EPM570F256I5 - 570-LE MAX II CPLD, 256-BGA, Industrial | Intel / Altera
N.º de pieza: EPM570F256I5 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $19.85 | $198,50 |
| 100 | $16.4 | $1.640,00 |
| 500 | $14.1 | $7.050,00 |
| 1.000 | $12.6 | $12.600,00 |
EPM570F256I5 Descripción general
A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-on programmable logic device built from a fabric of Look-Up Tables (LUTs), macrocells, and a programmable interconnect network. In the broader programmable logic taxonomy, CPLDs sit alongside FPGAs as the two dominant families of programmable logic; CPLDs are characterized by deterministic, pin-to-pin propagation delays (typically <10 ns), non-volatile on-chip flash storage, low standby current, and instant-on behavior, making them ideal for glue-logic, bus bridging, I/O expansion, and power-up control tasks where FPGAs are overkill. The MAX II family specifically uses a 0.18 um flash process with a look-up-table based logic array (LE) rather than the older product-term macrocell, giving it higher density per die area while preserving CPLD simplicity.
Key features of the EPM570F256I5 include 570 logic elements, 160 maximum user I/Os, 8 Kbits of user flash memory (UFM) usable as general-purpose non-volatile storage, on-chip termination support, JTAG-based in-system programmability (ISP), and MultiVolt I/O that interoperates with 1.5V/1.8V/2.5V/3.3V/5V systems. The device supports I/O standards such as LVTTL, LVCMOS, SSTL, and PCI. Pin-to-pin logic delays in the I5 speed grade are typically in the 5-7 ns range with a maximum clock frequency around 304 MHz (per the MAX II datasheet).
From an architecture standpoint, the MAX II family uses a logic-element based fabric divided into Logic Array Blocks (LABs) interconnected by a MultiTrack interconnect; each LE contains a 4-input LUT, a programmable register, and a carry chain, while the UFM block provides 8 Kbits of user-accessible flash that can store boot parameters, serial numbers, or lookup tables without an external EEPROM. The device also includes 4 phase-locked loops (PLLs) for clock synthesis and skew management.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing and supervisory logic in multi-rail systems, glue-logic replacement for discrete 74-series logic, configuration control for FPGAs and microcontrollers, and protocol translation (UART-to-SPI, I2C-to-parallel) in embedded designs. Its instant-on non-volatile configuration makes it particularly attractive as a companion logic device to ASICs, ASSPs, and microprocessors.
When designing with this device, place decoupling capacitors (0.1 uF plus 10 uF bulk) adjacent to each supply pin, follow Intel/Altera Quartus II pin-out guidelines for the F256 BGA (1.0 mm pitch), and connect JTAG TMS/TCK/TDO/TDI to a standard 10-pin header for ISP. Be aware that the MAX II family is now NRND on the Intel product roadmap; for new designs, MAX V or MAX 10 FPGAs are recommended.
This page synthesizes distributor pricing, drop-in same-family pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para EPM570F256I5 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPM570F256I5 (mismo factor de forma y huella) — difiere en Package, Programming Interface, Operating Temperature, Process Technology, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPM570F256I5N
✅ Sustitución directa✓ En stock
$19.85 / unidad
Ver hoja de datos →EPM570F256C5N
✅ Sustitución directa✓ En stock
$17.03 / unidad
Ver hoja de datos →EPM570F256C4N
✅ Sustitución directa✓ En stock
$26.85 / unidad
Ver hoja de datos →EPM570F256C3N
✅ Sustitución directa✓ En stock
$13.75 / unidad
Ver hoja de datos →EPM570F256I5 Valores máximos y características eléctricas
| Family | MAX II |
| Logic Elements (LE) | 570 |
| Maximum User I/O Pins | 160 |
| User Flash Memory (UFM) | 8 Kbits |
| Package Type | 256-ball FineLine BGA (FBGA-256) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Supply Voltage - Core | 3.3 V (also operates at 3.3V per part description) |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, PCI |
| MultiVolt I/O | 1.5V / 1.8V / 2.5V / 3.3V |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| In-System Programmability | Yes |
| Non-volatile Configuration | Yes (on-chip flash) |
| Pin-to-Pin Logic Delay (typ) | 5 ns to 7 ns |
| Tipo de montaje | Surface Mount |
| Width | 17 mm (per Partstack) |
| Speed Grade | I5 |
Guía de configuración de pines de EPM570F256I5 256-ball fineline bga (fbga-256)
Configuración de pines para EPM570F256I5 (encapsulado 256-ball fineline bga (fbga-256)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPM570F256I5.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPM570F256I5 es adecuado para 6 aplicacións: Industrial I/O Expansion and Bus Bridging, Power-Up Sequencing and Supervisory Logic, Glue-Logic Replacement for Discrete 74-Series Logic, FPGA/Microcontroller Configuration Control, Protocol Translation (UART/SPI/I2C Bridging), LED Display and Lighting Control.
Industrial I/O Expansion and Bus Bridging
The EPM570F256I5's 160 user I/O pins and 570 logic elements make it ideal for I/O expansion and bus bridging in industrial PLCs, sensor hubs, and motor-control boards. Its non-volatile instant-on configuration eliminates firmware load delay at power-up, while the MultiVolt I/O supports 1.5V/1.8V/2.5V/3.3V interoperability with legacy 5V peripherals via level shifting. Deterministic pin-to-pin delays (5-7 ns typical) guarantee bus-timing margins for SPI, I2C, UART, and parallel-bus glue logic. Industrial-grade -40C to +85C operation handles factory floor temperature swings without thermal derating.
Recomendado
Power-Up Sequencing and Supervisory Logic
The MAX II CPLD excels at power-up sequencing in multi-rail systems, where its instant-on non-volatile configuration enables precise timing of voltage-rail enable signals without microcontroller boot delay. The 8 Kbits of user flash memory can store default rail-enable sequencing patterns and watchdog timer parameters that survive power cycles. With 5-7 ns typical propagation delay and industrial temperature operation, the EPM570F256I5 provides reliable supervisory logic in telecom infrastructure, server motherboards, and industrial controllers where deterministic start-up behavior is mission-critical.
Recomendado
Glue-Logic Replacement for Discrete 74-Series Logic
The EPM570F256I5 can replace 30-50 packages of discrete 74-series TTL/CMOS glue logic with a single 256-BGA device, dramatically simplifying PCB layout, reducing BOM cost, and eliminating trace-length matching issues. Quartus synthesis accepts VHDL/Verilog netlist translations of legacy 74-series designs and the JTAG-based ISP allows in-field design revisions. Industrial-temp grade makes it ideal for replacing discrete logic in factory automation equipment where 74-series parts are obsolete or being phased out.
Recomendado
FPGA/Microcontroller Configuration Control
Use the EPM570F256I5 as a companion configuration controller for FPGAs (e.g. Cyclone, Stratix) or microcontrollers in multi-chip systems. The CPLD's instant-on behavior and dedicated JTAG chain support allow it to manage FPP/PS configuration modes, hold configuration lines stable during FPGA boot, and perform multi-device programming in parallel via JTAG. The UFM block can store backup bitstreams or golden configuration images for fail-safe recovery in safety-critical industrial applications.
Recomendado
Protocol Translation (UART/SPI/I2C Bridging)
The 570 LEs in the EPM570F256I5 comfortably handle custom protocol bridges between UART, SPI, I2C, parallel-bus, CAN, and LIN interfaces at industrial bus speeds. MultiVolt I/O allows direct connection to 1.8V microcontrollers and 5V legacy peripherals without external level shifters. The CPLD's deterministic timing and industrial temperature range make it ideal for protocol translation in industrial sensor networks, automotive body electronics, and embedded gateways.
Recomendado
LED Display and Lighting Control
With 160 user I/Os, the EPM570F256I5 can drive large LED matrix displays, RGB lighting strips, and industrial signage panels via direct multiplexing or PWM dimming. The UFM block stores lighting presets and animation sequences without external memory. Industrial-temp operation enables outdoor signage and architectural lighting installations where temperature swings would compromise discrete-logic designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPM570F256I5 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPM570F256I5N | EPM570F256C5N | EPM570F256C4N | EPM570F256C3N |
|---|---|---|---|---|---|
| Package | FBGA-256 (17 mm, 1.0 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 570 LE | 570 LE | 570 LE | 570 LE | 570 LE |
| Maximum User I/Os | 160 | 160 | 160 | 160 | 160 |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C |
| Speed Grade | I5 | I5 (same) | C5 | C4 (faster) | C3 (fastest) |
| Lead-Free / RoHS | No (Pb-bearing) | Yes (-N suffix) | Yes | Yes | Yes |
| UFM (User Flash) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Diferenciadores clave
- Same-family lead-free RoHS variant available with identical pinout (frente a EPM570F256I5N)
- Industrial temperature grade (-40C to +85C) vs commercial (frente a EPM570F256C5N)
- Same 256-BGA footprint across all speed grades enables PCB reuse (frente a EPM570F256C4N / EPM570F256C3N)
Notas de diseño
The EPM570F256I5 requires a clean 3.3V core supply (VCCINT) and a separate VCCIO bank supply per I/O bank. Per the MAX II datasheet, place a 0.1 uF decoupling capacitor within 5 mm of every VCC pin and add 10 uF bulk capacitance per power rail. Avoid sharing VCCIO between widely spaced banks; noisy I/O banks can inject noise into the logic-array supply. Estimated: at 50% I/O toggle rate, supply current is approximately 50-100 mA per VCCIO bank; reference the DC characteristics table in the datasheet for exact ICCINT figures.
The FBGA-256 package has a 1.0 mm ball pitch and 17 mm body, requiring 4-6 layer PCB with microvia or via-in-pad technology. Escape routing is constrained: maximum two signal tracks between adjacent balls in a single layer. Use Intel's recommended BGA breakout pattern (per the MAX II Handbook pinout file) and length-match clock, JTAG, and high-speed I/O within 50 mil. Thermal pad is not present on MAX II FBGA - the device is low enough power that 1 oz copper pours are adequate.
Group JTAG signals (TMS, TCK, TDO, TDI) on a dedicated 10-pin 0.05-inch header with 4.7 kohm pull-ups on TMS and TDI; keep JTAG trace length below 100 mm to avoid signal-integrity issues during in-system programming. Isolate analog and digital grounds at the connector level but join them at a single ground point beneath the CPLD to prevent ground loops. If using PLL outputs, route clock traces on the inner PCB layer with a continuous ground reference on the layer above.
Do not assume C5 and I5 variants are interchangeable: the EPM570F256C5N is commercial temp grade and will fail cold-start below 0C in industrial designs. Also note that MAX II is on Intel's NRND list - for new designs, migrate to MAX V (5M570Z) or MAX 10 (10M02) families. Watch out for MSL3 moisture sensitivity on FBGA packages; bake at 125C for 24 hours before assembly if the floor-life has been exceeded.
Información de cumplimiento
Original EPM570F256I5 (no -N suffix) is Pb-bearing. For RoHS-compliant designs use EPM570F256I5N. AEC-Q100 not qualified - this is industrial-temp, not automotive-qualified.
