EP1C6F256I7N - Cyclone FPGA, 5980 LE, 256-FBGA | Intel
부품 번호: EP1C6F256I7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $41.87 | $41.87 |
| 10 | $39.42 | $394.20 |
| 100 | $35.18 | $3,518.00 |
| 500 | $31.65 | $15,825.00 |
| 1,000 | $27.94 | $27,940.00 |
EP1C6F256I7N 개요
What is an FPGA? A Field Programmable Gate Array is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, PLLs, and I/O serializers. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and PALs, and provide a hardware-parallel alternative to microcontrollers and DSPs for high-throughput, low-latency digital signal processing. The Cyclone family specifically targets cost-sensitive, high-volume applications by trimming unused features of Altera's Stratix line while retaining the Quartus II design-tool ecosystem.
Key features include two embedded PLLs, up to 20 global clock networks, dedicated DDR SDRAM interface support, 2 True-LVDS differential I/O pairs, and a passive serial configuration interface that loads bitstreams from low-cost EPCS configuration flash. The 1.5 V core and 3.3 V/2.5 V/1.8 V multi-voltage I/O banks are supplied through independent VCCINT, VCCIO, and VCCA pins, simplifying mixed-voltage board designs. The -I7 speed grade specifies a -40 C to +100 C industrial junction operating range.
The Cyclone I architecture uses 4-input look-up tables (LUTs) arranged in Logic Array Blocks (LABs) of 10 LUTs each, with embedded M4K RAM blocks (4 Kbit each, true dual-port) and 18 x 18 hardware multipliers distributed across the fabric. The LE-to-RAM ratio makes the EP1C6 well-suited for glue-logic replacement, custom bus bridges, motor-control state machines, and low-channel-count video processing.
Typical applications include industrial motor control, factory automation I/O expansion, low-density video capture/display bridging, medical instrumentation front-ends, and legacy parallel-bus-to-GPI/Ethernet bridging. The 185 user I/Os are sufficient for 32-bit parallel camera interfaces, RGB888 LCD panels, or multi-bank UART/SPI expansion. The wide operating temperature range also makes the device a popular choice for automotive interior modules and outdoor signage controllers.
When designing with the EP1C6F256I7N, pay particular attention to the multi-rail decoupling scheme: a minimum of one 100 uF bulk plus 0.1 uF + 1 nF ceramics per VCCINT/VCCIO pin pair is recommended. The exposed die paddle of the FBGA-256 package must be soldered to a thermal pad with adequate vias for heat extraction, especially at sustained toggle rates above 100 MHz on more than 50 percent of the I/O.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Cyclone family, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers and procurement teams make faster, more confident sourcing decisions.
드롭인 대체품: EP1C6F256I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C6F256I7N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Speed Grade, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C6F256I7
✅ 드롭인✓ 재고 있음
$23.8 / 개
데이터시트 보기 →EP1C6F256C7N
✅ 드롭인✓ 재고 있음
$18.2 / 개
데이터시트 보기 →EP1C6F25617N
✅ 드롭인✓ 재고 있음
$9.2 / 개
데이터시트 보기 →EP1C6F256C8N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EP1C12F256I7N
✅ 드롭인✓ 재고 있음
$47.85 / 개
데이터시트 보기 →EP1C6F256I7N 최대 정격 & 전기적 특성
| Family | Cyclone |
| Logic Elements (LE) | 5,980 |
| Logic Array Blocks (LAB) | 598 |
| Embedded RAM Bits | 92,160 (90 Kbit M4K blocks) |
| User I/Os | 185 |
| Process Technology | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V (1.425 V to 1.575 V) |
| Maximum Operating Frequency | 250 MHz |
| PLLs | 2 |
| Global Clock Networks | Up to 20 |
| Differential I/O Pairs (LVDS) | 2 True-LVDS |
| Hardware Multipliers (18x18) | 20 |
| 패키지 | 256-BGA (FBGA, 17 x 17 mm, 1.0 mm pitch) |
| 동작 온도 | -40 C to +100 C (industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Pb-free) |
| Configuration Interface | Passive Serial (EPCS flash) |
EP1C6F256I7N 256-bga (fbga, 17 x 17 mm, 1.0 mm pitch) 핀 구성 가이드
EP1C6F256I7N(256-bga (fbga, 17 x 17 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1C6F256I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1C6F256I7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Bridge / LCD Controller, Legacy Bus-to-Ethernet Bridge, Medical Instrumentation Front-End, Automotive Interior Electronics, Test & Measurement Instrumentation.
Industrial Motor Control
The EP1C6F256I7N is well suited to industrial motor-control applications where deterministic hardware parallelism outperforms microcontroller-based solutions. With 5,980 logic elements, 20 dedicated 18 x 18 multipliers, and 2 PLLs, the fabric can simultaneously execute field-oriented control (FOC) loops, SVPWM generation, and encoder decoding at switching frequencies above 50 kHz. The 185 user I/Os accommodate multi-axis encoder inputs, gate-driver outputs, and isolated communication interfaces. The -40 C to +100 C industrial temperature grade ensures operation in cabinet-enclosed or outdoor drive environments. The device's passive-serial configuration from low-cost EPCS flash also enables fast factory programming without external boot logic.
추천
Video Bridge / LCD Controller
The EP1C6F256I7N serves as a low-cost video format converter or LCD timing controller in industrial display products. The 185 available I/Os support 24-bit parallel RGB interfaces plus control signals for TFT panels up to SVGA resolution. The 92,160 embedded M4K RAM bits provide line buffers sufficient for color-space conversion and partial frame storage without external memory. Hardware multipliers accelerate image scaling, gamma correction, and chroma resampling. Designers appreciate the integrated True-LVDS outputs for direct LVDS panel drive, eliminating external serializer ICs and reducing BOM cost in panel-integrated designs.
추천
Legacy Bus-to-Ethernet Bridge
Industrial retrofitting projects commonly require bridging parallel buses (ISA, PC/104, VME, or proprietary backplanes) to modern Ethernet or serial links. The EP1C6F256I7N delivers enough I/O density for 16-bit or 32-bit parallel bus capture plus MAC-side connectivity, while its 130 nm process and 250 MHz fabric support 100 Mbit Ethernet MAC implementations in soft logic. The two PLLs enable independent clocking of the legacy bus and Ethernet PHY domains, simplifying multi-rate bridging. The industrial temperature grade and rugged FBGA-256 package meet factory-floor reliability requirements.
추천
Medical Instrumentation Front-End
Patient-monitoring and laboratory-instrument designs leverage the EP1C6F256I7N to preprocess analog-front-end data before handing off to DSPs or microcontrollers. The 20 hardware 18 x 18 multipliers and high I/O count enable parallel multi-channel digital filtering (FIR/IIR), QRS detection in ECG, or pulse-oximetry envelope extraction at low latency. The 92,160 embedded RAM bits hold filter coefficients and circular sample buffers. The industrial temperature range accommodates clinical-cart and bedside-monitor environments, while the FBGA-256 footprint's small 17 x 17 mm outline supports compact PCB layouts.
추천
Automotive Interior Electronics
Inside automotive cabins, the EP1C6F256I7N serves as a flexible gateway between infotainment clusters, head-up displays, and body-control modules. Its industrial temperature grade handles the elevated thermal environment of dashboard-mounted enclosures, while the 185 I/Os accommodate multi-protocol bridging (CAN, LIN, SPI, I2C, UART) and LVDS display links. The embedded multipliers accelerate audio DSP for active-noise-cancellation or hands-free echo suppression. Note that EP1C6F256I7N is not AEC-Q100 qualified; for safety-critical under-hood or ADAS applications use AEC-Q100 parts such as the Cyclone IV EP4CE6F17I7N or specific AEC-Q100 automotive-grade FPGA families.
추천
Test & Measurement Instrumentation
Bench-top and modular test equipment benefits from the EP1C6F256I7N's parallel I/O bandwidth and reconfigurable logic. The fabric can implement custom protocol decoders, parallel-pattern generators, mixed-signal capture timing engines, and high-speed glue logic between ADCs/DACs and a host processor. The two PLLs provide independent clock domains for sample-rate generation and USB/Ethernet communication interfaces. The industrial temperature grade and FBGA-256 package meet laboratory and field-test deployment requirements, while Quartus II compatibility allows design reuse across the Cyclone I, II, and IV generations.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C6F256I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C6F256I7 | EP1C6F256C7N | EP1C6F25617N | EP1C6F256C8N | EP1C12F256I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 (17x17 mm) | FBGA-256 (17x17 mm) - same | FBGA-256 (17x17 mm) - same | FBGA-256 (17x17 mm) - same | FBGA-256 (17x17 mm) - same | FBGA-256 (17x17 mm) - same |
| Logic Elements | 5,980 | 5,980 | 5,980 | 5,980 | 5,980 | 12,060 (+102%) |
| Embedded RAM (bits) | 92,160 | 92,160 | 92,160 | 92,160 | 92,160 | 239,616 (+160%) |
| Operating Temperature | -40 C to +100 C (industrial) | -40 C to +100 C | 0 C to +85 C (commercial) | -40 C to +100 C | 0 C to +85 C (commercial) | -40 C to +100 C |
| Speed Grade | 7 | 7 | 7 | 7 | 8 (faster, +15% Fmax) | 7 |
| User I/Os | 185 | 185 | 185 | 185 | 185 | 185 |
| Hardware Multipliers (18x18) | 20 | 20 | 20 | 20 | 20 | 52 (+160%) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | NRND (Not Recommended for New Designs) | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Industrial-temperature lead-free variant (vs EP1C6F256I7)
- Industrial temperature range -40 C to +100 C (vs EP1C6F256C7N)
- Doubled logic capacity with same footprint (vs EP1C12F256I7N)
설계 노트
Estimated: at typical industrial utilization (60% LE, 50% toggle, 100 MHz), the EP1C6F256I7N core consumes approximately 0.5 to 0.8 W from VCCINT (1.5 V). Add 100 uF bulk decoupling plus 0.1 uF and 1 nF X7R ceramics on every VCCINT/VCCIO pin pair, placed within 5 mm of the package. VCCA_PLL must be held at 2.5 V +/-5% regardless of VCCIO setting; an LDO or ferrite filter is recommended to isolate PLL analog supply from digital switching noise.
The FBGA-256 package's exposed die paddle must be soldered to a PCB thermal pad with an array of at least 25 thermal vias (0.3 mm drill, 1.0 mm pitch). Without this thermal pad the junction temperature can exceed the +100 C industrial limit at sustained high toggle rates above 100 MHz on more than 50% of I/Os. Estimated: theta_JA on a 4-layer JEDEC test board is approximately 18 C/W with full thermal-pad solder, derating to >30 C/W with no thermal pad.
Route all eight VCCIO bank supplies through wide power planes; do not daisy-chain bank supplies. Use length-matched differential routing for the True-LVDS pairs (within 0.13 mm tolerance) with 100 ohm differential impedance. Keep configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL[0..3], DCLK, DATA0) away from high-speed clock edges; these pins are 3.3 V tolerant even when VCCIO is 1.5 V or 1.8 V.
Do not confuse the EP1C6F256I7N (industrial temp, 130 nm, 5,980 LE) with the EP1C6Q240I7N (PQFP-240 package, different PCB layout). The Q240 part has fewer balls and a different ball map despite sharing the same die. Also note: EP1C6F256I7N is NCNR/NRND - for new designs, target a Cyclone IV EP4CE6F17I7N or Cyclone 10 LP 10CL025YU256I7G which are actively supported. Use the Altera/Intel Pin-Out File Generator in Quartus II to verify your specific FBGA-256 pinout before PCB layout.
규정 준수 정보
RoHS-compliant per Intel/Altera product page (N-suffix denotes Pb-free finish). Not AEC-Q100 qualified - for automotive, evaluate Cyclone IV EP4CE6F17I7N or AEC-Q100 automotive FPGAs. Halogen-free status not explicitly stated in provided data.
