EPM1270F256I5 - 980-Macrocell MAX II CPLD, 256-FBGA | Altera
부품 번호: EPM1270F256I5 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.4 | $2,140.00 |
| 500 | $18.75 | $9,375.00 |
| 1,000 | $16.9 | $16,900.00 |
EPM1270F256I5 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell blocks on a single chip with a global interconnect fabric. In the system hierarchy it sits between simple PLDs and FPGAs, offering instant-on non-volatile configuration, deterministic timing, and low power. MAX II specifically uses a Look-Up Table (LUT) based logic element, a flash-backed configuration cell, and a MultiTrack interconnect for predictable routing delays, making it a drop-in successor to legacy 5 V CPLDs.
Key features of the EPM1270F256I5 include 980 logic elements, in-system programmability via JTAG, support for LVCMOS, LVTTL, PCI, SSTL-2, SSTL-3, and LVDS I/O standards, and an industrial temperature grade (-40 °C to +100 °C junction). The "I5" suffix denotes the industrial speed grade with tPD1 of 6.2 ns. The FBGA-256 package is surface-mount and provides high I/O density in a 17 mm × 17 mm footprint, making the device suitable for glue-logic and bus-interface consolidation where PCBs are constrained for space.
Typical applications include I/O expansion and bridging in industrial controllers, power-sequencing and supervisory glue logic in telecom baseboards, bus decoding for legacy microprocessor interfaces, and configurable peripheral drivers. The instant-on behavior is particularly valuable in safety-critical or boot-time-sensitive systems that cannot tolerate FPGA configuration latency.
Design consideration: the FBGA-256 package requires PCB design rules with 0.8 mm or 1.0 mm ball pitch, X-ray or rework-grade inspection for assembly, and at least four PCB layers for clean power/ground. Decoupling with 0.1 µF and 10 µF capacitors near each VCCIO/VCCINT ball is required.
This page consolidates distributor pricing, drop-in same-family alternatives, and practical design guidance not found in the standalone MAX II datasheet.
드롭인 대체품: EPM1270F256I5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM1270F256I5 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Programming Interface, Package, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM1270F256I5N
✅ 드롭인✓ 재고 있음
$14.85 / 개
데이터시트 보기 →EPM1270F256C5
✅ 드롭인✓ 재고 있음
$25.4 / 개
데이터시트 보기 →EPM1270F256C5N
✅ 드롭인✓ 재고 있음
$16.2 / 개
데이터시트 보기 →EPM1270F256
✅ 드롭인✓ 재고 있음
$10.85 / 개
데이터시트 보기 →EPM1270F256I5 최대 정격 & 전기적 특성
| Device Family | MAX II |
| Series | EPM1270 |
| Macrocell Count | 980 |
| Logic Elements | 1270 |
| User I/O Pins | 212 (max) |
| User Flash Memory | 8 Kbits |
| 패키지 | 256-ball FBGA (FineLine BGA) |
| Pin/Package Count | 256 |
| Process Technology | 0.18 µm |
| Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V |
| Maximum Internal Frequency | 201.1 MHz |
| Pin-to-Pin Delay (tPD) | 6.2 ns |
| 동작 온도 | -40 °C to +100 °C (industrial, "I") |
| Speed Grade | 5 |
| 실장 유형 | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
EPM1270F256I5 256 핀 구성 가이드
EPM1270F256I5(256 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM1270F256I5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM1270F256I5 적합 용도: 6 애플리케이션s: Industrial Glue Logic and I/O Bridging, Bus Decoding and Address Latching, Power Sequencing and Supervisory Logic, Legacy Microcontroller Expansion, Telecom Baseboard Glue Logic, Test and Measurement Front-End.
Industrial Glue Logic and I/O Bridging
The EPM1270F256I5 fits industrial glue-logic consolidation because it offers 980 macrocells in the MAX II family, 212 user I/O pins, and instant-on non-volatile configuration. With 1.8 V core and 2.5 V/3.3 V I/O it bridges legacy 3.3 V microcontrollers to 2.5 V peripherals without level-shifters, and 6.2 ns tPD keeps the design deterministic on 50 MHz buses. Industrial temperature range (-40 to +100 C junction) supports outdoor enclosures and factory-floor PLCs.
추천
Bus Decoding and Address Latching
Address decoding for multiplexed 16/32-bit buses and external peripheral chip-select generation is a textbook MAX II application. The EPM1270F256I5's 980 macrocells decode wide address ranges in a single pass, deliver tPD of 6.2 ns to meet 100 MHz+ write strobes, and retain decoded logic across power cycles via on-chip flash - no boot PROM. The 256-FBGA package supports up to 212 I/O for wide data and address fan-out.
추천
Power Sequencing and Supervisory Logic
The EPM1270F256I5 is widely used for multi-rail power sequencing in telecom and storage baseboards. Its non-volatile flash-backed logic executes the sequencing state machine on power-up with zero boot delay, and 980 macrocells provide ample capacity for monitoring PG (power-good) inputs, driving enable signals, and recording fault latches. The industrial -40 to +100 C range ensures sequencing works in mixed-temperature chassis.
추천
Legacy Microcontroller Expansion
Pairing the EPM1270F256I5 with an 8051 or ARM Cortex-M0/M3 host delivers configurable peripheral expansion (UART, PWM, quadrature decoder, I2C master) without burdening the CPU. 980 macrocells and 1270 logic elements implement 4–8 soft peripherals, 6.2 ns tPD keeps interrupt latency under 50 ns, and JTAG ISP allows field firmware updates without removing the board. The FBGA-256 footprint suits compact SoMs.
추천
Telecom Baseboard Glue Logic
Telecom baseboards rely on the EPM1270F256I5 for low-speed serial bridging (I2C mux, SPI-to-parallel, MDIO), board-ID strapping, and front-panel LED/HMI scanning. The 256-FBGA package integrates 212 user I/O for fan-out, and the 0.18 µm process keeps standby current low for always-on supervisor paths. Industrial temperature ensures reliability in thermally-challenged outdoor enclosures.
추천
Test and Measurement Front-End
The EPM1270F256I5 serves in T&M front-ends as a configurable pattern generator, mux/decoder for ADC/DAC channels, and trigger logic. Its deterministic 6.2 ns propagation delay supports precise trigger timing, 980 macrocells hold wide mux trees, and on-chip flash stores multiple personality configurations that can be swapped via JTAG without external boot memory.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM1270F256I5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM1270F256I5N | EPM1270F256C5 | EPM1270F256C5N | EPM1270F256 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Macrocell Count | 980 | 980 | 980 | 980 | 980 |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) |
| Lead-Free / RoHS | Non-RoHS (legacy) | Yes (Pb-free, RoHS) | Non-RoHS (legacy) | Yes (Pb-free, RoHS) | Non-RoHS (legacy) |
| Speed Grade (tPD) | 6.2 ns (grade 5) | 6.2 ns (grade 5) | 6.2 ns (grade 5) | 6.2 ns (grade 5) | Base grade |
| VCCINT (Core) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| VCCIO (I/O) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
주요 차별점
- Industrial temperature grade with 980 macrocells (vs EPM1270F256C5)
- Drop-in same-package footprint across temp/RoHS variants (vs EPM1270F256I5N)
- On-chip 8 Kbit user flash eliminates boot PROM (vs Small SRAM FPGAs in same density class)
설계 노트
The 256-ball FBGA package uses a 1.0 mm ball pitch and requires 4-layer (minimum) PCB stack-up with a continuous ground plane beneath the device. Use 0.8 mm micro-vias or 1.0 mm through-vias for fan-out; via-in-pad is recommended for clean signal return. Place 0.1 µF and 10 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO ball. Estimated: with 8 VCCIO balls and 4 VCCINT balls, budget at least 12 × 0.1 µF + 4 × 10 µF capacitors per device.
Route JTAG (TCK, TMS, TDO, TDI) signals with 50 Ω controlled impedance and keep total length under 50 mm to avoid programming failures. Provide a JTAG header or test pad accessible without removing the board. The MAX II configuration flash is on-chip, so no external JTAG boot PROM is required - but leave room on the PCB for an optional 2.5 V or 3.3 V reference test point for in-system programming verification.
Do not exceed the absolute maximum VCCINT of 1.95 V or VCCIO of 4.0 V; over-voltage on the core supply will permanently damage the 0.18 µm die. Mixed-voltage I/O banks must be configured in the Quartus pin planner before generating the JIC/POF file - leaving a bank at 3.3 V while driving 2.5 V signals causes leakage and logic errors. The "I5" speed grade is rated for tPD = 6.2 ns; if your design relies on sub-6 ns timing margins, the base grade is insufficient.
Estimated: at 100 MHz internal toggle rate and 50% I/O switching, the EPM1270F256I5 dissipates approximately 0.4–0.6 W. The 256-FBGA package has a theta-JA of approximately 25 °C /W (per typical Altera package thermal data), giving a junction rise of 10–15 °C above ambient. No external heatsink is required, but the FBGA thermal pad must be soldered to a copper pour of at least 1 square inch for proper heat spreading.
규정 준수 정보
Verified Web Data does not list an explicit RoHS or REACH compliance statement for EPM1270F256I5. The "I5" suffix denotes industrial temperature, not lead-free status; the "N" suffix on EPM1270F256I5N denotes Pb-free/RoHS-compliant assembly. AEC-Q100 not applicable (CPLD is not an automotive-grade qualified part by default).
