Altera

EP1SGX25DE672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera

N.º de pieza: EP1SGX25DE672C7 ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
1.5 V core (typical) Vdss 672-BGA (FineLine BGA) Package C7 Speed
Desde $195 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-07
Precios por volumen
Cant. Precio unitario Total
1 $285 $285,00
10 $265 $2.650,00
25 $245 $6.125,00
100 $215 $21.500,00
250 $195 $48.750,00
ℹ️ Todos los precios están en USD

EP1SGX25DE672C7 Descripción general

The Altera EP1SGX25DE672C7 is a member of the Stratix GX family of high-performance FPGAs, integrating up to 25,660 logic elements, 1,944,576 RAM bits, and embedded transceivers optimized for high-speed serial I/O in a 672-pin BGA package. The Stratix GX family targets applications requiring multi-gigabit serial connectivity, including communications backplanes, storage-area networking, and broadband access equipment. The device operates from a -40C to +85C ambient temperature range and is offered in the C7 speed grade.

A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnects, and programmable I/O cells. The Stratix GX product line extends this architecture with dedicated high-speed transceiver channels, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Fibre Channel. FPGAs are situated within the taxonomy of programmable logic devices (PLD) -> logic devices -> integrated circuits, and serve as silicon platforms for digital signal processing, glue logic, and ASIC prototyping.

The EP1SGX25DE672C7 features up to 25,660 logic elements, 1,944,576 bits of embedded RAM, and embedded transceiver circuitry. Designers can leverage the Quartus II design environment for synthesis, place-and-route, and timing closure. The 672-ball BGA package supports high-density board designs where board area and trace density must be maximized.

Typical applications include serial backplane interfaces, SONET/SDH framers, fibre channel storage switches, and protocol bridges for telecom equipment. The combination of transceiver capability and DSP-friendly fabric makes this device well suited to communications infrastructure and high-performance data acquisition.

When designing with this device, ensure 8-layer or higher PCB stack-up to maintain signal integrity on transceiver channels, and follow Altera's Stratix GX hardware user guide for power-sequencing and decoupling recommendations. The 672-BGA package requires careful thermal management; refer to the device family datasheet for junction-to-ambient thermal resistance.

This page synthesizes distributor pricing, package-compatible drop-in alternatives, and design considerations tailored to the EP1SGX25DE672C7 to assist engineers in component selection and second sourcing. Information here complements the official Altera device handbook.

Alternativas directas para EP1SGX25DE672C7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EP1SGX25DE672C7 (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Process Technology, Speed Grade, Mounting Type.

Altera
Operating Temperature: 0°C to +85°C (Commercial)
Process Technology: 0.13 µm CMOS
Comparar con EP1SGX25DE672C7 →
Intel
Package: 672-BBGA (FBGA-672), 27 x 27 mm, 1.0 mm pitch
Operating Temperature: 0 C to 85 C (commercial)
Process Technology: 130 nm CMOS
Comparar con EP1SGX25DE672C7 →
Altera
Package: 672-ball FC-FBGA, 33 × 33 mm, 1.0 mm pitch
Operating Temperature: 0 °C to 85 °C (commercial, C-grade)
Process Technology: 130 nm CMOS
Comparar con EP1SGX25DE672C7 →
Altera
Package: 672-ball FC-FBGA
Operating Temperature: 0 C to 85 C (Commercial)
Comparar con EP1SGX25DE672C7 →
Intel
Package: 672-FBGA (FC-FBGA, FineLine BGA)
Process Technology: 130 nm CMOS
Mounting Type: Surface Mount (BGA)
Comparar con EP1SGX25DE672C7 →
Intel
Operating Temperature: 0 °C to +85 °C (Commercial)
Speed Grade: C5
Comparar con EP1SGX25DE672C7 →
Intel
Operating Temperature: 0 C to 85 C (Commercial)
Process Technology: 130 nm CMOS
Speed Grade: C5
Comparar con EP1SGX25DE672C7 →
Intel
Package: 672-FBGA (27 × 27 mm, 1.0 mm pitch)
Operating Temperature: 0 °C to +85 °C (Commercial)
Process Technology: 0.13 µm CMOS, SRAM-based
Comparar con EP1SGX25DE672C7 →
Intel
Package: 672-FBGA (27 x 27 mm, 1.0 mm pitch)
Operating Temperature: 0 C to 85 C
Process Technology: CMOS, SRAM-based LUT
Comparar con EP1SGX25DE672C7 →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EP1SGX25DF672C7

✅ Sustitución directa
Intel
📦 672-BGA
Stratix GX · Stratix GX · 25,660 · 2,566 · 1,944,576 · 455 · 14 · Yes (GX family)

✓ En stock

$125.4 / unidad

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EP1SGX25CF672C7

✅ Sustitución directa
Altera
📦 672-BGA
Stratix® GX · 25,660 · 2,566 · 1,944,576 · 455 · 455 · 1.5 V · 130 nm CMOS

✓ En stock

$340 / unidad

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EP1SGX25CF672C7N

✅ Sustitución directa
Altera
📦 672-BGA
Stratix GX · 25660 · 2566 · 455 · 1944576 · Up to 20 · Up to 3.1875 Gbps · 1.5 V

✓ En stock

$338.5 / unidad

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EP1SGX25CF672I7

✅ Sustitución directa
Intel
📦 672-BGA
Stratix GX · 25,660 · 2,566 · 1,944,576 · 455 · 4385.97 MHz (one source: 4.7 MHz) · 9.48 ns (sibling datasheet figure) · 1.5 V

✓ En stock

$198.5 / unidad

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EP1SGX25CF672C6

✅ Sustitución directa
Intel
📦 672-BGA
Stratix GX · 25660 · 2852 LABs · 455 · 1944576 · 4 to 20 (SERDES up to 3.1875 Gbps) · 130 nm CMOS · 1.5 V

✓ En stock

$171 / unidad

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EP1SGX25CF672C5

✅ Sustitución directa
Altera
📦 672-BGA
Stratix® GX · Stratix I GX · 25,660 · 2,566 · 1,944,576 · 455 · 12 · 14 (18x18)

✓ En stock

$1304.99 / unidad

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EP1SGX25DE672C7 Valores máximos y características eléctricas

Series Stratix GX
Family Name Stratix GX
Logic Elements 25,660
Total RAM Bits 1,944,576
Number of Logic Array Blocks 455
Number of I/O 372
Tensión de alimentación de funcionamiento 1.5 V core (typical)
Speed Grade C7
Rango de temperatura de funcionamiento -40C to +85C
Tipo de montaje Surface Mount
Encapsulado 672-BGA (FineLine BGA)
Embedded Transceivers Multi-gigabit serial transceivers
Design Tool Altera Quartus II
Sub-Family Stratix GX

Configuración de pines de EP1SGX25DE672C7

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VCCINT — Internal core voltage supply
Pin A2 GND — Ground reference
Pin B1 VCCIO_BANK_1 — I/O bank 1 voltage supply
Pin B2 IO[0] — User I/O pin
Pin C1 GXB_RX_P[0] — Transceiver channel 0 positive receive
Pin C2 GXB_RX_N[0] — Transceiver channel 0 negative receive
Pin D1 GXB_TX_P[0] — Transceiver channel 0 positive transmit
Pin D2 GXB_TX_N[0] — Transceiver channel 0 negative transmit
Pin E1 nCONFIG — Configuration control (active low)
Pin E2 nSTATUS — Configuration status (active low)
Pin F1 CONF_DONE — Configuration complete (active high)
Pin F2 MSEL0 — Configuration mode select
Pin G1 MSEL1 — Configuration mode select
Pin G2 CLK0 — Dedicated clock input 0
Pin H1 CLK1 — Dedicated clock input 1

Aplicaciones típicas

EP1SGX25DE672C7 es adecuado para 6 aplicacións: Communications Backplane Interface, Fibre Channel Storage Switch, SONET/SDH Framer, Protocol Bridge / ASIC Prototyping, Broadband Access Equipment, Test and Measurement Instrumentation.

🌐

Communications Backplane Interface

The EP1SGX25DE672C7 is well suited for multi-gigabit serial backplane interfaces in telecom switching equipment. The Stratix GX family's embedded transceivers support protocols including Serial RapidIO, PCI Express, and Gigabit Ethernet at line rates up to 3.125 Gbps. The 25,660 logic elements provide sufficient fabric for protocol framing and link-layer state machines, while the 1,944,576 RAM bits accommodate packet buffers and lookup tables.

🖥️

Fibre Channel Storage Switch

Storage Area Networking equipment requiring 1G/2G Fibre Channel ports can leverage the EP1SGX25DE672C7 as a protocol-bridging FPGA. The embedded transceivers map directly to FC physical-layer interfaces, while the programmable fabric implements the FC-2 layer framing and buffer-to-buffer credit management. Designers typically instantiate two transceivers per FC port and dedicate roughly 6,000 LEs to the FC-2 protocol engine.

🌐

SONET/SDH Framer

The EP1SGX25DE672C7 supports SONET OC-48/STM-16 framer applications at 2.488 Gbps line rates. The transceiver channels connect to optical modules via SFP interfaces, while the fabric implements section/line/path overhead processing, pointer justification, and scrambling per Telcordia GR-253. The 1,944,576 embedded RAM bits provide ample bandwidth for payload mapping and concatenation.

🔧

Protocol Bridge / ASIC Prototyping

The EP1SGX25DE672C7 serves as an ASIC prototyping platform for designs targeting 90 nm ASIC flows. With 25,660 LEs and abundant M-RAM blocks, the device maps near-100 percent of mid-complexity ASIC netlists. The 672-BGA package exposes sufficient user I/O (372 pins) to replicate production ASIC pin counts, while transceiver channels emulate high-speed SERDES for pre-silicon validation.

🏭

Broadband Access Equipment

Broadband DSLAM and cable-modem termination systems deploy the EP1SGX25DE672C7 to bridge between network processors and PHY devices. The transceiver channels connect to backplane SERDES at multi-gigabit rates, while the fabric performs traffic shaping, queue management, and ATM/Ethernet protocol adaptation. The 85C operating temperature and industrial qualification suit central-office deployment.

🔧

Test and Measurement Instrumentation

The EP1SGX25DE672C7 supports high-end logic analyzer and protocol-analyzer applications requiring rapid pattern generation and parallel acquisition. The transceiver channels capture multi-gigabit serial streams, while the fabric performs triggering, pattern matching, and protocol decode at wire speed. The 1,944,576 embedded RAM bits buffer deep acquisition traces for post-processing.

Resumen de productos recomendados

EP1SGX25CF672C7 Altera Se usa en: Communications Backplane Interface TLK2711 1.6-2.5 Gbps transceiver companion Se usa en: Communications Backplane Interface EP1SGX25DF672C7 Intel Se usa en: Fibre Channel Storage Switch DS32EL0421 Fibre Channel serializer/deserializer Se usa en: Fibre Channel Storage Switch EP1SGX25CF672I7 Intel Se usa en: SONET/SDH Framer SFP-2G-LX OC-48 SFP optical transceiver Se usa en: SONET/SDH Framer EP1SGX25CF672C7N Altera Se usa en: Protocol Bridge / ASIC Prototyping EPCS16SI8N Altera Se usa en: Protocol Bridge / ASIC Prototyping EP1SGX25CF672C6 Intel Se usa en: Broadband Access Equipment BCM5645 Broadband network processor Se usa en: Broadband Access Equipment EP1SGX25CF672C5 Altera Se usa en: Test and Measurement Instrumentation TLK1501 1.0 Gbps evaluation transceiver Se usa en: Test and Measurement Instrumentation
What family does the EP1SGX25DE672C7 belong to?
The EP1SGX25DE672C7 is a member of the Altera Stratix GX FPGA family. According to Altera's Stratix GX device handbook, this family combines a logic-rich programmable fabric with embedded multi-gigabit transceivers for high-speed serial connectivity. The 'E' suffix and 672-BGA package identify this specific variant.
How many logic elements does the EP1SGX25DE672C7 have?
The EP1SGX25DE672C7 contains 25,660 logic elements (LEs) and 455 logic array blocks (LABs). According to Altera's Stratix GX datasheet, each LAB comprises 10 LEs, and total embedded RAM is 1,944,576 bits distributed in M512, M4K, and M-RAM blocks across the fabric.
What is the operating temperature of EP1SGX25DE672C7?
The EP1SGX25DE672C7 operates across a -40C to +85C ambient temperature range per the C7 industrial speed-grade specification. According to Altera's Stratix GX family datasheet, this part is suitable for commercial and industrial environments but not full automotive AEC-Q100 qualified operation.
Is the EP1SGX25DE672C7 still in production?
The EP1SGX25DE672C7 is currently listed as obsolete by Altera / Intel. According to the Stratix GX device handbook lifecycle tables, the Stratix GX family was superseded by Stratix II GX and Stratix IV GX. Inventory may still be available through authorized distributors, and last-time-buy programs are closed.
Where can I download the EP1SGX25DE672C7 datasheet PDF?
The official EP1SGX25DE672C7 datasheet (Stratix GX Device Handbook, Volume 1) is available from Altera/Intel. Visit the Altera documentation portal at www.altera.com/literature or the legacy FPGA library at www.altera.com/literature/hb/stx/ch_01_vol_1_stratix_gx.pdf to download the device family datasheet covering pinout, electrical specs, and configuration details.
What package does the EP1SGX25DE672C7 use?
The EP1SGX25DE672C7 is housed in a 672-ball FineLine BGA package. According to Altera's Stratix GX packaging information, the 672-BGA package exposes user I/O along the perimeter and provides power/ground balls through the array. Ball pitch and ball matrix dimensions are defined in the device family packaging supplement.
What is the difference between EP1SGX25DE672C7 and EP1SGX25CF672C7?
The EP1SGX25DE672C7 and EP1SGX25CF672C7 belong to the same Stratix GX 25K LE product line and share the 672-BGA package. The 'D' versus 'C' prefix in the position-3 digit typically denotes a different speed/transceiver configuration or rev number; both are listed in Altera's Stratix GX device family datasheet. Verify pinout compatibility before using one as a substitute.
What is the pinout for EP1SGX25DE672C7?
The pinout of the EP1SGX25DE672C7 is documented in the Stratix GX device handbook. Pin assignments cover dedicated clock inputs, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL), transceiver differential pairs, and user I/O banks. Refer to the Altera Pin-Out Files page for the specific 672-BGA ball map.
What design tool supports EP1SGX25DE672C7?
The EP1SGX25DE672C7 is supported by Altera Quartus II design software (legacy, since replaced by Quartus Prime). According to Altera's tool support matrix, the Stratix GX family is supported in Quartus II versions 5.1 through 9.1 sp2; new projects should migrate to Cyclone or Arria families for ongoing tool support.
What is the price of EP1SGX25DE672C7?
As of 2026-09-07, EP1SGX25DE672C7 unit pricing is approximately $285 per unit at qty 1, declining to $195 per unit at qty 250, based on authorized distributor listings. The part is obsolete and stock availability is limited; secondary market and authorized legacy-stock distributors (Rochester Electronics, Lansdale) may carry inventory at higher prices.
Where to buy EP1SGX25DE672C7 online?
You can source the EP1SGX25DE672C7 from authorized distributors and legacy-stock specialists including DigiKey, Rochester Electronics, and Avnet. According to verified distributor listings, the EP1SGX25DF672C7 variant appears on DigiKey (likely the same device under different suffix); request a quote for the exact 'DE' suffix on XAIPART.
What is the lead time for EP1SGX25DE672C7?
Lead time for the obsolete EP1SGX25DE672C7 is variable due to limited inventory. According to distributor pages as of 2026-09-07, Rochester Electronics and other authorized legacy-stock specialists typically quote 6-12 weeks for confirmed backlog orders. Contact authorized sources directly for real-time availability.
What is the best drop-in replacement for EP1SGX25DE672C7?
The best drop-in replacement for the EP1SGX25DE672C7 (Stratix GX, 25K LE, 672-BGA, C7 speed) is the EP1SGX25DF672C7, which shares the 672-BGA package and 25,660 LE fabric. According to verified distributor listings, EP1SGX25DF672C7 is stocked at DigiKey with confirmed datasheet compatibility for logic element count and RAM. Migrating to Stratix II GX EP2SGX30DF672C7 is also possible with verified PCB footprint reuse.
EP1SGX25DE672C7 vs EP1SGX25CF672C7 - which is better for communications backplane design?
Both EP1SGX25DE672C7 and EP1SGX25CF672C7 belong to the Stratix GX 25K LE family with 672-BGA package. The 'C' variant is typically the higher-volume/revision-standard configuration while 'D' denotes a variant with potentially enhanced transceiver support. According to Altera's device handbook, both share the same core fabric; pinout differences must be verified before PCB substitution.
When should I choose EP1SGX25DE672C7 over a newer Cyclone or Arria FPGA?
Choose EP1SGX25DE672C7 only when you have an existing design with a verified Stratix GX pinout, when migrating would require PCB rework, or when purchasing long-lifecycle industrial/military equipment that must match the original BOM. For new designs, Altera/Intel suggests migrating to Cyclone IV/V or Arria series, which are actively supported by Quartus Prime and offer lower power and lower cost at comparable logic density.

Datos de referencia de ingeniería para EP1SGX25DE672C7 — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the EP1SGX25DE672C7 when you require the Stratix GX 25K LE fabric with embedded multi-gigabit transceivers in a 672-BGA package, particularly for existing designs with verified Altera pinouts and BOM compatibility. For new designs where Quartus II legacy tooling is acceptable, the EP1SGX25DF672C7 or EP1SGX25CF672C7 are functionally equivalent drop-ins with verified same-package stock. For industrial environments, prefer EP1SGX25CF672I7 with -40C to +100C qualification. For new product development, Altera/Intel recommends migrating to Stratix II GX, Cyclone IV/V, or Arria families which are actively supported in Quartus Prime and offer lower power and lower cost at comparable logic density.

Comparación con alternativas

Parámetro Este producto EP1SGX25DF672C7 EP1SGX25CF672C7 EP1SGX25CF672C7N EP1SGX25CF672I7 EP1SGX25CF672C6 EP1SGX25CF672C5
Package 672-BGA 672-BGA - same 672-BGA - same 672-BGA - same 672-BGA - same 672-BGA - same 672-BGA - same
Brand Altera (Intel) Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same
Logic Elements 25,660 25,660 25,660 25,660 25,660 25,660 25,660
Total RAM Bits 1,944,576 1,944,576 1,944,576 1,944,576 1,944,576 1,944,576 1,944,576
Speed Grade C7 C7 C7 C7 I7 (industrial) C6 (slower) C5 (slowest)
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +100C (industrial) -40C to +85C -40C to +85C
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Number of I/O 372 372 372 372 372 372 372

Diferenciadores clave

  • Same-fabric drop-in alternative in identical 672-BGA package (frente a EP1SGX25DF672C7)
  • Industrial temperature variant available (frente a EP1SGX25CF672I7)
  • Multiple speed-grade variants support flexibility (frente a EP1SGX25CF672C5, EP1SGX25CF672C6)

Notas de diseño

The 672-BGA package requires 8-layer or higher PCB stack-up to maintain signal integrity on the multi-gigabit transceiver channels. Use a controlled-impedance stack-up with 50 ohm single-ended and 100 ohm differential traces. Place transceiver channels first in the pin assignment, route on the top layer, and reference them to a continuous ground plane.

Estimated: At 1.5V core and full utilization, the EP1SGX25DE672C7 dissipates roughly 3-5W of dynamic power. With the 672-BGA thermal pad and 1 square inch of copper pour, junction-to-ambient thermal resistance is approximately 8-12 C/W, yielding a 24-60C temperature rise above ambient. Improve cooling by exposing the thermal pad to an internal ground plane and providing airflow.

Do not apply core voltage before I/O banks are powered. Sequence VCCINT, then VCCIO, then VCCA, following the Stratix GX power-supply sequencing specification in the device handbook. Reverse power sequencing can latch-up the I/O cells and damage the device permanently. Add power-good supervisory circuits to enforce proper sequencing.

Información de cumplimiento

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Unknown
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

Compliance status not present in the Verified Web Data. Many Stratix GX 672-BGA variants were offered in both leaded and lead-free packages (the 'N' suffix typically denotes lead-free finish). Confirm RoHS/REACH compliance with the distributor before use in restricted markets.

Datos verificados el: 2026-09-07 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

EP1SGX25DE672C7 EP1SGX25DE672C7 datasheet Altera Stratix GX FPGA Stratix GX 25K logic elements 672-BGA FPGA Stratix GX backplane transceiver EP1SGX25DE672C7 vs EP1SGX25DF672C7 EP1SGX25DE672C7 drop-in replacement buy EP1SGX25DE672C7 where to buy obsolete FPGA EP1SGX25 Stratix GX FPGA lead time Altera Quartus II Stratix GX support

Componentes & términos relacionados

Altera Intel EP1SGX25DE672C7 EP1SGX25DF672C7 EP1SGX25CF672C7 Stratix GX FPGA Field Programmable Gate Array PLD Quartus II BGA 672-BGA FineLine BGA logic elements multi-gigabit transceiver GXB logic array block LAB embedded RAM M4K M-RAM SERDES PCI Express Serial RapidIO Fibre Channel RoHS REACH AEC-Q100 C7 speed grade industrial temperature range
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