EPF8282ATC100-2 - FLEX 8000 FPGA, 2.5K Gates, 100-TQFP | Intel
N.º de pieza: EPF8282ATC100-2 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
EPF8282ATC100-2 Descripción general
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing to implement arbitrary digital logic. The FLEX 8000 family sits in the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. FPGAs differ from CPLDs in their distributed SRAM-based configuration memory, which provides higher logic density and register-rich architectures at the cost of requiring external configuration storage on power-up.
Key features of the EPF8282ATC100-2 include in-circuit reconfigurability (ICR) via the serial configuration interface, JTAG boundary-scan test support, and a multi-volt I/O interface compatible with 5 V and 3.3 V signalling. The device integrates 282 flip-flops distributed across 26 LABs, supporting registered state machines, counters, and datapath logic. The MAX+PLUS II development system provides VHDL, Verilog HDL, and waveform design entry, synthesis, simulation, and timing analysis for the FLEX 8000 family.
The FLEX 8000 architecture is built on a continuous, hierarchical routing fabric with FastTrack interconnect lines spanning the entire device. Each LAB contains 8 logic elements (LEs) with a 4-input look-up table (LUT), programmable register, and carry-chain for arithmetic operations. Dedicated input pins and clock networks support synchronous design patterns common in bus interfacing, peripheral control, and telecommunications glue logic.
Typical applications include bus-interface bridging (PCI, ISA, VME), peripheral controllers, telecommunications line-card glue logic, industrial control state machines, and legacy system upgrades where ASIC-equivalent functionality is needed without the NRE cost. The 100-TQFP footprint makes the EPF8282ATC100-2 compatible with through-hole and surface-mount assembly lines that have been validated for the FLEX 8000 family.
Designers should verify timing closure with MAX+PLUS II timing analysis and budget sufficient I/O headroom for 5 V tolerance on legacy buses. Because the FLEX 8000 family has been in production for decades, second-source supply remains available from authorized distributors and stocking partners.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers source pin-compatible replacements for legacy FLEX 8000 designs.
Alternativas directas para EPF8282ATC100-2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF8282ATC100-2 (mismo factor de forma y huella) — difiere en Process Technology, Speed Grade, Configuration Method, Package, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF8282ATC100-3
✅ Sustitución directa✓ En stock
$10.25 / unidad
Ver hoja de datos →EPF8282ATC100-4
✅ Sustitución directa✓ En stock
$9.95 / unidad
Ver hoja de datos →EPF8282ATC100-2N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EPF8452ATC100-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EPF8636ATC100-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EPF8282ATC100-2 Valores máximos y características eléctricas
| Family | FLEX 8000 |
| Usable Gates | 2,500 |
| Logic Cells | 208 |
| Logic Array Blocks (LABs) | 26 |
| User I/Os | 78 |
| Flip-Flops | 282 |
| Tensión de alimentación | 5 V |
| Process Technology | 0.42 µm CMOS |
| Encapsulado | 100-pin TQFP |
| Temperatura de funcionamiento | 0 °C to 70 °C (Commercial) |
| Speed Grade | -2 |
| Tipo de montaje | Surface Mount |
| Configuration Memory | SRAM (volatile, requires external boot) |
| Development Tool | Altera MAX+PLUS II |
Guía de configuración de pines de EPF8282ATC100-2 100-pin tqfp
Configuración de pines para EPF8282ATC100-2 (encapsulado 100-pin tqfp). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF8282ATC100-2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF8282ATC100-2 es adecuado para 6 aplicacións: PCI/ISA Bus Interface Bridge, Industrial Control State Machine, Telecommunications Line-Card Glue Logic, Peripheral Controller (Printer, Scanner, Plotter), Legacy System Upgrade / Form-Fit-Function Replacement, VME / Multibus Backplane Interface.
PCI/ISA Bus Interface Bridge
The EPF8282ATC100-2's 78 user I/Os and 2,500 usable gates are well-matched to legacy PCI and ISA bus-bridge designs where 32-bit datapath glue logic, address decoding, and interrupt steering must be implemented in a single device. The 5 V I/O tolerance matches PCI's signalling environment directly without level shifters. With 282 flip-flops distributed across 26 LABs, the device can implement registered state machines for DMA controllers and bus-arbitration logic. Compared with a CPLD, the FLEX 8000 architecture provides higher register density and better timing predictability for multi-clock bus interfaces. Designers using MAX+PLUS II timing analysis can verify setup/hold margins against the PCI 33 MHz specification. The 100-TQFP footprint supports standard SMT assembly lines validated for industrial-grade electronics.
Recomendado
Industrial Control State Machine
The FLEX 8000 architecture's combination of 282 flip-flops, 26 LABs, and in-circuit reconfigurability makes the EPF8282ATC100-2 ideal for industrial control state machines that must adapt to evolving factory protocols. The 0 °C to 70 °C commercial temperature range covers most factory-floor environments, and the 5 V supply interfaces directly with 24 V-to-5 V industrial power rails. The MAX+PLUS II development flow supports VHDL and Verilog design entry, enabling migration from existing PLC logic to FPGA implementation. The 100-TQFP package is compatible with through-hole adapter boards for retrofit installations, and the SRAM-based configuration supports field firmware updates via JTAG. Designers appreciate the deterministic timing of the FastTrack interconnect for safety-critical interlocks.
Recomendado
Telecommunications Line-Card Glue Logic
In telecommunications line cards, the EPF8282ATC100-2 implements glue logic between framers, LIUs (line interface units), and network processors without the NRE cost of an ASIC. The 78 user I/Os accommodate multiple serial data streams, clock-domain crossings, and supervisory interfaces in a single device. The FLEX 8000 family's JTAG boundary-scan support simplifies board-level test on densely populated line cards, and the in-circuit reconfigurability allows remote firmware updates over the management interface. Compared with discrete 74-series logic, the EPF8282ATC100-2 reduces board area by 5-10× and improves signal integrity by minimizing inter-chip routing. The 5 V I/O tolerance interfaces directly with legacy T1/E1 framers and older LIU silicon.
Recomendado
Peripheral Controller (Printer, Scanner, Plotter)
The EPF8282ATC100-2 is a proven peripheral controller for legacy printers, scanners, and plotters where 2,500 gates and 78 I/Os are sufficient to implement motor control, sensor interfacing, and host-bus glue logic. The 0.42 µm CMOS process provides low static power consumption suitable for office equipment energy budgets. The 5 V I/O tolerance interfaces directly with TTL peripherals and stepper-motor drivers without level shifting. The 100-TQFP package supports automated SMT assembly lines common in high-volume office-equipment manufacturing. Designers appreciate the FLEX 8000 family's mature MAX+PLUS II tool chain, which provides stable simulation models and timing analysis critical for verifying complex motor-control algorithms before tape-out.
Recomendado
Legacy System Upgrade / Form-Fit-Function Replacement
The EPF8282ATC100-2 serves as a form-fit-function replacement for older discrete-logic and ASIC implementations in long-lifecycle systems such as medical instrumentation, military radios, and aerospace ground equipment. The 100-TQFP footprint matches the original FLEX 8000 land pattern, enabling direct PCB retrofit without re-spin. The SRAM-based configuration allows in-system updates when firmware patches are required, even decades after deployment. Per the Altera FLEX 8000 datasheet, the architecture supports JTAG boundary-scan for board-level test continuity with legacy test programs. Designers of long-lifecycle programs rely on authorized-distributor stocking programs to ensure multi-decade supply continuity for these mature FPGAs.
Recomendado
VME / Multibus Backplane Interface
The EPF8282ATC100-2 implements VMEbus and Multibus backplane interfaces in industrial and laboratory instrumentation, where 2,500 gates are sufficient for address decoding, bus arbitration, interrupt handling, and data buffering. The 78 user I/Os accommodate the VME D-size connector (96 pins minus power) and additional supervisory signals. The 5 V signalling matches VME standards directly without level translation, and the deterministic FastTrack interconnect simplifies timing closure for the 16 MB/s VME transfer rate. Compared with discrete 74LS and 74F glue logic, the EPF8282ATC100-2 reduces component count from 15-25 ICs to a single device, improving MTBF and reducing assembly cost. The 100-TQFP package supports both production SMT and prototype through-hole assembly.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF8282ATC100-2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF8282ATC100-3 | EPF8282ATC100-4 | EPF8282ATC100-2N | EPF8452ATC100-2 | EPF8636ATC100-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Usable Gates | 2,500 | 2,500 | 2,500 | 2,500 | 4,500 | 6,000 |
| Logic Cells | 208 | 208 | 208 | 208 | 336 | 504 |
| Speed Grade | -2 | -3 (faster) | -4 (fastest) | -2 (Pb-free) | -2 | -2 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| User I/Os | 78 | 78 | 78 | 78 | 78 | 78 |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
Diferenciadores clave
- Faster timing closure for high-speed bus interfaces (frente a EPF8282ATC100-2)
- Higher logic density for complex designs (frente a EPF8282ATC100-2)
- Maximum density for complex protocol aggregation (frente a EPF8282ATC100-2)
Notas de diseño
The EPF8282ATC100-2 requires a clean 5 V supply with adequate decoupling. Per the FLEX 8000 datasheet, place 0.1 µF ceramic bypass capacitors within 5 mm of every VCC pin and provide bulk decoupling (10-47 µF tantalum or ceramic) on the power plane. Estimated ICC (active, all I/Os switching) is approximately 50-100 mA depending on utilization and clock rate; designers should budget 500 mA peak from the 5 V regulator with 20% margin. During configuration download, ICC may spike briefly to 200 mA - the regulator must maintain regulation under this transient load.
The FLEX 8000 family uses SRAM-based configuration memory that is volatile - the bitstream must be reloaded from an external configuration PROM (typically EPC1 or EPC2) on every power-up. Designers frequently forget that JTAG programming does not persist across power cycles without an attached configuration device. For production systems, always include a configuration PROM in the BOM. Additionally, the 5 V I/O tolerance is absolute maximum 5.5 V; operation above this threshold damages the I/O cells. Designers migrating from 5 V to 3.3 V logic must verify signal-level compatibility before connecting mixed-voltage buses.
The 100-pin TQFP package has a thermal resistance θJA of approximately 50 °C/W in still air, rising to 35 °C/W with 100 LFM airflow. Estimated: at 50 mA ICC and 5 V supply, quiescent power dissipation is 0.25 W, yielding a junction temperature rise of 12.5 °C above ambient - well within the 0-70 °C commercial range. However, designers driving 78 I/Os at high toggle rates should add 0.5-1.0 W to the dissipation budget for IO switching losses. For enclosed systems, verify junction temperature with the manufacturer's thermal model before finalizing the mechanical design.
Información de cumplimiento
RoHS status not explicitly stated in verified web data; EPF8282ATC100-2N variant is lead-free per Octopart. AEC-Q100 not applicable for commercial-grade FPGAs. Designers requiring automotive qualification should consult the Intel/Altera automotive-grade FPGA portfolio instead.