EPM570F256C4 - 570 LEs MAX II CPLD, 256-FBGA | Intel
N.º de pieza: EPM570F256C4 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $30.1 | $301,00 |
| 100 | $26.85 | $2.685,00 |
| 250 | $24.2 | $6.050,00 |
| 1.000 | $19.95 | $19.950,00 |
EPM570F256C4 Descripción general
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that uses EEPROM or Flash memory to retain its configuration. It sits below FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC -> semiconductor) and is typically used for glue logic, bus bridging, power sequencing, and I/O expansion. Unlike SRAM-based FPGAs, MAX II CPLDs need no external boot PROM and start within microseconds of power-up, making them ideal for deterministic system initialization.
Key features include 570 Logic Elements, 160 programmable logic array blocks (LABs equivalent), 212 maximum user I/O pins, 8 Kbits of user flash memory, and an internal oscillator that supports 4.5 ns pin-to-pin logic delays. The device supports JTAG IEEE 1149.1 boundary-scan and in-system programmability (ISP) through the JTAG interface, with built-in Joint Test Action Group (JTAG) instructions for board-level testing.
Architecturally, the EPM570F256C4 uses Intel's MultiCore architecture with a labyrinth routing switch matrix, four global clock networks, and per-pin output enable control. The MultiVolt I/O bank can interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels without external level shifters, simplifying mixed-voltage designs.
Typical applications include power-on reset and sequencing control in industrial automation, I/O expansion and bus bridging in networking line cards, address decoding in microcontroller systems, and digital signal conditioning in test and measurement equipment. Designers also choose MAX II CPLDs as glue-logic consolidation parts to reduce discrete MSI/SSI logic on the board.
When designing with the EPM570F256C4, treat the 256-ball FineLine BGA as a fine-pitch package that requires careful PCB layout: matched-length impedance traces, a 6- or 8-layer stack-up with continuous ground planes, and Xilinx/Altera-compatible BGA fanout. Quartus II software supports this device through the free Quartus Prime Lite / Web Edition toolchain.
This page synthesizes distributor pricing (as of 2026-09-12), drop-in same-package alternatives within the MAX II family, and practical design notes not found on a single distributor listing.
Alternativas directas para EPM570F256C4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPM570F256C4 (mismo factor de forma y huella) — difiere en Package, Programming Interface, Process Technology, Operating Temperature, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPM570F256C3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$14.85 / unidad
Ver hoja de datos →EPM570F256C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$13.75 / unidad
Ver hoja de datos →EPM1270F256C4
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EPM570F256C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$17.03 / unidad
Ver hoja de datos →EPM2210F256C4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$42.8 / unidad
Ver hoja de datos →5M570ZF256C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$13.2 / unidad
Ver hoja de datos →EPM570F256C4 Valores máximos y características eléctricas
| Family | MAX II |
| Device Name | EPM570 |
| Logic Elements (LEs) | 570 |
| Maximum User I/O Pins | 212 |
| User Flash Memory | 8 Kbits |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns (commercial -4 speed grade) |
| Supply Voltage - Core (VCCINT) | 1.8 V |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Temperatura de funcionamiento | 0C to +85C (commercial) |
| Encapsulado | 256-ball FineLine BGA (F256) |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (168 hours) |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant per product page) |
| Configuration Memory | Internal Flash (non-volatile, instant-on) |
| Global Clock Networks | 4 |
Guía de configuración de pines de EPM570F256C4 256-ball fineline bga (f256)
Configuración de pines para EPM570F256C4 (encapsulado 256-ball fineline bga (f256)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPM570F256C4.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPM570F256C4 es adecuado para 6 aplicacións: Power Sequencing and Reset Control, I/O Expansion and Bus Bridging, Industrial Control and Factory Automation, Networking Line Card Glue Logic, Test and Measurement Front-End Logic, Display and Touch-Panel Interface Bridging.
Power Sequencing and Reset Control
The EPM570F256C4's 570 LEs and 4.5 ns tPD logic delay make it well-suited for centralized power-sequencing and reset-distribution logic in multi-rail systems. A typical design uses the CPLD to monitor PG (power-good) signals from each DC-DC converter, then stagger the enable outputs by tens of milliseconds to enforce proper rail sequencing for processors, FPGAs, or DDR memories. The instant-on, non-volatile Flash configuration means the sequencer is operational within microseconds of VCCINT ramp - critical when downstream ICs cannot tolerate a long undefined reset window. The 212 user I/Os accommodate dozens of rails plus status LEDs and fault inputs, and JTAG boundary-scan assists board-level test.
Recomendado
I/O Expansion and Bus Bridging
With 212 user I/Os and MultiVolt I/O banks that natively support 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5 V logic levels, the EPM570F256C4 is an excellent bus-bridging solution between microcontrollers, FPGAs, and legacy peripherals. Common implementations include SPI-to-parallel LCD bridges, I2C-to-GPIO expanders, and async FIFO bridges between domains running at different clock rates. The internal 8 Kbit user flash can store calibration or configuration data, and the four global clock networks simplify synchronous crossing logic. Pin-to-pin compatibility with the EPM1270 in the F256 package enables seamless capacity upgrade as bridging needs grow.
Recomendado
Industrial Control and Factory Automation
The EPM570F256C4's industrial-temperature variants and robust 1.8 V core / MultiVolt I/O architecture support factory-automation designs such as PLC I/O modules, motor-driver front-end controllers, and machine-vision trigger generators. The 4.5 ns propagation delay is sufficient for encoder quadrature decoding at high RPM, PWM generation for servo loops, and deterministic interrupt-handling glue logic. Designers exploit the JTAG ISP capability to update field-deployed boards without removing them from the chassis - essential for retrofit programs. The F256 BGA package's fine pitch (1.0 mm) requires 6-8 layer PCB stack-ups typical of industrial control cards.
Recomendado
Networking Line Card Glue Logic
In networking line cards and base-station designs, the EPM570F256C4 handles address decoding, chip-select generation, and bus-width adaptation between network processors (NPs), FPGAs, and packet-buffer memories. Its MultiVolt I/O banks bridge 2.5 V packet-buffer interfaces to 3.3 V PHY or backplane logic without external level shifters. The CPLD's deterministic timing supports hardware-queue pointer management and pause-frame generation, while the JTAG boundary-scan infrastructure integrates with board-level ATPG patterns. Vertical migration within the F256 footprint to EPM1270 or EPM2210 allows line-card platforms to scale capacity without re-routing the PCB.
Recomendado
Test and Measurement Front-End Logic
The EPM570F256C4 is widely used in test-and-measurement instruments as a front-end pattern generator, multiplexer controller, and trigger-arming circuit. Its low propagation delay (4.5 ns) enables tight timing margins for sub-microsecond trigger events, while the 570 LEs accommodate modest state machines and waveform counters. Designers often use the CPLD to route internal test points to a smaller pin count or to multiplex multiple sensor inputs into a single high-speed ADC. The internal 8 Kbit user flash stores calibration constants read by the host at startup, eliminating an external EEPROM.
Recomendado
Display and Touch-Panel Interface Bridging
The EPM570F256C4's high I/O count and MultiVolt I/O make it a strong fit for display-driver bridging, RGB-to-LVDS conversion glue logic, and capacitive-touch-panel scanning controllers. The CPLD can aggregate touch-sensor I2C or SPI inputs from multiple panels and present a unified interrupt to the host processor, reducing host wake-up events and saving power in handheld designs. The internal user flash holds panel-edid data or color-profile lookup values. The 256-ball BGA package, while fine-pitch, is standard in mid-density display controller boards where 6-layer stack-ups are already required for high-speed RGB traces.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPM570F256C4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPM570F256C3 | EPM570F256C3N | EPM1270F256C4 | EPM570F256C5N | EPM2210F256C4 | 5M570ZF256C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II | MAX V |
| Logic Elements (LEs) | 570 | 570 (same) | 570 (same) | 1270 (+123%) | 570 (same) | 2210 (+288%) | 570 (same) |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns (-C4) | 3.6 ns (-C3, +25% faster) | 3.6 ns (-C3, +25% faster) | 6.0 ns (-C4 at higher density) | 5.0 ns (-C5, -10% slower) | 7.0 ns (-C4 at higher density) | 5.0 ns (-C5) |
| User Flash Memory | 8 Kbits | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same) | 0 Kbits (no user flash) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial, lead-free) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Diferenciadores clave
- Highest-density BGA package in the EPM570 family with maximum 212 user I/O pins (frente a EPM570F100C4N (F100 BGA, 100 balls))
- Non-volatile Flash configuration with instant-on microsecond startup (frente a Equivalent Lattice ispMACH 4000ZE CPLD with on-chip NV memory)
- Pin-compatible upgrade path to EPM1270 and EPM2210 in same F256 BGA (frente a Other MAX II densities in smaller packages)
Notas de diseño
The F256 FineLine BGA package uses 1.0 mm ball pitch and requires a 6- or 8-layer PCB stack-up with matched-impedance traces and continuous ground planes for reliable assembly. Use via-in-pad or microvia fanout on at least the inner-row balls; standard dog-bone fanout at 1.0 mm pitch risks solder-bridge defects. Recommend NSMD (non-solder-mask-defined) BGA pads with 0.45 mm pad diameter to maximize the solder fillet and improve manufacturing yield per IPC-7351.
Provide separate 1.8 V VCCINT and 3.3 V VCCIO rails, each decoupled with a 1 uF ceramic capacitor within 100 mils of every supply pin plus a bulk 100 uF tantalum near the package. The MAX II MultiVolt I/O banks each have their own VCCIO pins and may run at independent voltages (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V); tie unused bank VCCIO to a valid rail rather than leaving floating. Allow >1 ms VCCINT ramp time before JTAG programming begins.
Common pitfalls when bringing up the EPM570F256C4: (1) forgetting to drive JTAG TCK with a clean 10 MHz clock during ISP - noisy TCK causes verify failures; (2) mixing single-ended I/O standards with differential (LVDS) on adjacent pins without proper VCCIO bank isolation; (3) leaving the nCONFIG pin floating rather than tying it to VCCINT through a 10 kohm pull-up; (4) using open-drain outputs without external pull-ups, which the MAX II does not provide internally on all pins.
For clock-distribution designs, route global clock inputs on dedicated CLK pins with 50 ohm controlled-impedance traces and length-match within 200 mils across the four global clock networks. Avoid routing clock signals across BGA inner rows where via stubs introduce reflections. The 4.5 ns tPD budget assumes worst-case commercial temperature and voltage; derate accordingly for industrial or extended temperature designs.
Información de cumplimiento
RoHS compliant and lead-free per Intel product page. Halogen-free per material declaration. Standard commercial MAX II grade is not AEC-Q100 qualified; for automotive, choose the MAX II automotive-grade or MAX V AEC-Q100 variants.
