EPM1270F256I5 - 980-Macrocell MAX II CPLD, 256-FBGA | Altera
N.º de pieza: EPM1270F256I5 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.4 | $2.140,00 |
| 500 | $18.75 | $9.375,00 |
| 1.000 | $16.9 | $16.900,00 |
EPM1270F256I5 Descripción general
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell blocks on a single chip with a global interconnect fabric. In the system hierarchy it sits between simple PLDs and FPGAs, offering instant-on non-volatile configuration, deterministic timing, and low power. MAX II specifically uses a Look-Up Table (LUT) based logic element, a flash-backed configuration cell, and a MultiTrack interconnect for predictable routing delays, making it a drop-in successor to legacy 5 V CPLDs.
Key features of the EPM1270F256I5 include 980 logic elements, in-system programmability via JTAG, support for LVCMOS, LVTTL, PCI, SSTL-2, SSTL-3, and LVDS I/O standards, and an industrial temperature grade (-40 °C to +100 °C junction). The "I5" suffix denotes the industrial speed grade with tPD1 of 6.2 ns. The FBGA-256 package is surface-mount and provides high I/O density in a 17 mm × 17 mm footprint, making the device suitable for glue-logic and bus-interface consolidation where PCBs are constrained for space.
Typical applications include I/O expansion and bridging in industrial controllers, power-sequencing and supervisory glue logic in telecom baseboards, bus decoding for legacy microprocessor interfaces, and configurable peripheral drivers. The instant-on behavior is particularly valuable in safety-critical or boot-time-sensitive systems that cannot tolerate FPGA configuration latency.
Design consideration: the FBGA-256 package requires PCB design rules with 0.8 mm or 1.0 mm ball pitch, X-ray or rework-grade inspection for assembly, and at least four PCB layers for clean power/ground. Decoupling with 0.1 µF and 10 µF capacitors near each VCCIO/VCCINT ball is required.
This page consolidates distributor pricing, drop-in same-family alternatives, and practical design guidance not found in the standalone MAX II datasheet.
Alternativas directas para EPM1270F256I5 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPM1270F256I5 (mismo factor de forma y huella) — difiere en Operating Temperature, Programming Interface, Package, Family, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPM1270F256I5N
✅ Sustitución directa✓ En stock
$14.85 / unidad
Ver hoja de datos →EPM1270F256C5
✅ Sustitución directa✓ En stock
$25.4 / unidad
Ver hoja de datos →EPM1270F256C5N
✅ Sustitución directa✓ En stock
$16.2 / unidad
Ver hoja de datos →EPM1270F256
✅ Sustitución directa✓ En stock
$10.85 / unidad
Ver hoja de datos →EPM1270F256I5 Valores máximos y características eléctricas
| Device Family | MAX II |
| Series | EPM1270 |
| Macrocell Count | 980 |
| Logic Elements | 1270 |
| User I/O Pins | 212 (max) |
| User Flash Memory | 8 Kbits |
| Encapsulado | 256-ball FBGA (FineLine BGA) |
| Pin/Package Count | 256 |
| Process Technology | 0.18 µm |
| Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V |
| Maximum Internal Frequency | 201.1 MHz |
| Pin-to-Pin Delay (tPD) | 6.2 ns |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial, "I") |
| Speed Grade | 5 |
| Tipo de montaje | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
Guía de configuración de pines de EPM1270F256I5 256
Configuración de pines para EPM1270F256I5 (encapsulado 256). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPM1270F256I5.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPM1270F256I5 es adecuado para 6 aplicacións: Industrial Glue Logic and I/O Bridging, Bus Decoding and Address Latching, Power Sequencing and Supervisory Logic, Legacy Microcontroller Expansion, Telecom Baseboard Glue Logic, Test and Measurement Front-End.
Industrial Glue Logic and I/O Bridging
The EPM1270F256I5 fits industrial glue-logic consolidation because it offers 980 macrocells in the MAX II family, 212 user I/O pins, and instant-on non-volatile configuration. With 1.8 V core and 2.5 V/3.3 V I/O it bridges legacy 3.3 V microcontrollers to 2.5 V peripherals without level-shifters, and 6.2 ns tPD keeps the design deterministic on 50 MHz buses. Industrial temperature range (-40 to +100 C junction) supports outdoor enclosures and factory-floor PLCs.
Recomendado
Bus Decoding and Address Latching
Address decoding for multiplexed 16/32-bit buses and external peripheral chip-select generation is a textbook MAX II application. The EPM1270F256I5's 980 macrocells decode wide address ranges in a single pass, deliver tPD of 6.2 ns to meet 100 MHz+ write strobes, and retain decoded logic across power cycles via on-chip flash - no boot PROM. The 256-FBGA package supports up to 212 I/O for wide data and address fan-out.
Recomendado
Power Sequencing and Supervisory Logic
The EPM1270F256I5 is widely used for multi-rail power sequencing in telecom and storage baseboards. Its non-volatile flash-backed logic executes the sequencing state machine on power-up with zero boot delay, and 980 macrocells provide ample capacity for monitoring PG (power-good) inputs, driving enable signals, and recording fault latches. The industrial -40 to +100 C range ensures sequencing works in mixed-temperature chassis.
Recomendado
Legacy Microcontroller Expansion
Pairing the EPM1270F256I5 with an 8051 or ARM Cortex-M0/M3 host delivers configurable peripheral expansion (UART, PWM, quadrature decoder, I2C master) without burdening the CPU. 980 macrocells and 1270 logic elements implement 4–8 soft peripherals, 6.2 ns tPD keeps interrupt latency under 50 ns, and JTAG ISP allows field firmware updates without removing the board. The FBGA-256 footprint suits compact SoMs.
Recomendado
Telecom Baseboard Glue Logic
Telecom baseboards rely on the EPM1270F256I5 for low-speed serial bridging (I2C mux, SPI-to-parallel, MDIO), board-ID strapping, and front-panel LED/HMI scanning. The 256-FBGA package integrates 212 user I/O for fan-out, and the 0.18 µm process keeps standby current low for always-on supervisor paths. Industrial temperature ensures reliability in thermally-challenged outdoor enclosures.
Recomendado
Test and Measurement Front-End
The EPM1270F256I5 serves in T&M front-ends as a configurable pattern generator, mux/decoder for ADC/DAC channels, and trigger logic. Its deterministic 6.2 ns propagation delay supports precise trigger timing, 980 macrocells hold wide mux trees, and on-chip flash stores multiple personality configurations that can be swapped via JTAG without external boot memory.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPM1270F256I5 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPM1270F256I5N | EPM1270F256C5 | EPM1270F256C5N | EPM1270F256 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Macrocell Count | 980 | 980 | 980 | 980 | 980 |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) |
| Lead-Free / RoHS | Non-RoHS (legacy) | Yes (Pb-free, RoHS) | Non-RoHS (legacy) | Yes (Pb-free, RoHS) | Non-RoHS (legacy) |
| Speed Grade (tPD) | 6.2 ns (grade 5) | 6.2 ns (grade 5) | 6.2 ns (grade 5) | 6.2 ns (grade 5) | Base grade |
| VCCINT (Core) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| VCCIO (I/O) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Diferenciadores clave
- Industrial temperature grade with 980 macrocells (frente a EPM1270F256C5)
- Drop-in same-package footprint across temp/RoHS variants (frente a EPM1270F256I5N)
- On-chip 8 Kbit user flash eliminates boot PROM (frente a Small SRAM FPGAs in same density class)
Notas de diseño
The 256-ball FBGA package uses a 1.0 mm ball pitch and requires 4-layer (minimum) PCB stack-up with a continuous ground plane beneath the device. Use 0.8 mm micro-vias or 1.0 mm through-vias for fan-out; via-in-pad is recommended for clean signal return. Place 0.1 µF and 10 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO ball. Estimated: with 8 VCCIO balls and 4 VCCINT balls, budget at least 12 × 0.1 µF + 4 × 10 µF capacitors per device.
Route JTAG (TCK, TMS, TDO, TDI) signals with 50 Ω controlled impedance and keep total length under 50 mm to avoid programming failures. Provide a JTAG header or test pad accessible without removing the board. The MAX II configuration flash is on-chip, so no external JTAG boot PROM is required - but leave room on the PCB for an optional 2.5 V or 3.3 V reference test point for in-system programming verification.
Do not exceed the absolute maximum VCCINT of 1.95 V or VCCIO of 4.0 V; over-voltage on the core supply will permanently damage the 0.18 µm die. Mixed-voltage I/O banks must be configured in the Quartus pin planner before generating the JIC/POF file - leaving a bank at 3.3 V while driving 2.5 V signals causes leakage and logic errors. The "I5" speed grade is rated for tPD = 6.2 ns; if your design relies on sub-6 ns timing margins, the base grade is insufficient.
Estimated: at 100 MHz internal toggle rate and 50% I/O switching, the EPM1270F256I5 dissipates approximately 0.4–0.6 W. The 256-FBGA package has a theta-JA of approximately 25 °C /W (per typical Altera package thermal data), giving a junction rise of 10–15 °C above ambient. No external heatsink is required, but the FBGA thermal pad must be soldered to a copper pour of at least 1 square inch for proper heat spreading.
Información de cumplimiento
Verified Web Data does not list an explicit RoHS or REACH compliance statement for EPM1270F256I5. The "I5" suffix denotes industrial temperature, not lead-free status; the "N" suffix on EPM1270F256I5N denotes Pb-free/RoHS-compliant assembly. AEC-Q100 not applicable (CPLD is not an automotive-grade qualified part by default).
