drop-in replacement for the EP1C6F256I7N is the EP1C6F256I7 itself (without the 'N' suffix), which shares the exact same FBGA-256 footprint and Cyclone-I die, differing only in lead finish. The EP1C6F256C7N (commercial temp, 7 speed grade) is also a drop-in but operates only to +85 C. Both alternatives reuse existing PCB layouts without modification.
Where to download the EP1C6F256I7N datasheet PDF?
The official EP1C6F256I7N datasheet is the Cyclone Device Handbook, available as the 'cyc_c5v1' PDF on the Intel Programmable Solutions Group support site. Third-party mirrors at DigiKey, Mouser, Alldatasheet, and ADatasheet also host the document. The handbook contains DC/AC specs, configuration schemes, JTAG instructions, and reference design examples; download it before designing your PCB.
Where to find the EP1C6F256I7N pinout for the FBGA-256 package?
The EP1C6F256I7N pinout is documented in the Cyclone Device Handbook chapter on pin tables and in Altera's Pin-Out File Generator (within Quartus II). The FBGA-256 uses a 16 x 16 ball grid with thermal pad; bank assignments separate VCCIO rails by I/O bank letter. Reference designators follow the standard JEDEC MS-034 variation for 1.0 mm-pitch BGA.
What are the key specifications of EP1C6F256I7N that engineers should know?
The EP1C6F256I7N combines 5,980 logic elements, 92,160 embedded RAM bits, 20 hardware 18 x 18 multipliers, 2 PLLs, and 185 user I/Os in a 256-ball FBGA at 17 x 17 mm. The 1.5 V core supports up to 250 MHz internal operation with industrial-temperature qualification (-40 C to +100 C). Configuration is via passive-serial from a low-cost EPCS flash, with JTAG boundary-scan support for in-system debug.
Is EP1C6F256I7N the same as EP1C12F256I7N?
No, the EP1C6F256I7N contains 5,980 logic elements, while the EP1C12F256I7N contains 12,060 logic elements - approximately twice the density. Both share the same FBGA-256 footprint and Cyclone-I architecture, so the EP1C12F256I7N is a parametric upgrade but NOT a drop-in replacement because the bitstream, configuration, and pinout of unused I/Os differ. For software-compatible upward migration, recompile with the larger device target.
What is the best Xilinx equivalent for EP1C6F256I7N?
The Xilinx equivalent of the EP1C6F256I7N at the same logic density is the XC3S50 / Spartan-3 family (50,000 system gates, 1,728 logic cells) - the closest in era and density to Cyclone I. The XC6SLX9 (Spartan-6) and XC7A35T (Artix-7) are modern, lower-power alternatives, but they are pinout-incompatible with the FBGA-256 footprint and require full PCB redesign plus a Vivado migration rather than a Quartus II drop-in.

Datos de referencia de ingeniería para EP1C6F256I7N — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the EP1C6F256I7N for industrial-temperature, RoHS-compliant, 5,980-LE Cyclone-I designs already laid out for the FBGA-256 footprint. If you do not require RoHS compliance and have legacy SnPb assembly, the EP1C6F256I7 (bare suffix) is electrically identical. For commercial-temperature products operating only between 0 C and +85 C, the EP1C6F256C7N offers the same functionality at potentially lower cost. For designs that need higher speed grade (approximately 15% Fmax uplift), the EP1C6F256C8N is a drop-in but commercial-only. If your logic needs are likely to grow beyond 5,980 LE, lay out the PCB for the EP1C12F256I7N (same footprint, 12,060 LE) to preserve your design investment. None of these alternatives are AEC-Q100 qualified; for automotive applications use Cyclone IV EP4CE6F17I7N or AEC-Q100 parts.

Comparación con alternativas

Parámetro Este producto EP1C6F256I7 EP1C6F256C7N EP1C6F25617N EP1C6F256C8N EP1C12F256I7N
Brand Intel Intel Intel Intel Intel Intel
Package FBGA-256 (17x17 mm) FBGA-256 (17x17 mm) - same FBGA-256 (17x17 mm) - same FBGA-256 (17x17 mm) - same FBGA-256 (17x17 mm) - same FBGA-256 (17x17 mm) - same
Logic Elements 5,980 5,980 5,980 5,980 5,980 12,060 (+102%)
Embedded RAM (bits) 92,160 92,160 92,160 92,160 92,160 239,616 (+160%)
Operating Temperature -40 C to +100 C (industrial) -40 C to +100 C 0 C to +85 C (commercial) -40 C to +100 C 0 C to +85 C (commercial) -40 C to +100 C
Speed Grade 7 7 7 7 8 (faster, +15% Fmax) 7
User I/Os 185 185 185 185 185 185
Hardware Multipliers (18x18) 20 20 20 20 20 52 (+160%)
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Lifecycle Status NRND (Not Recommended for New Designs) NRND NRND NRND NRND NRND

Diferenciadores clave

  • Industrial-temperature lead-free variant (frente a EP1C6F256I7)
  • Industrial temperature range -40 C to +100 C (frente a EP1C6F256C7N)
  • Doubled logic capacity with same footprint (frente a EP1C12F256I7N)

Notas de diseño

Estimated: at typical industrial utilization (60% LE, 50% toggle, 100 MHz), the EP1C6F256I7N core consumes approximately 0.5 to 0.8 W from VCCINT (1.5 V). Add 100 uF bulk decoupling plus 0.1 uF and 1 nF X7R ceramics on every VCCINT/VCCIO pin pair, placed within 5 mm of the package. VCCA_PLL must be held at 2.5 V +/-5% regardless of VCCIO setting; an LDO or ferrite filter is recommended to isolate PLL analog supply from digital switching noise.

The FBGA-256 package's exposed die paddle must be soldered to a PCB thermal pad with an array of at least 25 thermal vias (0.3 mm drill, 1.0 mm pitch). Without this thermal pad the junction temperature can exceed the +100 C industrial limit at sustained high toggle rates above 100 MHz on more than 50% of I/Os. Estimated: theta_JA on a 4-layer JEDEC test board is approximately 18 C/W with full thermal-pad solder, derating to >30 C/W with no thermal pad.

Route all eight VCCIO bank supplies through wide power planes; do not daisy-chain bank supplies. Use length-matched differential routing for the True-LVDS pairs (within 0.13 mm tolerance) with 100 ohm differential impedance. Keep configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL[0..3], DCLK, DATA0) away from high-speed clock edges; these pins are 3.3 V tolerant even when VCCIO is 1.5 V or 1.8 V.

Do not confuse the EP1C6F256I7N (industrial temp, 130 nm, 5,980 LE) with the EP1C6Q240I7N (PQFP-240 package, different PCB layout). The Q240 part has fewer balls and a different ball map despite sharing the same die. Also note: EP1C6F256I7N is NCNR/NRND - for new designs, target a Cyclone IV EP4CE6F17I7N or Cyclone 10 LP 10CL025YU256I7G which are actively supported. Use the Altera/Intel Pin-Out File Generator in Quartus II to verify your specific FBGA-256 pinout before PCB layout.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS-compliant per Intel/Altera product page (N-suffix denotes Pb-free finish). Not AEC-Q100 qualified - for automotive, evaluate Cyclone IV EP4CE6F17I7N or AEC-Q100 automotive FPGAs. Halogen-free status not explicitly stated in provided data.

Datos verificados el: 2026-09-06 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

EP1C6F256I7N EP1C6F256I7N datasheet Intel Cyclone FPGA 5980 LE EP1C6F256I7N FBGA-256 industrial Altera Cyclone I FPGA drop-in replacement EP1C6F256I7N vs EP1C12F256I7N EP1C6F256I7N buy price stock Cyclone FPGA motor control industrial EP1C6F256I7N pinout Quartus II FPGA 185 user I/O 1.5V 130nm Cyclone I NCNR replacement upgrade EP1C6F256I7N lead-free RoHS FBGA

Componentes & términos relacionados

Intel Altera EP1C6F256I7N EP1C6F256I7 EP1C6F256C7N EP1C6F25617N EP1C6F256C8N EP1C12F256I7N Cyclone FPGA Field Programmable Gate Array Logic Array Block (LAB) Logic Element (LE) FBGA-256 FineLine BGA M4K RAM block PLL True-LVDS Quartus II EPCS configuration flash Passive Serial RoHS AEC-Q100 JTAG 130 nm CMOS process industrial temperature grade
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