EPF8282ATC100-2 - FLEX 8000 FPGA, 2.5K Gates, 100-TQFP | Intel
Артикул: EPF8282ATC100-2 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
EPF8282ATC100-2 Обзор
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing to implement arbitrary digital logic. The FLEX 8000 family sits in the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. FPGAs differ from CPLDs in their distributed SRAM-based configuration memory, which provides higher logic density and register-rich architectures at the cost of requiring external configuration storage on power-up.
Key features of the EPF8282ATC100-2 include in-circuit reconfigurability (ICR) via the serial configuration interface, JTAG boundary-scan test support, and a multi-volt I/O interface compatible with 5 V and 3.3 V signalling. The device integrates 282 flip-flops distributed across 26 LABs, supporting registered state machines, counters, and datapath logic. The MAX+PLUS II development system provides VHDL, Verilog HDL, and waveform design entry, synthesis, simulation, and timing analysis for the FLEX 8000 family.
The FLEX 8000 architecture is built on a continuous, hierarchical routing fabric with FastTrack interconnect lines spanning the entire device. Each LAB contains 8 logic elements (LEs) with a 4-input look-up table (LUT), programmable register, and carry-chain for arithmetic operations. Dedicated input pins and clock networks support synchronous design patterns common in bus interfacing, peripheral control, and telecommunications glue logic.
Typical applications include bus-interface bridging (PCI, ISA, VME), peripheral controllers, telecommunications line-card glue logic, industrial control state machines, and legacy system upgrades where ASIC-equivalent functionality is needed without the NRE cost. The 100-TQFP footprint makes the EPF8282ATC100-2 compatible with through-hole and surface-mount assembly lines that have been validated for the FLEX 8000 family.
Designers should verify timing closure with MAX+PLUS II timing analysis and budget sufficient I/O headroom for 5 V tolerance on legacy buses. Because the FLEX 8000 family has been in production for decades, second-source supply remains available from authorized distributors and stocking partners.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers source pin-compatible replacements for legacy FLEX 8000 designs.
Аналоги без доработки для EPF8282ATC100-2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF8282ATC100-2 (тот же форм-фактор и посадочное место) — отличается по Process Technology, Speed Grade, Configuration Method, Package, Operating Temperature.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF8282ATC100-3
✅ Прямая замена✓ В наличии
$10.25 / шт.
Открыть даташит →EPF8282ATC100-4
✅ Прямая замена✓ В наличии
$9.95 / шт.
Открыть даташит →EPF8282ATC100-2N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EPF8452ATC100-2
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
EPF8636ATC100-2
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
EPF8282ATC100-2 Максимальные параметры и электрические характеристики
| Family | FLEX 8000 |
| Usable Gates | 2,500 |
| Logic Cells | 208 |
| Logic Array Blocks (LABs) | 26 |
| User I/Os | 78 |
| Flip-Flops | 282 |
| Напряжение питания | 5 V |
| Process Technology | 0.42 µm CMOS |
| Корпус | 100-pin TQFP |
| Рабочая температура | 0 °C to 70 °C (Commercial) |
| Speed Grade | -2 |
| Тип монтажа | Surface Mount |
| Configuration Memory | SRAM (volatile, requires external boot) |
| Development Tool | Altera MAX+PLUS II |
Руководство по цоколевке EPF8282ATC100-2 в корпусе 100-pin tqfp
Цоколевка для EPF8282ATC100-2 (корпус 100-pin tqfp). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EPF8282ATC100-2.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EPF8282ATC100-2 подходит для 6 применениеs: PCI/ISA Bus Interface Bridge, Industrial Control State Machine, Telecommunications Line-Card Glue Logic, Peripheral Controller (Printer, Scanner, Plotter), Legacy System Upgrade / Form-Fit-Function Replacement, VME / Multibus Backplane Interface.
PCI/ISA Bus Interface Bridge
The EPF8282ATC100-2's 78 user I/Os and 2,500 usable gates are well-matched to legacy PCI and ISA bus-bridge designs where 32-bit datapath glue logic, address decoding, and interrupt steering must be implemented in a single device. The 5 V I/O tolerance matches PCI's signalling environment directly without level shifters. With 282 flip-flops distributed across 26 LABs, the device can implement registered state machines for DMA controllers and bus-arbitration logic. Compared with a CPLD, the FLEX 8000 architecture provides higher register density and better timing predictability for multi-clock bus interfaces. Designers using MAX+PLUS II timing analysis can verify setup/hold margins against the PCI 33 MHz specification. The 100-TQFP footprint supports standard SMT assembly lines validated for industrial-grade electronics.
Рекомендуется
Industrial Control State Machine
The FLEX 8000 architecture's combination of 282 flip-flops, 26 LABs, and in-circuit reconfigurability makes the EPF8282ATC100-2 ideal for industrial control state machines that must adapt to evolving factory protocols. The 0 °C to 70 °C commercial temperature range covers most factory-floor environments, and the 5 V supply interfaces directly with 24 V-to-5 V industrial power rails. The MAX+PLUS II development flow supports VHDL and Verilog design entry, enabling migration from existing PLC logic to FPGA implementation. The 100-TQFP package is compatible with through-hole adapter boards for retrofit installations, and the SRAM-based configuration supports field firmware updates via JTAG. Designers appreciate the deterministic timing of the FastTrack interconnect for safety-critical interlocks.
Рекомендуется
Telecommunications Line-Card Glue Logic
In telecommunications line cards, the EPF8282ATC100-2 implements glue logic between framers, LIUs (line interface units), and network processors without the NRE cost of an ASIC. The 78 user I/Os accommodate multiple serial data streams, clock-domain crossings, and supervisory interfaces in a single device. The FLEX 8000 family's JTAG boundary-scan support simplifies board-level test on densely populated line cards, and the in-circuit reconfigurability allows remote firmware updates over the management interface. Compared with discrete 74-series logic, the EPF8282ATC100-2 reduces board area by 5-10× and improves signal integrity by minimizing inter-chip routing. The 5 V I/O tolerance interfaces directly with legacy T1/E1 framers and older LIU silicon.
Рекомендуется
Peripheral Controller (Printer, Scanner, Plotter)
The EPF8282ATC100-2 is a proven peripheral controller for legacy printers, scanners, and plotters where 2,500 gates and 78 I/Os are sufficient to implement motor control, sensor interfacing, and host-bus glue logic. The 0.42 µm CMOS process provides low static power consumption suitable for office equipment energy budgets. The 5 V I/O tolerance interfaces directly with TTL peripherals and stepper-motor drivers without level shifting. The 100-TQFP package supports automated SMT assembly lines common in high-volume office-equipment manufacturing. Designers appreciate the FLEX 8000 family's mature MAX+PLUS II tool chain, which provides stable simulation models and timing analysis critical for verifying complex motor-control algorithms before tape-out.
Рекомендуется
Legacy System Upgrade / Form-Fit-Function Replacement
The EPF8282ATC100-2 serves as a form-fit-function replacement for older discrete-logic and ASIC implementations in long-lifecycle systems such as medical instrumentation, military radios, and aerospace ground equipment. The 100-TQFP footprint matches the original FLEX 8000 land pattern, enabling direct PCB retrofit without re-spin. The SRAM-based configuration allows in-system updates when firmware patches are required, even decades after deployment. Per the Altera FLEX 8000 datasheet, the architecture supports JTAG boundary-scan for board-level test continuity with legacy test programs. Designers of long-lifecycle programs rely on authorized-distributor stocking programs to ensure multi-decade supply continuity for these mature FPGAs.
Рекомендуется
VME / Multibus Backplane Interface
The EPF8282ATC100-2 implements VMEbus and Multibus backplane interfaces in industrial and laboratory instrumentation, where 2,500 gates are sufficient for address decoding, bus arbitration, interrupt handling, and data buffering. The 78 user I/Os accommodate the VME D-size connector (96 pins minus power) and additional supervisory signals. The 5 V signalling matches VME standards directly without level translation, and the deterministic FastTrack interconnect simplifies timing closure for the 16 MB/s VME transfer rate. Compared with discrete 74LS and 74F glue logic, the EPF8282ATC100-2 reduces component count from 15-25 ICs to a single device, improving MTBF and reducing assembly cost. The 100-TQFP package supports both production SMT and prototype through-hole assembly.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF8282ATC100-2 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF8282ATC100-3 | EPF8282ATC100-4 | EPF8282ATC100-2N | EPF8452ATC100-2 | EPF8636ATC100-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Usable Gates | 2,500 | 2,500 | 2,500 | 2,500 | 4,500 | 6,000 |
| Logic Cells | 208 | 208 | 208 | 208 | 336 | 504 |
| Speed Grade | -2 | -3 (faster) | -4 (fastest) | -2 (Pb-free) | -2 | -2 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| User I/Os | 78 | 78 | 78 | 78 | 78 | 78 |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
Ключевые отличия
- Faster timing closure for high-speed bus interfaces (против EPF8282ATC100-2)
- Higher logic density for complex designs (против EPF8282ATC100-2)
- Maximum density for complex protocol aggregation (против EPF8282ATC100-2)
Заметки по проектированию
The EPF8282ATC100-2 requires a clean 5 V supply with adequate decoupling. Per the FLEX 8000 datasheet, place 0.1 µF ceramic bypass capacitors within 5 mm of every VCC pin and provide bulk decoupling (10-47 µF tantalum or ceramic) on the power plane. Estimated ICC (active, all I/Os switching) is approximately 50-100 mA depending on utilization and clock rate; designers should budget 500 mA peak from the 5 V regulator with 20% margin. During configuration download, ICC may spike briefly to 200 mA - the regulator must maintain regulation under this transient load.
The FLEX 8000 family uses SRAM-based configuration memory that is volatile - the bitstream must be reloaded from an external configuration PROM (typically EPC1 or EPC2) on every power-up. Designers frequently forget that JTAG programming does not persist across power cycles without an attached configuration device. For production systems, always include a configuration PROM in the BOM. Additionally, the 5 V I/O tolerance is absolute maximum 5.5 V; operation above this threshold damages the I/O cells. Designers migrating from 5 V to 3.3 V logic must verify signal-level compatibility before connecting mixed-voltage buses.
The 100-pin TQFP package has a thermal resistance θJA of approximately 50 °C/W in still air, rising to 35 °C/W with 100 LFM airflow. Estimated: at 50 mA ICC and 5 V supply, quiescent power dissipation is 0.25 W, yielding a junction temperature rise of 12.5 °C above ambient - well within the 0-70 °C commercial range. However, designers driving 78 I/Os at high toggle rates should add 0.5-1.0 W to the dissipation budget for IO switching losses. For enclosed systems, verify junction temperature with the manufacturer's thermal model before finalizing the mechanical design.
Информация о соответствии
RoHS status not explicitly stated in verified web data; EPF8282ATC100-2N variant is lead-free per Octopart. AEC-Q100 not applicable for commercial-grade FPGAs. Designers requiring automotive qualification should consult the Intel/Altera automotive-grade FPGA portfolio instead.