EP1S80B956C6AA - Stratix FPGA 79,040 LEs 956-BGA | Intel
MPN: EP1S80B956C6AA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 50 | $248 | $12,400.00 |
| 100 | $235 | $23,500.00 |
| 500 | $215 | $107,500.00 |
Drop-in alternatives for EP1S80B956C6AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S80B956C6AA Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Process Node | 130 nm |
| Logic Elements | 79,040 |
| M4K RAM Blocks | 742 |
| User I/O Pins | 683 |
| Package | 956-BGA |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | MultiVolt (1.5 V, 1.8 V, 2.5 V, 3.3 V) |
| Speed Grade | C6 |
| Operating Temperature | Commercial (0C to +85C) - inferred from C6 suffix |
| Configuration Scheme | Active Serial / Passive Serial / JTAG |
| PLLs | 6 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead free / RoHS Compliant |
| Legacy Status | Obsolete - Mult Device EOL 1/Jun/2017 |
EP1S80B956C6AA Pin Configuration
| Pin A1 | I/O — User I/O bank 1 |
| Pin A2 | VCCIO1 — I/O bank 1 supply |
| Pin A3 | GND — Ground |
| Pin B1 | I/O — User I/O bank 1 |
| Pin B2 | I/O — User I/O bank 1 |
| Pin B3 | VCCINT — Core supply 1.5 V |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S80B956C6AA is suitable for 6 applications: Telecom Line-Card Packet Processing, ASIC Prototyping and Emulation, High-Throughput DSP Pipeline (Baseband / FFT), Broadcast Video Processing, High-Speed Data Acquisition, Industrial Control and Robotics.
Telecom Line-Card Packet Processing
The EP1S80B956C6AA's 79,040 logic elements and 742 M4K RAM blocks make it well suited for telecom line-card packet processing engines that require parallel lookup tables, queue managers, and protocol state machines. With 683 user I/O pins, the device supports multiple high-bandwidth LVDS links to network processors and external TCAMs simultaneously, a configuration often required in 10G/40G Ethernet line cards. The 6 PLLs and 12 global clock networks allow independent frequency domains for fabric, fabric-to-network interfaces, and packet-classifier cores. Compared with ASIC alternatives, the FPGA design cycle is 3-6 months shorter and supports field upgrades for emerging protocols.
Recommended
ASIC Prototyping and Emulation
With 79,040 logic elements, the EP1S80B956C6AA serves as an ASIC prototyping platform for designs in the 30K-60K ASIC gate range, allowing engineers to validate RTL before committing to silicon. The 956-BGA package exposes 683 I/O pins to enable multi-FPGA partitioning with high-pin-count ASIC designs. Designers commonly stack multiple EP1S80B956C6AA devices via a custom backplane to emulate ASICs up to 1-2 million gates, with LVDS providing the gigabit inter-FPGA links required for timing-accurate emulation. Quartus II synthesis results closely match ASIC timing after appropriate constraints are applied.
Recommended
High-Throughput DSP Pipeline (Baseband / FFT)
The EP1S80B956C6AA's dedicated 18x18 multiplier blocks and 742 M4K RAM blocks enable implementation of multi-channel FFT engines, FIR filter banks, and baseband processors for wireless infrastructure. Each M4K block supports dual-port access at up to 135 MHz in the -6 speed grade, allowing systolic FIR architectures to process 8-16 parallel streams. For 3G/4G base-station applications, a single EP1S80B956C6AA can implement a complete antenna-carrier processing chain including FFT/iFFT, channel estimation, and modulator/demodulator, with the 683 I/O enabling LVDS connections to ADCs and DACs.
Recommended
Broadcast Video Processing
The EP1S80B956C6AA supports broadcast video standards including SD-SDI, HD-SDI, and 3G-SDI through its high-speed LVDS I/O and dedicated serializer/deserializer logic. The 79,040 logic elements and 683 I/O pins allow multi-channel video processing - for example, simultaneous quad-channel HD-SDI format conversion, color-space conversion, and frame-rate conversion. Embedded memory of approximately 7.4 Mbit provides line buffering for real-time video scaling and deinterlacing without external SDRAM. Compared with ASSP video processors, the FPGA solution enables custom proprietary codecs and customer-specific overlays.
Recommended
High-Speed Data Acquisition
The EP1S80B956C6AA's 683 I/O pins accommodate high-channel-count parallel ADCs in scientific and industrial data acquisition systems, particularly oscilloscopes, spectrum analyzers, and medical imaging front-ends. The embedded M4K RAM blocks function as deep capture buffers, enabling multi-megasample transient capture before store-to-DDR. With 6 PLLs providing low-jitter clocks to the ADC interface, the device supports ADC sampling rates up to 500 MSPS per channel in typical configurations. Quartus II's TimeQuest timing analyzer closes timing on the strict setup/hold windows required by precision converters.
Recommended
Industrial Control and Robotics
The EP1S80B956C6AA enables complex multi-axis motion controllers in industrial robotics, where deterministic low-latency response is critical. Its 79,040 logic elements support servo-loop computation, trajectory planning, and EtherCAT/Ethernet/IP protocol stacks concurrently, while 683 I/O pins connect to encoder interfaces, drive enables, and safety chains. Compared with microcontroller-based controllers, the FPGA delivers microsecond-cycle deterministic response and parallel servo-loop computation, enabling higher axis counts per controller. Industrial-grade variants of the Stratix family deliver -40C to +100C operation for factory-floor deployment.
Recommended
Recommended Products Summary
Engineering reference data for EP1S80B956C6AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S80B956C6 | EP1S80B956C5N | EP1S60B956C6 | EP1S40B956C6 | EP1S30B956C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 956-BGA | 956-BGA (same) | 956-BGA (same) | 956-BGA (same) | 956-BGA (same) | 956-BGA (same) |
| Logic Elements | 79,040 | 79,040 | 79,040 | 57,120 (-27.7%) | 41,250 (-47.8%) | 32,470 (-58.9%) |
| User I/O Pins | 683 | 683 | 683 | [DATA_NEEDED: I/O count for EP1S60B956] | [DATA_NEEDED: I/O count for EP1S40B956] | [DATA_NEEDED: I/O count for EP1S30B956] |
| M4K RAM Blocks | 742 | 742 | 742 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | C6 | C6 | C5 (slower) | C6 | C6 | C6 |
| Lead-Free / RoHS | Yes (AA suffix) | No (SnPb finish) | Yes (N suffix) | No | No | No |
| Lifecycle Status | Obsolete (EOL Jun 2017) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest logic density in the original Stratix family (vs EP1S60B956C6)
- RoHS-compliant lead-free finish in the AA suffix (vs EP1S80B956C6)
- -6 speed grade Fmax vs -5 grade -15% reduction (vs EP1S80B956C5N)
Design Notes
Power the EP1S80B956C6AA with a sequence of VCCINT (1.5 V core) before VCCIO to avoid I/O bus contention during incomplete power-up. Recommended ramp time is 1-100 ms with monotonic rise. Decouple every VCCINT/VCCIO ball pair with 0.1 uF and 10 uF ceramic capacitors placed within 50 mils of the BGA ball. Use the TPS3808 voltage supervisor with active-low RESET to hold the device in configuration mode during power ramp.
The 956-BGA package uses 1.00 mm ball pitch, requiring 4-6 layer PCB with microvia-in-pad construction for reliable assembly. Use ENIG (Electroless Nickel Immersion Gold) or OSP (Organic Solderability Preservative) surface finish. Route signal traces on inner layers between BGA pads using dog-bone fan-out. Maintain controlled impedance (50 ohm single-ended, 100 ohm differential) for LVDS pairs to avoid signal-integrity violations at 500+ MHz toggling rates.
Do not assume the EP1S80B956C6AA's configuration file format is compatible with newer Quartus versions. Use Quartus II 13.0sp1 or earlier for bitstream generation. Verify that the configuration mode (AS, AP, PS, FPP, JTAG) matches the EPCS/EPCQ serial flash selected for the design. Avoid mixing the EP1S80B956C6 (SnPb) with the EP1S80B956C6AA (RoHS) on the same assembly run, as this violates lead-free process control.
Estimated: the EP1S80B956C6AA's thermal resistance (theta_JA) is approximately 12-15 C/W on a 4-layer PCB with 1 oz copper and forced-air cooling. At maximum power of 6-9 W typical for a 79,040-LE design running at full DSP utilization, the junction temperature rises approximately 90-135 C above ambient. Without forced-air cooling, derate by 30% or attach a heatsink via thermal interface material to the package top surface.
Compliance Information
AA suffix denotes lead-free RoHS compliant finish per distributor listings (Components-Store.com). Device EOL 1/Jun/2017 per full-electronic.com PCN documentation. REACH compliance status not explicitly stated in verified data.
