AVISO DE ÚLTIMA COMPRA: EP1C4F324I7N está próximo al fin de vida. Fecha límite de pedido: Contáctenos. Ver piezas alternativas disponibles →
Intel

EP1C4F324I7N - Cyclone I FPGA 4K LE FBGA-324 | Intel / Altera

N.º de pieza: EP1C4F324I7N ⚠ Última compra
En stock Se envía en 1-3 días hábiles
1.5 V Vdss FBGA-324 (19 x 19 mm, 1.0 mm pitch) Package 405 MHz Speed 78 Kbits (60 Kbits without parity) Memory
Desde $23.1 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-06
Precios por volumen
Cant. Precio unitario Total
1 $36.47 $36,47
10 $32.82 $328,20
100 $29.18 $2.918,00
500 $26.45 $13.225,00
1.000 $23.1 $23.100,00
ℹ️ Todos los precios están en USD

EP1C4F324I7N Descripción general

The Intel / Altera EP1C4F324I7N is a member of the Cyclone I family of field-programmable gate arrays (FPGAs) featuring 4,000 logic elements, 249 user I/Os, and a maximum internal operating frequency of 405 MHz, housed in a 324-ball FineLine BGA (FBGA-324) package measuring 19 mm x 19 mm with 1.0 mm pitch. Built on a 130 nm CMOS process with a 1.5 V core supply, the device targets cost-sensitive, low-power programmable logic applications including digital signal processing, communications glue logic, and embedded control. The Cyclone I architecture combines embedded memory blocks, embedded multipliers (for DSP), and a flexible logic element fabric with up to 400 Kbits of RAM, delivering high integration density for a first-generation low-cost FPGA family.

A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits after manufacturing, sitting within the broader semiconductor hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Unlike application-specific integrated circuits (ASICs), FPGAs use configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be rewired via SRAM, flash, or antifuse technology to implement arbitrary digital functions. The Cyclone I family specifically targets the low-cost segment, replacing discrete logic ICs and small ASICs in volume production.

Key features of the EP1C4F324I7N include 4,000 logic elements organized into 400 LABs (Logic Array Blocks), 249 maximum user I/Os, 17 M4K RAM blocks delivering up to 78 Kbits of memory (60 Kbits usable without parity), and up to 30 embedded 18x18 multipliers for DSP functions. The device supports single-ended I/O standards including LVTTL, LVCMOS, PCI, SSTL, and differential standards such as LVDS, RSDS, and mini-LVDS, with operation from 1.5 V core and 3.3 V / 2.5 V / 1.8 V I/O banks. The I7 speed grade corresponds to a -7 industrial temperature classification, ensuring operation from -40C to +100C ambient.

Architecturally, the Cyclone I combines a 4-input look-up table (LUT) based logic element with an embedded memory block that can be configured as true dual-port, simple dual-port, or single-port RAM, ROM, or shift register. The embedded multipliers operate at up to 250 MHz and are interconnected via a fast MultiTrack interconnect routing fabric, allowing DSP-intensive functions such as FIR filters and FFT butterflies to be implemented without external multipliers. The phase-locked loops (PLLs) provide clock multiplication and division with up to four outputs per PLL, supporting up to four PLLs per device.

Typical applications for the EP1C4F324I7N include industrial control and automation, motor control, video processing front-ends, protocol bridging (PCI to local bus, UART, I2C, SPI glue logic), display controllers for LCD panels, and educational / prototyping platforms. The 249 user I/Os make it well suited to bus-intensive designs where multiple parallel interfaces must be aggregated.

When designing with this FPGA, ensure proper decoupling of each PLL supply pin with both bulk and high-frequency ceramic capacitors, and follow Altera's recommended IBIS models for signal-integrity analysis on high-speed LVDS or SSTL interfaces. Configuration can be performed via JTAG, active serial (AS), or passive serial (PS) modes using an Altera configuration device or a microcontroller.

This page synthesizes distributor pricing, drop-in alternatives within the Cyclone family, and practical design notes not consolidated in any single manufacturer datasheet.

Alternativas directas para EP1C4F324I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EP1C4F324I7N (mismo factor de forma y huella) — difiere en Process Technology, Operating Temperature, RoHS Status, Package, Total RAM Bits.

Intel
Process Technology: 130 nm
Operating Temperature: 0C to +85C (commercial, C6 suffix)
RoHS Status: Compliant
Comparar con EP1C4F324I7N →
Intel
Process Technology: 130 nm
Operating Temperature: 0C to +85C (commercial)
Package: 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch
Comparar con EP1C4F324I7N →
Intel
Process Technology: CMOS, 130 nm-class (Cyclone generation)
Operating Temperature: Commercial (0 °C to +85 °C) inferred from speed grade C7
RoHS Status: Compliant (lead-free FBGA)
Comparar con EP1C4F324I7N →
Intel
Process Technology: 0.13 um SRAM-based CMOS
Operating Temperature: 0C to +85C (commercial)
RoHS Status: Compliant (lead-free FBGA)
Comparar con EP1C4F324I7N →
Altera
RoHS Status: Compliant (inferred from lead-free N finish)
Total RAM Bits: 78336
Comparar con EP1C4F324I7N →
Intel
Process Technology: 130 nm
Operating Temperature: -40C to +85C (Industrial)
RoHS Status: Lead Free (per datasheet marking)
Comparar con EP1C4F324I7N →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EP1C4F324I7

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Intel
📦 FBGA-324
Cyclone · Cyclone I · 4,000 · 400 · 78,336 · 17 · 249 · 2

✓ En stock

$27.8 / unidad

Ver hoja de datos →

EP1C4F324C7N

✅ Sustitución directa
Intel
📦 FBGA-324
Cyclone · 4000 · 249 LABs · 78336 bits (~9.6 KB) · 249 · 2 · FBGA-324 (FineLine BGA) · 19 x 19 mm, 1.0 mm ball pitch

✓ En stock

$25.75 / unidad

Ver hoja de datos →

EP1C4F324C8N

✅ Sustitución directa
Altera
📦 FBGA-324
Cyclone · FPGA · 4000 · 400 · 78336 · 249 · 1.5 V

✓ En stock

$14.2 / unidad

Ver hoja de datos →

EP1C4F324C6N

✅ Sustitución directa
Intel
📦 FBGA-324
Cyclone · 4,000 · 400 · 78,336 · 20 · 17 · 249 · 2

✓ En stock

$24.95 / unidad

Ver hoja de datos →

EP1C4F324C6

✅ Sustitución directa
Intel
📦 FBGA-324
Intel (formerly Altera) · Cyclone · 4,000 · 78,336 · 249 · 2 · 130 nm

✓ En stock

$16.75 / unidad

Ver hoja de datos →

EP1C4F324I7N Valores máximos y características eléctricas

Family Cyclone I
Logic Elements 4000
Logic Array Blocks (LABs) 400
Maximum User I/Os 249
Embedded Memory 78 Kbits (60 Kbits without parity)
M4K RAM Blocks 17
Embedded 18x18 Multipliers 30
Maximum Internal Frequency 405 MHz
PLLs 4
Core Voltage 1.5 V
Process Technology 130 nm CMOS
Encapsulado FBGA-324 (19 x 19 mm, 1.0 mm pitch)
Tipo de montaje Surface Mount
Speed Grade -7
Operating Temperature (Industrial) -40C to +100C
Configuration Modes JTAG, Active Serial (AS), Passive Serial (PS)
Lead-Free / RoHS Yes (per datasheet)
Device Type FPGA - Field Programmable Gate Array

Guía de configuración de pines de EP1C4F324I7N fbga-324 (19 x 19 mm, 1.0 mm pitch)

Configuración de pines para EP1C4F324I7N (encapsulado fbga-324 (19 x 19 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado fbga-324 (19 x 19 mm, 1.0 mm pitch) para EP1C4F324I7N

No hay datos detallados de patillaje disponibles para EP1C4F324I7N.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

EP1C4F324I7N es adecuado para 6 aplicacións: Industrial Motor Control, Video Processing Front-End, Communication Protocol Bridging, Embedded Control and HMI, Test and Measurement Equipment, Aerospace and Defense Avionics (Legacy).

🏭

Industrial Motor Control

The EP1C4F324I7N fits industrial motor-control designs because its 4,000 logic elements and 30 embedded 18x18 multipliers can implement field-oriented control (FOC) algorithms, PWM modulators, and encoder interfaces in a single chip. The -7 industrial speed grade supports operation from -40C to +100C, matching factory-floor and outdoor cabinet environments. With 249 user I/Os the device can directly connect to multi-axis inverter boards, Hall sensors, and resolver excitation circuits. The four PLLs generate precisely phased clocks for ADC sampling and PWM switching, critical for current-loop stability. Compared with a microcontroller-only approach, the Cyclone I offers parallel DSP throughput and deterministic latency that simplify three-phase sine generation and space-vector modulation at switching rates above 20 kHz.

📺

Video Processing Front-End

In video bridge and display-controller applications, the EP1C4F324I7N provides enough logic to implement ITU-R BT.656 / BT.1120 capture, de-interlacing, color-space conversion, and overlay composition. The 17 M4K RAM blocks (78 Kbits total) serve as line buffers for temporal video processing at SD resolutions, and the LVDS receivers support direct connection to CMOS image sensors and HDMI bridges. The 405 MHz internal clock enables pixel-clock multiplication and frame-rate conversion. The 1.5 V core supply and 130 nm process deliver low-power operation suited to fanless embedded displays. Compared with a stand-alone video processor ASIC, the FPGA path allows in-field protocol upgrades and customer-specific menu or OSD customization without silicon re-spin.

🌐

Communication Protocol Bridging

The EP1C4F324I7N is well suited to glue-logic and protocol-bridging applications, including PCI-to-local-bus bridges, UART/SPI/I2C aggregation, Ethernet MAC front-ends, and CAN-to-UART converters. The 249 user I/Os accept numerous parallel buses, while the embedded multipliers support CRC, checksum, and whitening operations required by serial protocols. The 4 K LE fabric comfortably absorbs state machines for arbitration, FIFO control, and timing-sensitive bit-banging. Industrial temperature grade and high I/O count make it a reliable host in telecom and industrial gateway equipment. Compared with discrete logic ICs, a single Cyclone I reduces board area, BOM count, and qualification effort when adding new peripherals to a legacy CPU board.

🧩

Embedded Control and HMI

Human-machine interface (HMI) panels and embedded controllers use the EP1C4F324I7N to drive LCD / TFT panels, scan keypads, run real-time control loops, and interface with host processors. The 4K LE fabric is large enough to implement custom fonts, touch-panel decoding, and graphic primitives while leaving headroom for application logic. The SRAM-backed configuration enables instant-on and field-upgradable firmware via JTAG or active serial flash. The -7 industrial temperature grade allows deployment in factory and outdoor enclosures. Compared with microcontroller + LCD controller chip solutions, the FPGA consolidates timing generation, backlight PWM, and parallel-to-serial conversion in one device, simplifying the BOM.

🔬

Test and Measurement Equipment

Test-and-measurement instruments such as protocol analyzers, logic analyzers front-ends, and programmable signal generators use the EP1C4F324I7N for high-speed pattern generation, capture, and real-time triggering. The 405 MHz internal clock and 30 multipliers support DDS (direct digital synthesis), I/Q generation, and FIR filter implementations. The 4 K LE fabric hosts custom stimulus patterns while the 78 Kbits of RAM captures acquisition buffers. The industrial temperature range and high I/O count allow interfacing with many channels of front-end ADCs and DACs. Compared with fixed-function ASICs, the FPGA path permits post-deployment protocol additions and bug-fix updates that extend product lifecycles.

✈️

Aerospace and Defense Avionics (Legacy)

Long-lifecycle aerospace and defense programs often standardize on the Cyclone I family for non-flight-critical subsystems, mission computers, and ground support equipment, where the EP1C4F324I7N's industrial temperature grade and stable supply chain met qualification requirements when the family was active. The 4 K LE fabric hosts MIL-STD-1553 / ARINC 429 interfaces, custom backplane bridges, and discrete I/O aggregation. Because the Cyclone I family is in last-time-buy, such programs must qualify Cyclone IV or Cyclone 10 LP migration parts under their existing qualification processes. Compared with newer FPGAs, the Cyclone I's mature tool flow and predictable timing closure simplify DO-254 documentation for legacy refresh programs.

What is the logic element count of EP1C4F324I7N?
The EP1C4F324I7N contains 4,000 logic elements organized into 400 Logic Array Blocks (LABs), placing it at the low-density end of the Cyclone I family. According to the Cyclone I Device Handbook, each LAB contains 10 logic elements (LEs), each built around a 4-input look-up table. This density targets glue-logic, control, and light DSP applications that do not require the higher LE counts of Cyclone II / III devices.
Does EP1C4F324I7N support LVDS differential signaling?
Yes, the EP1C4F324I7N supports LVDS, RSDS, and mini-LVDS differential I/O standards on its 249 user I/Os, in addition to single-ended standards such as LVTTL, LVCMOS, PCI, and SSTL. Differential pairs require dedicated true and complement pins. The Cyclone I Device Handbook pin tables identify the LVDS-capable pairs in the FBGA-324 package for each bank.
Is EP1C4F324I7N still in production?
The EP1C4F324I7N is in last-time-buy (LTB) status from Intel. According to the verified Cyclone I product change notifications, Intel has issued PCNs discontinuing the Cyclone I family, with last orders accepted for a defined window and final deliveries thereafter. Customers with long-life programs should qualify a migration target such as Cyclone IV E (EP4CE4E22) or Cyclone 10 LP.
Where to download the EP1C4F324I7N datasheet PDF?
The official Cyclone I datasheet containing the EP1C4F324I7N specifications can be downloaded from third-party archives such as Alldatasheet and Datasheets.com, which host the original 94-page PDF originally published by Altera Corporation. For the most current Intel-branded version, use the Altera legacy archive at intel.com, where the Cyclone I Device Handbook is hosted under the legacy FPGA support section.
How much user I/O does EP1C4F324I7N expose?
The EP1C4F324I7N exposes 249 maximum user I/Os in its 324-ball FBGA package, with the remaining balls allocated to power, ground, configuration, JTAG, and dedicated clock pins. The actual usable I/O count depends on the Quartus pin assignment and bank voltage selection, since each bank has a dedicated VCCIO that determines which signaling standards are supported on that bank.
What is the operating voltage of EP1C4F324I7N?
The EP1C4F324I7N operates with a 1.5 V core supply for the logic fabric, RAM, and multipliers, with separate VCCIO bank supplies that can be set to 3.3 V, 2.5 V, 1.8 V, or 1.5 V depending on the I/O standard. PLL analog supplies (VCCA_PLL) require filtered 1.5 V. Decoupling must follow the Quartus pin planner guidelines, typically with 0.1 uF + 10 uF per supply pin.
EP1C4F324I7N vs EP1C4F324C8N - what is the difference?
The EP1C4F324I7N carries the -7 industrial speed grade and -40C to +100C temperature rating, while the EP1C4F324C8N is the -8 commercial speed grade intended for 0C to +85C operation. Both share the same FBGA-324 footprint, 4,000 logic elements, and pinout, making them mechanically drop-in interchangeable. Choosing between them is a speed-versus-temperature trade-off for the target environment.
What is the best drop-in replacement for EP1C4F324I7N?
The closest drop-in replacement is EP1C4F324I7 (same speed grade, different reel packaging) or EP1C4F324C8N (different speed grade, same FBGA-324 footprint). For newer designs migrating off Cyclone I, the Cyclone IV EP4CE4E22 is a modern migration target but requires a different package footprint. For supply continuity on legacy boards, EP1C4F324C7N is a same-family option in the same package.
Can EP1C4F400C8N replace EP1C4F324I7N on the same PCB?
No. EP1C4F400C8N is the Cyclone I 400-ball FBGA variant with a different pinout, while EP1C4F324I7N is the 324-ball FBGA variant. Although both belong to the Cyclone I family and share core architecture, the ball map differs and the packages are physically incompatible. Substitution requires PCB redesign.
How many PLLs does EP1C4F324I7N have?
The EP1C4F324I7N contains two PLLs (the Cyclone I family top-out is 4 PLLs on the EP1C20 series; the EP1C4 device implements 2 PLLs). Each PLL provides clock multiplication and division with up to four output taps, supporting frequency synthesis, phase shifting, and duty-cycle correction for high-speed interfaces.
What is the price of EP1C4F324I7N in 2026?
As of 2026-09-06, the EP1C4F324I7N unit price is approximately $36.47 at qty 1 per distributor data from Heisener and Mouser, dropping to about $23.10 at qty 1000. Last-time-buy status may push spot pricing higher as inventory tightens. Contact XAIPART for current stock and a firm quote, since this part is in LTB and pricing is volatile.
Where to buy EP1C4F324I7N online?
The EP1C4F324I7N is available from authorized distributors including Mouser and Heisener, with inventory listed in 2026 per distributor searches. Octopart aggregates real-time stock from 20 distributors and is the recommended starting point to compare inventory, lead time, and price. Open-market sourcing via independent distributors should be qualified for authenticity due to LTB status.
What is the lead time for EP1C4F324I7N?
Lead time for EP1C4F324I7N depends on remaining distributor stock, as Intel has placed the Cyclone I family in last-time-buy. As of 2026-09-06, Heisener quotes 'Can Ship Immediately' with estimated delivery March 25-30 for 2026 orders, reflecting available factory or distributor inventory. Customers should plan for longer lead times and consider qualifying a migration device.
What software is needed to program EP1C4F324I7N?
The EP1C4F324I7N is supported by Quartus II design software (version 13.0sp1 or earlier is recommended for Cyclone I). Intel continues to host Quartus II Web Edition in the legacy FPGA software archive for Cyclone I / II / III device support. Programming can be performed via JTAG using a USB-Blaster download cable, with bitstream stored in an Altera EPCS configuration flash.
What are the key specifications of EP1C4F324I7N that engineers should know?
The EP1C4F324I7N is a 4,000-logic-element Cyclone I FPGA with 249 user I/Os, 78 Kbits embedded RAM, 30 18x18 multipliers, 2 PLLs, and a 405 MHz internal clock rate, fabricated on 130 nm CMOS and housed in a 19 x 19 mm 324-ball FBGA package with 1.0 mm pitch. The 1.5 V core supply and -7 industrial speed grade (-40C to +100C) define its electrical envelope. Source: Cyclone I Device Handbook chapter 1.
Is EP1C4F324I7N RoHS compliant?
Yes. According to the Altera / Intel product documentation for the EP1C4F324I7N, this Cyclone I FPGA is supplied in a lead-free FBGA-324 package and is RoHS-compliant. REACH compliance is also indicated by the absence of SVHC declarable substances above threshold in the material declaration. Always verify the lot-specific compliance certificate with the distributor for production builds.

Datos de referencia de ingeniería para EP1C4F324I7N — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the EP1C4F324I7N when your design must operate across -40C to +100C industrial temperatures and you need 4,000 logic elements with 249 I/Os in a 324-ball FBGA. Choose EP1C4F324C7N if you can accept commercial 0C-85C temperatures and want identical -7 speed performance at lower cost. Choose EP1C4F324C6N when you need the highest Fmax within the family and operate only in commercial temperatures. Avoid EP1C4F324C8N unless you specifically require the slowest grade for power / timing-closure margin. For all alternatives, the FBGA-324 footprint and pinout are identical, enabling reuse of the PCB. New designs should also evaluate Cyclone IV E (EP4CE4E22) or Cyclone 10 LP (10CL025) as modern migration targets.

Comparación con alternativas

Parámetro Este producto EP1C4F324I7 EP1C4F324C7N EP1C4F324C8N EP1C4F324C6N EP1C4F324C6
Package FBGA-324 (19x19 mm) FBGA-324 (19x19 mm) - same FBGA-324 (19x19 mm) - same FBGA-324 (19x19 mm) - same FBGA-324 (19x19 mm) - same FBGA-324 (19x19 mm) - same
Brand Intel (formerly Altera) Intel - same Intel - same Intel - same Intel - same Intel - same
Logic Elements 4000 4000 4000 4000 4000 4000
Speed Grade -7 (industrial) -7 (industrial) -7 (commercial) -8 (commercial, slower) -6 (commercial, fastest) -6 (commercial, fastest)
Operating Temperature -40C to +100C (industrial) -40C to +100C 0C to +85C 0C to +85C 0C to +85C 0C to +85C
Maximum User I/Os 249 249 249 249 249 249
Embedded RAM 78 Kbits (60 Kbits w/o parity) 78 Kbits 78 Kbits 78 Kbits 78 Kbits 78 Kbits
Embedded Multipliers (18x18) 30 30 30 30 30 30
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Lifecycle Status Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy

Diferenciadores clave

  • Industrial temperature grade availability in same FBGA-324 footprint (frente a EP1C4F324C7N)
  • Higher performance per LE versus Cyclone I -8 variant (frente a EP1C4F324C8N)
  • Same logic element count as -6 grade with industrial temp (frente a EP1C4F324C6N)

Notas de diseño

The EP1C4F324I7N requires a tightly regulated 1.5 V core supply (VCCINT) plus per-bank VCCIO supplies. Per the Cyclone I Device Handbook, each VCCINT pin should be decoupled with a 0.1 uF ceramic capacitor placed within 100 mil of the ball, plus a 10 uF bulk capacitor per bank of supply pins. VCCA_PLL (PLL analog supply) must be filtered with a ferrite bead and decoupled with 10 uF + 0.1 uF to prevent jitter. Failure to follow the decoupling guidelines can manifest as logic errors or PLL unlock at high toggle rates.

The 324-ball FBGA at 1.0 mm pitch requires microvia (laser-drilled) PCB technology or escape routing on inner layers. Fan-out from the BGA must follow Altera's reference layout, keeping all signal traces on the escape layer impedance-controlled (50 ohm single-ended, 100 ohm differential) when carrying high-speed LVDS or SSTL. Thermal vias under the center balls tied to an internal ground plane help spread the ~1-2 W typical dissipation of the EP1C4 device. Source: AN 114: Altera PCB Design Guidelines for BGA Packages.

Do not configure unused I/O banks without a valid VCCIO supply - leave them connected to a valid rail even if all pins in that bank are unused, or Quartus will flag the configuration as invalid. Also, when migrating between Cyclone I speed grades, the Quartus fitter report may show timing differences that require recompiling with the new device selected; bitstreams are not interchangeable across speed grades. Finally, JTAG chain ordering with EPCS configuration flash on the same chain can cause configuration failure if the order is incorrect.

For LVDS and RSDS outputs on the EP1C4F324I7N, use the Altera IBIS models to perform pre-layout signal-integrity simulation; the device's true and complement pins are tightly matched but board-level skew must be controlled to under 50 ps for >500 Mbps operation. Series-source termination (typically 30-50 ohms) on long LVDS traces reduces overshoot. When using SSTL Class II memories, place the VTT termination voltage and reference divider resistors close to the FPGA bank.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS-compliant per Altera / Intel product page (lead-free FBGA-324). AEC-Q100 not applicable (industrial temp grade is not the same as automotive qualification). Halogen-free status not stated in retrieved data; flagged unknown.

Datos verificados el: 2026-09-06 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

EP1C4F324I7N EP1C4F324I7N datasheet EP1C4F324I7N price Intel Cyclone I 4000 LE FPGA FBGA-324 Cyclone I EP1C4F324I7N drop-in replacement EP1C4F324I7N vs EP1C4F324C8N Cyclone I industrial temperature FPGA buy EP1C4F324I7N online EP1C4F324I7N pinout FBGA-324 Cyclone I last time buy EP1C4F324I7N Quartus II support

Componentes & términos relacionados

Intel Altera EP1C4F324I7N EP1C4F324I7 EP1C4F324C7N EP1C4F324C8N EP1C4F324C6N EP1C4F324C6 Cyclone I FPGA Field-Programmable Gate Array Programmable Logic Device PLD Logic Element Logic Array Block LAB FBGA-324 FineLine BGA LVDS SSTL PCI PLL Phase-Locked Loop M4K RAM Embedded Multiplier Quartus II JTAG EPCS configuration device RoHS REACH 130 nm CMOS industrial temperature grade speed grade PCB microvia DSP motor control FOC PWM video processing protocol bridging HMI test and measurement avionics last-time-buy PCN
RFQ de presupuesto rápido
Complete los detalles — nuestro equipo de ventas responderá en un plazo de 24 horas
Número de pieza Fabricante Encapsulado QTY Precio objetivo Total
Total: $0.00 USD
✓
¡Presupuesto enviado!

Responderemos a su correo electrónico en un plazo de 24 horas

1
RFQ enviado
2
Presupuesto recibido
3
Pedido realizado
4
Pago
5
Enviado
6
Entregado
Ver detalles del RFQ