EP1SGX25CF672C7N - 25K LE Stratix GX FPGA 672-FBGA | Altera
MPN: EP1SGX25CF672C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485.92 | $485.92 |
| 10 | $432.5 | $4,325.00 |
| 100 | $398.2 | $39,820.00 |
| 500 | $365 | $182,500.00 |
| 1,000 | $338.5 | $338,500.00 |
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View Datasheet →EP1SGX25CF672C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25660 |
| Logic Array Blocks (LABs) | 2566 |
| User I/O Pins | 455 |
| Embedded Memory Bits | 1944576 |
| High-Speed Transceiver Channels | Up to 20 |
| Transceiver Data Rate | Up to 3.1875 Gbps |
| Core Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Package | 672-ball FC-FBGA |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Configuration Method | SRAM (volatile, requires external flash) |
| Lead-Free / RoHS | RoHS3 Compliant |
| Logic Family / Process | CMOS, 1.5 V core |
| Mounting Type | Surface Mount |
EP1SGX25CF672C7N 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX25CF672C7N (33 x 33 mm package) with 455 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25CF672C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 455 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25CF672C7N is suitable for 6 applications: 10 Gbps Telecom Line Card Interface, Serial RapidIO Bridge in Embedded Computing, Backplane Aggregation in Switch Fabric, Protocol Converter ASIC/FPGA Replacement, Test and Measurement Equipment Front End, PCI Express Endpoint and Switch.
10 Gbps Telecom Line Card Interface
The EP1SGX25CF672C7N is well matched to telecom line card designs where aggregated serial I/O bandwidth exceeds the capability of lower-density FPGAs. Its 20 transceiver channels at up to 3.1875 Gbps each support protocols such as XAUI, OC-48, and multi-channel Gigabit Ethernet when paired with the Stratix GX soft IP. The 25,660 logic elements and 1,944,576 bits of embedded memory are sufficient to implement the entire MAC, PCS layer, and ingress buffering for a multi-port line card in a single device, while the 672-ball FC-FBGA package provides 455 user I/Os for parallel backplane connections and external memory bus expansion.
Recommended
Serial RapidIO Bridge in Embedded Computing
For embedded computing applications that aggregate Serial RapidIO (SRIO) traffic between DSPs, microprocessors, and switched fabrics, the EP1SGX25CF672C7N provides the integrated 3.1875 Gbps SERDES, CDR, and clock recovery circuitry required for both 1x and 4x SRIO link widths. The 1.5 V core and 25,660 logic elements are sufficient to implement an SRIO endpoint or switch plus a parallel RapidIO-to-PCIe or RapidIO-to-Ethernet bridge in a single device. The 672-ball FC-FBGA package footprint integrates easily with 1.5 V power distribution networks common in VME and VPX backplanes, and the 455 user I/Os allow direct connection to multiple parallel DSP host ports.
Recommended
Backplane Aggregation in Switch Fabric
Switch fabric line cards aggregating traffic from multiple backplane lanes use the EP1SGX25CF672C7N to bridge serial backplane protocols such as Serial RapidIO, XAUI, and proprietary chip-to-chip links. The 20 transceiver channels can be partitioned into four groups of four plus a shared channel, supporting independent backplane fabrics. The 1,944,576 bits of TriMatrix embedded memory serve as packet buffers and queue managers, while the 25,660 logic elements implement the queue scheduling and traffic-management logic. The commercial 0 to 85 C operating range is suitable for centrally cooled switch chassis where board temperature is well controlled.
Recommended
Protocol Converter ASIC/FPGA Replacement
Engineers using the EP1SGX25CF672C7N as a drop-in replacement for obsolete ASIC-based protocol converters benefit from the integrated 3.1875 Gbps transceivers that eliminate external PHY chips. The 25,660 logic elements support complex protocol stacks including PCIe, XAUI, SRIO, and custom serial protocols without the NRE of an ASIC. The volatile SRAM configuration also allows in-field firmware updates through a configuration flash, enabling single-device designs to support multiple protocol variants by simply changing the loaded bitstream - a significant advantage over fixed-function ASIC implementations.
Recommended
Test and Measurement Equipment Front End
High-end protocol analyzers and BERT (bit error rate tester) front ends benefit from the EP1SGX25CF672C7N's 20 multi-gigabit transceivers, which can be dynamically reconfigured across multiple protocols via different bitstreams. The 455 user I/Os and 1.5 V core allow direct interface to high-speed ADCs, DACs, and parallel test data buses without external bus bridges. Per the Stratix GX datasheet, the transceiver CDR performance is well suited for pattern generation and analysis at 3.1875 Gbps, while the 25,660 logic elements can implement protocol-aware state machines for protocol-aware BER measurements.
Recommended
PCI Express Endpoint and Switch
The EP1SGX25CF672C7N implements PCI Express x1, x4, and x8 endpoints and root complexes through its integrated transceivers, eliminating external PCIe PHY chips. The Stratix GX PCIe hard IP and soft IP support PCIe Gen 1 at 2.5 Gbps per lane, while the remaining logic elements handle the application layer, DMA engines, and memory controllers. The 672-ball FC-FBGA package allows direct connection to multiple PCIe slots and downstream bridges. The volatile SRAM configuration is useful for development systems that need to test multiple PCIe configurations, while the 1.5 V core integrates with conventional 1.5 V power distribution networks used in add-in cards and blade servers.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25CF672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672C7 | EP1SGX25CF672C6N | EP1SGX25CF672C6 | EP1SGX25CF672C5 | EP1SGX25-CF672-I6 | EP1SGX10CF672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Elements | 25660 | 25660 (identical) | 25660 (identical) | 25660 (identical) | 25660 (identical) | 25660 (identical) | 10570 (-59%) |
| Speed Grade | C7 | C7 (identical) | C6 (slower, -1 grade) | C6 (slower, -1 grade) | C5 (slowest, -2 grades) | I6 (industrial, -1 grade) | C7 (identical) |
| User I/O Pins | 455 | 455 (identical) | 455 (identical) | 455 (identical) | 455 (identical) | 455 (identical) | [DATA_NEEDED] |
| Transceiver Channels | Up to 20 | Up to 20 (identical) | Up to 20 (identical) | Up to 20 (identical) | Up to 20 (identical) | Up to 20 (identical) | Fewer (lower density) |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Compliance | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant |
Key Differentiators
- Highest commercial speed grade in the Stratix GX 25K family (vs EP1SGX25CF672C6N)
- Full 20-channel transceiver capacity at mid-density logic (vs EP1SGX10CF672C7N)
- Commercial 0 to 85 C operating range (vs EP1SGX25-CF672-I6)
Design Notes
The 672-ball FC-FBGA package uses a 1.0 mm ball pitch, which requires laser-drilled micro vias or 0.8 mm drill holes in the PCB stack-up. Designers should follow the Stratix GX PCB design guidelines for breakout routing, escape pattern, and stack-up selection. Use a 6-8 layer PCB minimum with continuous ground planes adjacent to each signal layer to achieve the 3.1875 Gbps transceiver signal integrity. Vias-in-pad with filled and plated-over copper is recommended for the BGA balls to minimize stub lengths and to enable the package's full I/O density.
The EP1SGX25CF672C7N requires multiple supply rails including VCCINT (1.5 V core), VCCIO (I/O bank voltage, variable per bank), VCCA (PLL analog 1.5 V), VCCA_PLL (transceiver analog), and VCCCH (transceiver high-current). Per the Stratix GX datasheet, each transceiver quad can draw significant current during operation. Decoupling must be dense: place 0.1 uF and 0.01 uF ceramic capacitors as close as possible to every VCC and GND ball pair, and add bulk polymer or tantalum capacitors on each supply plane. A separate analog ground island connected to the main ground at a single point is required for the transceiver PLLs.
Estimated: based on a 33 x 33 mm FC-FBGA package, the EP1SGX25CF672C7N dissipates roughly 3-5 W typical in active use and up to 8-10 W with all 20 transceivers at 3.1875 Gbps. A 4-layer PCB with internal solid ground planes typically yields a theta_JA of approximately 18-22 C/W, giving a junction temperature rise of 80-110 C at 5 W - a thermal relief copper pour is required, and forced-air cooling is recommended. Configuration volatility is also a critical pitfall: the SRAM-based bitstream is lost on every power cycle, so an EPCS or EPCQ configuration flash and a reliable POR circuit are mandatory.
Each 3.1875 Gbps transceiver channel requires 100 ohm differential controlled-impedance routing (typically 85 ohm for the Stratix GX reference design), AC coupling capacitors of 100 nF on both TX and RX pairs, and short lengths from the BGA to the AC coupling caps. Per the Stratix GX transceiver design guide, ground stitching vias should be placed every lambda/10 (about 1.5-2 mm) along the differential traces. Skew between P and N within a pair must be under 5 ps, and length matching between TX and RX of a lane should be within 25 ps to maintain CDR lock.
Compliance Information
RoHS3 compliant per the alterachips.com product listing. REACH, halogen-free status, and conflict minerals compliance not stated in verified web data - set to 'unknown'. AEC-Q100 not applicable to FPGAs.
