EP1S80B956C6AB - Stratix 79K LE FPGA, 956-BGA | Intel
N.º de pieza: EP1S80B956C6AB ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 100 | $198 | $19.800,00 |
| 500 | $165 | $82.500,00 |
| 1.000 | $142 | $142.000,00 |
EP1S80B956C6AB Descripción general
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits through software configuration rather than ASIC fabrication. Stratix-class FPGAs belong to the hierarchy programmable logic → programmable logic device (PLD) → field programmable gate array (FPGA) → high-density FPGA → embedded system-on-chip (SoC) FPGA, integrating logic, memory blocks, DSP blocks, transceivers, and I/O on a single die.
Key features of the EP1S80B956C6AB include 79,040 logic elements (LEs), high-speed TriMatrix memory blocks, embedded DSP blocks for fixed- and floating-point arithmetic, up to 683 user I/Os, and multiple phase-locked loops (PLLs) for clock management. The 956-ball FCBGA package supports high signal count and signal integrity required by parallel buses, memory interfaces, and external transceiver connections.
Architecturally, the EP1S80B956C6AB uses a 130 nm SRAM-based lookup table (LUT) fabric with embedded RAM, DSP multipliers, and a high-speed interconnect. This gives designers deterministic timing, hardware-level parallelism, and the ability to implement custom accelerators, bus protocols, and data-path pipelines that would be costly or impossible on a fixed-architecture processor.
Typical applications include high-speed digital signal processing (DSP) and data encryption, network packet processing, ASIC prototyping, parallel compute accelerators, and high-bandwidth interface bridging. Stratix FPGAs have historically been deployed in telecom infrastructure, test and measurement, military/aerospace, and broadcast video processing systems.
When designing with this part, allocate sufficient PCB area for power decoupling around the FCBGA, follow Intel/Altera pin-out guidelines for memory interface traces, and validate timing closure in Quartus II. Thermal management is important because 130 nm Stratix devices dissipate meaningful power at high toggle rates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select and source the EP1S80B956C6AB with confidence for new designs, EOL re-spins, and legacy system maintenance.
Alternativas directas para EP1S80B956C6AB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1S80B956C6AB (mismo factor de forma y huella) — difiere en Package, Operating Temperature, DSP Blocks, PLLs, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1S80B956C6
✅ Sustitución directa✓ En stock
$1000 / unidad
Ver hoja de datos →EP1S80B956C6AA
✅ Sustitución directa✓ En stock
$215 / unidad
Ver hoja de datos →EP1S60B956C6
✅ Sustitución directa✓ En stock
$339.2 / unidad
Ver hoja de datos →EP1S80B956C5N
✅ Sustitución directa✓ En stock
$175 / unidad
Ver hoja de datos →EP1S80B956C6AB Valores máximos y características eléctricas
| Family | Stratix |
| Logic Elements (LEs) | 79,040 |
| Logic Cells | 79,040 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Maximum Operating Frequency | 450.05 MHz |
| User I/O Pins | 683 |
| Encapsulado | 956-ball FCBGA |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Memory Blocks | TriMatrix embedded RAM |
| DSP Blocks | Embedded DSP blocks (per Stratix family) |
| PLLs | Multiple PLLs for clock management |
| Configuration Method | SRAM-based, configured via JTAG or passive/active serial |
| Manufacturer | Intel (formerly Altera) |
Guía de configuración de pines de EP1S80B956C6AB 956-ball fcbga
Configuración de pines para EP1S80B956C6AB (encapsulado 956-ball fcbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1S80B956C6AB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1S80B956C6AB es adecuado para 6 aplicacións: Telecom Baseband Processing, ASIC Prototyping, High-Speed Data Acquisition Systems, Image and Video Processing, Industrial Control and Motor Drive, Military and Aerospace Avionics.
Telecom Baseband Processing
The EP1S80B956C6AB is well-suited for telecom baseband signal processing because its 79,040 logic elements plus embedded DSP blocks can implement parallel FIR filters, channelizers, and forward error correction in a single device. With 683 user I/Os the FPGA can connect to multiple ADC/DAC lanes, external SRAM/RLDRAM buffers, and CPRI/OBSAI framer interfaces. Operating at a 1.5 V core with up to 450 MHz fabric, designers can hit the throughput required for multi-antenna 3G/4G base station channel cards. The 956-BGA footprint provides the signal integrity needed for LVDS and HSTL memory interfaces used in symbol-rate processing, making this part historically common in wireless infrastructure designs.
Recomendado
ASIC Prototyping
ASIC prototyping is a primary use case for the EP1S80B956C6AB because 79,040 LEs can emulate complex multi-million-gate ASICs at hardware speed, enabling pre-silicon software development and system validation. The TriMatrix memory and embedded DSP blocks replicate common ASIC compute primitives, while 683 I/Os let engineers break a design across multiple FPGAs via high-speed serial or parallel bridges. Designers compile ASIC RTL into Quartus II and partition the design across EP1S80 devices for FPGA-based prototyping. Reference: Altera ASIC Pro design flow documentation.
Recomendado
High-Speed Data Acquisition Systems
The EP1S80B956C6AB fits high-speed data acquisition systems because its 683 user I/Os can sink multiple parallel ADC lanes, and embedded DSP blocks perform decimation, FFT, and channel filtering in real time. Designers can pair this device with 14-/16-bit ADCs running at 100-200 MSPS and process multi-channel data inside the FPGA fabric before forwarding via external memory or Ethernet. The 1.5 V core plus per-bank VCCIO supports mixed LVDS/LVCMOS interfaces to ADCs and DACs. Reference: Altera reference designs for radar and test-and-measurement front-ends.
Recomendado
Image and Video Processing
The EP1S80B956C6AB supports image and video processing pipelines because its DSP blocks implement convolution, motion estimation, and color-space conversion at real-time rates, and its memory bandwidth handles full-HD frame buffers. With 79,040 LEs and embedded RAM, the FPGA can drive HDMI/DVI input-output, perform deinterlacing, scaling, and overlay, and feed compressed streams to external encoders. Reference: Altera video reference designs for broadcast and surveillance. The 956-BGA package provides enough I/O for parallel video buses, and 1.5 V core operation gives low power per video channel.
Recomendado
Industrial Control and Motor Drive
Industrial control and motor drive applications benefit from the EP1S80B956C6AB's 79,040 LEs and 683 I/Os, which can host multi-axis motion controllers, encoder interfaces (EnDat, BISS, SSI), and fieldbus bridges (EtherCAT, PROFINET) simultaneously. Designers implement current/torque loops in hardware DSP blocks for deterministic sub-microsecond response, while the high pin count supports parallel GPIO for limit switches, brake drivers, and resolver excitation. The 1.5 V core with industrial temperature grade (per datasheet ordering suffix) operates reliably in factory environments.
Recomendado
Military and Aerospace Avionics
Military and aerospace avionics historically deploy the EP1S80B956C6AB for radar, electronic warfare, and secure communications because high-density FPGAs with hardware-level parallelism deliver deterministic latency impossible on processors. The 956-BGA FCBGA supports ruggedized PCB stack-ups, and the Stratix family offers extended-temperature and military-qualified ordering codes. Designers implement FFT-based signal detection, cryptographic primitives, and protocol bridges on a single device. Reference: Altera/Intel military and aerospace product briefs for original Stratix.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1S80B956C6AB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1S80B956C6 | EP1S80B956C6AA | EP1S60B956C6 | EP1S80B956C5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 956-BGA (FCBGA) | 956-BGA (FCBGA) - same | 956-BGA (FCBGA) - same | 956-BGA (FCBGA) - same | 956-BGA (FCBGA) - same |
| Logic Elements | 79,040 LEs | 79,040 LEs | 79,040 LEs | 57,120 LEs (-28%) | 79,040 LEs |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | C6 | C6 (same) | C6 + AA suffix | C6 | C5 (slower) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Family | Stratix | Stratix | Stratix | Stratix | Stratix |
Diferenciadores clave
- Pin-compatible with 956-BGA family members for flexible sourcing (frente a EP1S60B956C6)
- High pin-count 956-BGA supports 683 I/Os (frente a EP1S80B956C5N)
- Legacy Altera/Intel design ecosystem support (frente a Generic FPGAs)
Notas de diseño
Estimated: at typical Stratix core utilization of 70% and 200 MHz toggle rate, the EP1S80B956C6AB dissipates 6-10 W; design the 956-BGA PCB with a thermal pad soldered to a large inner-plane copper pour (minimum 4 sq inches) to keep junction temperature below 100 °C. Reference: Altera Stratix PowerPlay early power estimator guidelines.
The 956-BGA package has 1.0 mm pitch typical for Stratix FCBGA. Use microvia or stacked-via PCB technology and follow Altera's BGA escape routing guidelines. Place decoupling capacitors within 100 mil of every VCC pin and use a power-plane island beneath the BGA. Reference: Altera Stratix Hardware Reference Design Guidelines.
Do not migrate the EP1S80B956C6AB design to a Stratix II device (EP2S series) without a full PCB redesign because the Stratix II BGA pinout is not pin-compatible. Verify Quartus II version supports the original Stratix family: only legacy Quartus II (up to v9.x for Stratix I) compiles EP1S designs; newer Quartus versions reject this family.
Differential pairs (LVDS) on the EP1S80B956C6AB require matched-length routing within 50 mil and 100 ohm differential impedance. Use IBIS models from Intel/Altera for SI simulation. Reference: Altera Stratix Device Handbook, LVDS chapter.
Información de cumplimiento
RoHS compliant per distributor listings (Arrow). AEC-Q100 not applicable - this is a commercial/industrial FPGA. Lead-free per datasheet. Halogen-free status unknown from provided data.
