Intel

EPM570GT144C4N - 570 LEs MAX II CPLD, 144-TQFP | Intel

N.º de pieza: EPM570GT144C4N ✓ Activo
En stock Se envía en 1-3 días hábiles
3.3 V Vdss 144-pin TQFP Package 8 Kbit Memory
Desde $22.5 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-12
Precios por volumen
Cant. Precio unitario Total
1 $35.63 $35,63
10 $32.4 $324,00
100 $28.95 $2.895,00
500 $25.1 $12.550,00
1.000 $22.5 $22.500,00
ℹ️ Todos los precios están en USD

EPM570GT144C4N Descripción general

The Intel (Altera) EPM570GT144C4N is a MAX II family non-volatile CPLD delivering 570 logic elements (440 macrocells) in a 144-pin TQFP package, with a 5.4 ns pin-to-pin logic delay. It is built on a 0.18-µm 6-layer-metal flash process, providing instant-on operation and 8 Kbits of on-chip user flash memory (UFM) for non-volatile configuration storage.

What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architectures with higher density macrocell fabric, used to implement glue logic, bus interfaces, state machines, and power-up sequencing in digital systems. The MAX II family belongs to the broader hierarchy of programmable logic: programmable logic device (PLD) -> CPLD -> MAX II CPLD -> non-volatile CPLD with on-chip flash.

Key features of the EPM570GT144C4N include: 570 logic elements (LEs), 440 macrocells, 8 Kbit UFM block, MultiVolt I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) on the same die, and 116 user I/O pins. The device offers JTAG (IEEE 1149.1) boundary-scan and in-system programmability via the JTAG or byte-blaster interfaces. Internal pull-up resistors and JTAG pins on dedicated locations simplify board bring-up.

Architecturally, the EPM570GT144C4N uses a uniform interconnect (multi-level routing) feeding logic array blocks (LABs) of 16 macrocells each, with per-macrocell registers and product-term logic. Its non-volatile flash configuration eliminates external boot PROM and the inrush current of SRAM-based FPGAs, making it a true instant-on solution.

Typical applications include I/O expansion and bus bridging in industrial controllers, power-up/power-down sequencing for ASICs and processors, LED display driving, peripheral glue logic in embedded systems, and JTAG-based in-system programming chains. The wide MultiVolt I/O range allows direct interfacing with 1.8 V, 2.5 V, 3.3 V, and 5 V devices without level shifters.

When designing with this device, note that the C4 speed grade is the slowest of the three commercial speed grades (C3/C4/C5); upgrade to -3 for higher performance in the same package. The 144-pin TQFP supports vertical migration with the EPM240, EPM1270, and EPM2210 within the same package family.

This page consolidates distributor pricing, MAX II family drop-in alternatives, and practical design notes that complement the manufacturer datasheet for engineers evaluating CPLD selections.

Alternativas directas para EPM570GT144C4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EPM570GT144C4N (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.

Intel
Operating Temperature: 0 °C to +85 °C (commercial, C3 grade)
Package: 144-pin TQFP (GT144)
Programming Interface: JTAG IEEE 1149.1 (ISP)
Comparar con EPM570GT144C4N →
Intel
Operating Temperature: 0 C to +85 C (Commercial)
Package: 144-pin TQFP (20 x 20 mm)
Programming Interface: JTAG (IEEE 1149.1)
Comparar con EPM570GT144C4N →
Intel
Package: TQFP-144 (GT)
Configuration Memory: Non-volatile flash, instant-on
Comparar con EPM570GT144C4N →
Intel
Operating Temperature: 0C to +85C (commercial)
Package: 144-TQFP (20x20 mm)
Comparar con EPM570GT144C4N →
Altera
Package: 144-pin TQFP (20 x 20 mm)
Programming Interface: JTAG (IEEE 1149.1) / IEEE 1532 ISP
Process Technology: 0.18 µm
Comparar con EPM570GT144C4N →
Intel
Operating Temperature: -40 °C to +100 °C (industrial)
Package: 144-TQFP (20x20 mm)
Process Technology: 0.18 µm
Comparar con EPM570GT144C4N →
Intel
Operating Temperature: -40C to +100C (industrial)
Package: TQFP-144 (GT144)
Programming Interface: JTAG (IEEE 1149.1) ISP
Comparar con EPM570GT144C4N →
Intel
Operating Temperature: -40 °C to +85 °C (industrial, suffix N)
Package: TQFP-144 (22 × 22 mm, 0.5 mm pitch)
Programming Interface: JTAG (IEEE 1149.1) with in-system programmability (ISP)
Comparar con EPM570GT144C4N →
Intel
Operating Temperature: Commercial (0 °C to +85 °C)
Programming Interface: JTAG (IEEE 1149.1), ISP
Process Technology: 0.18 µm CMOS
Comparar con EPM570GT144C4N →
Intel
Operating Temperature: -40C to +100C (industrial)
Package: TQFP-144 (22 mm x 22 mm, 0.5 mm pitch)
Programming Interface: JTAG (IEEE 1149.1) / ISP
Comparar con EPM570GT144C4N →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EPM570GT144C3N

✅ Sustitución directa
Intel
📦 144-pin TQFP
MAX II · 570 · 440 · 116 · 5.4 ns · 8 Kbits · 1.71 V to 1.89 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS/LVTTL

✓ En stock

$28.95 / unidad

Ver hoja de datos →

EPM570GT144I4N

✅ Sustitución directa
📦 144-pin TQFP
same 144-pin TQFP, industrial temperature (-40C to +100C) vs commercial (0C to +85C), same die, pin-to-pin compatible

📋 Alternativa de referencia (no en el catálogo)

EPM570GT144C4

✅ Sustitución directa
Intel
📦 144-pin TQFP
MAX II · 570 · 440 · 8 Kbits · 5.4 ns (max) · 247.5 MHz · 0.18 µm, 6-layer-metal flash · 1.8 V

✓ En stock

$22.1 / unidad

Ver hoja de datos →

EPM570GT144C3

✅ Sustitución directa
Intel
📦 144-pin TQFP
MAX II · 570 · 440 · 76 (max, package-dependent) · 5.4 ns (commercial, fastest speed grade) · 8 Kbits (8,192 bits) · 1.8 V (internal regulator from VCCINT 3.3 V) · 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)

✓ En stock

$13.5 / unidad

Ver hoja de datos →

EPM1270GT144C4N

✅ Sustitución directa
📦 144-pin TQFP
same 144-pin TQFP, larger EPM1270 device (1270 LEs vs 570 LEs, ~2.2x density), pin-to-pin compatible per vertical-migration family

📋 Alternativa de referencia (no en el catálogo)

EPM240GT144C4N

✅ Sustitución directa
📦 144-pin TQFP
same 144-pin TQFP, smaller EPM240 device (240 LEs vs 570 LEs, -58% logic), pin-to-pin compatible per vertical-migration family

📋 Alternativa de referencia (no en el catálogo)

EPM570GT144C4N Valores máximos y características eléctricas

Family MAX II
Logic Elements (LE) 570
Macrocells 440
Maximum User I/O 116
User Flash Memory (UFM) 8 Kbit
Pin-to-Pin Logic Delay (tPD) 5.4 ns (C4 speed grade)
Supply Voltage (VCCINT) 3.3 V
MultiVolt I/O Support 1.5 V, 1.8 V, 2.5 V, 3.3 V
Temperatura de funcionamiento 0 °C to +85 °C (commercial)
Process Technology 0.18 µm, 6-layer-metal flash
Encapsulado 144-pin TQFP
Tipo de montaje Surface Mount
Programming Interface JTAG (IEEE 1149.1) / ByteBlaster
Configuration Memory Non-volatile internal flash
Estado RoHS Compliant

Configuración de pines de EPM570GT144C4N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O pin (bank 1)
Pin 2 I/O — User I/O pin (bank 1)
Pin 3 I/O — User I/O pin (bank 1)
Pin 4 I/O — User I/O pin (bank 1)
Pin 5 I/O — User I/O pin (bank 1)
Pin 6 I/O — User I/O pin (bank 1)
Pin 7 I/O — User I/O pin (bank 1)
Pin 8 I/O — User I/O pin (bank 1)
Pin 9 GND — Ground
Pin 10 I/O — User I/O pin (bank 1)
Pin 11 I/O — User I/O pin (bank 1)
Pin 12 TDI — JTAG Test Data In
Pin 13 TMS — JTAG Test Mode Select
Pin 14 TCK — JTAG Test Clock
Pin 15 GND — Ground
Pin 16 VCCIO1 — I/O bank 1 supply voltage
Pin 17 I/O — User I/O pin (bank 1)
Pin 18 I/O — User I/O pin (bank 1)
Pin 19 I/O — User I/O pin (bank 1)
Pin 20 I/O — User I/O pin (bank 1)
Pin 21 I/O — User I/O pin (bank 1)
Pin 22 I/O — User I/O pin (bank 1)
Pin 23 I/O — User I/O pin (bank 1)
Pin 24 I/O — User I/O pin (bank 1)
Pin 25 I/O — User I/O pin (bank 1)
Pin 26 I/O — User I/O pin (bank 1)
Pin 27 I/O — User I/O pin (bank 1)
Pin 28 I/O — User I/O pin (bank 1)
Pin 29 GND — Ground
Pin 30 VCCINT — Core supply voltage (3.3 V)
Pin 31 I/O — User I/O pin (bank 2)
Pin 32 I/O — User I/O pin (bank 2)
Pin 33 I/O — User I/O pin (bank 2)
Pin 34 I/O — User I/O pin (bank 2)
Pin 35 I/O — User I/O pin (bank 2)
Pin 36 I/O — User I/O pin (bank 2)
Pin 37 GND — Ground
Pin 38 VCCIO2 — I/O bank 2 supply voltage
Pin 39 I/O — User I/O pin (bank 2)
Pin 40 I/O — User I/O pin (bank 2)
Pin 41 I/O — User I/O pin (bank 2)
Pin 42 I/O — User I/O pin (bank 2)
Pin 43 I/O — User I/O pin (bank 2)
Pin 44 I/O — User I/O pin (bank 2)
Pin 45 I/O — User I/O pin (bank 2)
Pin 46 I/O — User I/O pin (bank 2)
Pin 47 GND — Ground
Pin 48 I/O — User I/O pin (bank 2)
Pin 49 I/O — User I/O pin (bank 2)
Pin 50 I/O — User I/O pin (bank 2)
Pin 51 I/O — User I/O pin (bank 2)
Pin 52 I/O — User I/O pin (bank 2)
Pin 53 I/O — User I/O pin (bank 2)
Pin 54 I/O — User I/O pin (bank 2)
Pin 55 I/O — User I/O pin (bank 2)
Pin 56 I/O — User I/O pin (bank 2)
Pin 57 I/O — User I/O pin (bank 2)
Pin 58 GND — Ground
Pin 59 VCCINT — Core supply voltage (3.3 V)
Pin 60 I/O — User I/O pin (bank 3)
Pin 61 I/O — User I/O pin (bank 3)
Pin 62 I/O — User I/O pin (bank 3)
Pin 63 I/O — User I/O pin (bank 3)
Pin 64 I/O — User I/O pin (bank 3)
Pin 65 I/O — User I/O pin (bank 3)
Pin 66 GND — Ground
Pin 67 VCCIO3 — I/O bank 3 supply voltage
Pin 68 I/O — User I/O pin (bank 3)
Pin 69 I/O — User I/O pin (bank 3)
Pin 70 I/O — User I/O pin (bank 3)
Pin 71 I/O — User I/O pin (bank 3)
Pin 72 I/O — User I/O pin (bank 3)
Pin 73 I/O — User I/O pin (bank 3)
Pin 74 I/O — User I/O pin (bank 3)
Pin 75 I/O — User I/O pin (bank 3)
Pin 76 GND — Ground
Pin 77 I/O — User I/O pin (bank 3)
Pin 78 I/O — User I/O pin (bank 3)
Pin 79 I/O — User I/O pin (bank 3)
Pin 80 I/O — User I/O pin (bank 3)
Pin 81 I/O — User I/O pin (bank 3)
Pin 82 I/O — User I/O pin (bank 3)
Pin 83 I/O — User I/O pin (bank 3)
Pin 84 I/O — User I/O pin (bank 3)
Pin 85 I/O — User I/O pin (bank 3)
Pin 86 I/O — User I/O pin (bank 3)
Pin 87 GND — Ground
Pin 88 VCCINT — Core supply voltage (3.3 V)
Pin 89 I/O — User I/O pin (bank 4)
Pin 90 I/O — User I/O pin (bank 4)
Pin 91 I/O — User I/O pin (bank 4)
Pin 92 I/O — User I/O pin (bank 4)
Pin 93 I/O — User I/O pin (bank 4)
Pin 94 I/O — User I/O pin (bank 4)
Pin 95 GND — Ground
Pin 96 VCCIO4 — I/O bank 4 supply voltage
Pin 97 I/O — User I/O pin (bank 4)
Pin 98 I/O — User I/O pin (bank 4)
Pin 99 I/O — User I/O pin (bank 4)
Pin 100 I/O — User I/O pin (bank 4)
Pin 101 I/O — User I/O pin (bank 4)
Pin 102 I/O — User I/O pin (bank 4)
Pin 103 I/O — User I/O pin (bank 4)
Pin 104 I/O — User I/O pin (bank 4)
Pin 105 GND — Ground
Pin 106 I/O — User I/O pin (bank 4)
Pin 107 I/O — User I/O pin (bank 4)
Pin 108 I/O — User I/O pin (bank 4)
Pin 109 I/O — User I/O pin (bank 4)
Pin 110 I/O — User I/O pin (bank 4)
Pin 111 I/O — User I/O pin (bank 4)
Pin 112 I/O — User I/O pin (bank 4)
Pin 113 I/O — User I/O pin (bank 4)
Pin 114 I/O — User I/O pin (bank 4)
Pin 115 I/O — User I/O pin (bank 4)
Pin 116 GND — Ground
Pin 117 VCCINT — Core supply voltage (3.3 V)
Pin 118 I/O — User I/O pin (bank 1)
Pin 119 I/O — User I/O pin (bank 1)
Pin 120 I/O — User I/O pin (bank 1)
Pin 121 I/O — User I/O pin (bank 1)
Pin 122 I/O — User I/O pin (bank 1)
Pin 123 I/O — User I/O pin (bank 1)
Pin 124 GND — Ground
Pin 125 VCCIO1 — I/O bank 1 supply voltage
Pin 126 I/O — User I/O pin (bank 1)
Pin 127 I/O — User I/O pin (bank 1)
Pin 128 I/O — User I/O pin (bank 1)
Pin 129 I/O — User I/O pin (bank 1)
Pin 130 I/O — User I/O pin (bank 1)
Pin 131 I/O — User I/O pin (bank 1)
Pin 132 I/O — User I/O pin (bank 1)
Pin 133 I/O — User I/O pin (bank 1)
Pin 134 GND — Ground
Pin 135 I/O — User I/O pin (bank 1)
Pin 136 I/O — User I/O pin (bank 1)
Pin 137 I/O — User I/O pin (bank 1)
Pin 138 I/O — User I/O pin (bank 1)
Pin 139 I/O — User I/O pin (bank 1)
Pin 140 I/O — User I/O pin (bank 1)
Pin 141 I/O — User I/O pin (bank 1)
Pin 142 I/O — User I/O pin (bank 1)
Pin 143 I/O — User I/O pin (bank 1)
Pin 144 TDO — JTAG Test Data Out

Aplicaciones típicas

EPM570GT144C4N es adecuado para 6 aplicacións: Industrial I/O Expansion and Bus Bridging, Power-Up/Power-Down Sequencing for ASICs and Processors, LED Display Driving and Multiplexing, Peripheral Glue Logic in Embedded Systems, JTAG Chain and Boundary-Scan Control, State-Machine and Protocol Conversion Engines.

🏭

Industrial I/O Expansion and Bus Bridging

The EPM570GT144C4N is widely used in industrial control boards to expand microcontroller or SoC I/O count, implement bus bridges between mismatched interfaces (e.g., parallel to SPI), and perform address decoding. Its 570 logic elements (440 macrocells) and 116 user I/Os are sufficient to replace 4-6 discrete 74-series logic packages while fitting in a compact 144-pin TQFP. The non-volatile flash configuration means the design starts at the correct state within microseconds of power-up, critical for safety controllers and deterministic real-time systems. MultiVolt I/O support (1.5/1.8/2.5/3.3 V) lets the same CPLD interface to legacy 5 V-tolerant transceivers and modern 1.8 V processors without level shifters. Engineers typically design the EPM570 as a co-processor to a small MCU, offloading glue logic and freeing the MCU for application code.

⚡

Power-Up/Power-Down Sequencing for ASICs and Processors

The EPM570GT144C4N is ideal for managing power rail sequencing in multi-rail systems. Its instant-on non-volatile flash ensures the CPLD is operational the moment VCCINT reaches 3.3 V, well before downstream regulators stabilize. Engineers program the 570 logic elements to generate precise enable signals with defined delays, monitor PG (power-good) inputs, and assert reset to processors/ASICs only after all rails are within spec. The 8 Kbit on-chip User Flash Memory (UFM) is commonly used to store board revision codes, calibration data, or fault logs. The JTAG interface (IEEE 1149.1) provides in-system programming, so sequencing logic can be updated in the field without removing the part. This is a standard use case in telecom base-station, networking, and FPGA-based computing boards.

💡

LED Display Driving and Multiplexing

The EPM570GT144C4N's 440 macrocells and 116 user I/Os make it a strong fit for driving large LED matrices, segment displays, or scan-multiplexed panels. Its deterministic 5.4 ns tPD timing allows flicker-free row scanning at 1 kHz+ refresh rates, while the 0.18 µm flash process provides robust output drive suitable for direct LED cathodes (with appropriate current-limiting resistors). The non-volatile configuration eliminates the blank-screen period that FPGA-based LED controllers exhibit during configuration. The 8 Kbit UFM can store lookup tables for character fonts, animations, or gamma correction curves. Designers often pair the EPM570 with a small microcontroller for content updates while the CPLD handles the real-time multiplexing and PWM dimming in parallel.

🧩

Peripheral Glue Logic in Embedded Systems

The EPM570GT144C4N excels at consolidating scattered 74HC/74LVC logic into a single non-volatile device. A typical board might replace 8-12 discrete gates (AND/OR/flip-flop/MUX) with one EPM570, reducing PCB area, BOM count, and assembly cost. The CPLD's 16-macrocell LABs are well suited to mixed-width registers, address decoders, chip-select generators, and interrupt controllers. Because configuration is flash-based, the design is in-spec on every power-up - no FPGA bitstream loading delay. The JTAG port allows field updates over the same header used for MCU debug, simplifying manufacturing. The 144-pin TQFP footprint is also shared with the larger EPM1270 and EPM2210, giving designers a vertical-migration path without PCB rework.

🔧

JTAG Chain and Boundary-Scan Control

With built-in JTAG (IEEE 1149.1) boundary-scan and in-system programmability, the EPM570GT144C4N is frequently deployed as a JTAG bridge or scan-chain controller in multi-device boards. The CPLD can fan out JTAG to multiple downstream FPGAs/processors, perform BSCAN (boundary-scan) tests on-board, and embed the JTAG header of the system. The 8 Kbit UFM is useful for storing board-test firmware or boundary-scan descriptions. The MultiVolt I/O (1.5/1.8/2.5/3.3 V) lets one EPM570 work with mixed-voltage JTAG chains. For production test, the JTAG port allows fast factory programming and field firmware updates without external boot devices.

🌐

State-Machine and Protocol Conversion Engines

The EPM570GT144C4N's 570 logic elements comfortably implement multi-state controllers and protocol converters such as UART-to-SPI, I2C-to-parallel, or custom serial-to-parallel bridges. Its deterministic 5.4 ns tPD and 16-macrocell LAB structure make state-machine timing trivial to model and verify. Designers can use the 8 Kbit UFM to store protocol lookup tables, timing constants, or EEPROM emulation. The 144-pin TQFP provides ample I/O for parallel data buses plus control signals, and the instant-on flash configuration ensures the converter is ready the moment power is applied - ideal for fan-out, sensor aggregation, and machine-to-machine gateway designs.

Resumen de productos recomendados

EPM570GT100C4N Altera Se usa en: Industrial I/O Expansion and Bus Bridging, LED Display Driving and Multiplexing, State-Machine and Protocol Conversion Engines EPM1270GT144C4N Same package, higher density (1270 LEs) for design growth Se usa en: Industrial I/O Expansion and Bus Bridging, Peripheral Glue Logic in Embedded Systems EPM570GT144C3N Intel Se usa en: Power-Up/Power-Down Sequencing for ASICs and Processors EPM240GT144C4N Smaller 240-LE variant for simpler glue logic Se usa en: Peripheral Glue Logic in Embedded Systems EPM570GT144I4N Industrial temperature variant for outdoor/telecom test gear Se usa en: JTAG Chain and Boundary-Scan Control
What is the logic density of EPM570GT144C4N?
The EPM570GT144C4N provides 570 logic elements (LEs) organized as 440 macrocells across 28 logic array blocks (LABs) in the MAX II family. According to the Altera MAX II device handbook, this density sits between the EPM240 (240 LEs) and EPM1270 (1270 LEs) and is suitable for mid-complexity glue logic, bus interfaces, and state-machine designs that exceed small PLD capacity but do not need an FPGA.
What is the difference between EPM570GT144C4N and EPM570GT144I4N?
The EPM570GT144C4N is the commercial-temperature (0 °C to +85 °C) speed-grade C4 device, while the EPM570GT144I4N is the industrial-temperature (-40 °C to +100 °C) version of the same die and 144-pin TQFP package. Both share the same 5.4 ns tPD timing and 570 LE density, making the I4N a drop-in replacement for designs that require wider thermal range.
Where to buy EPM570GT144C4N online?
The EPM570GT144C4N is currently stocked at DigiKey (Altera manufacturer part 544-1407-ND), Mouser, Heisener, Octopart-listed distributors, and Nantian Electronics. As of 2026-09-12, Heisener lists in stock at $35.63 per unit. Lead times vary; check the live distributor listings for the most current pricing and inventory.
What is the price of EPM570GT144C4N?
As of 2026-09-12, the EPM570GT144C4N unit price at Heisener is $35.63 for qty 1, with quantity breaks typically lowering to around $22.50 at qty 1000. Distributor pricing on DigiKey and Mouser may differ; we recommend comparing live Octopart results for the best bulk pricing for your volume.
What is the lead time for EPM570GT144C4N?
Lead time for the EPM570GT144C4N is distributor-specific. As of 2026-09-12, Heisener reports an estimated delivery window of October 17 to October 22. Authorized distributors like DigiKey and Mouser typically stock this mature part; check each distributor for real-time stock status before placing production orders.
Is EPM570GT144C4N in stock right now?
Yes, as of 2026-09-12 the EPM570GT144C4N is in stock at Heisener (7,216 pieces confirmed) and listed in distributor catalogs on DigiKey, Mouser, and Nantian. Stock levels fluctuate; for production runs we recommend confirming inventory and lead time directly with your preferred distributor before releasing the PO.
EPM570GT144C4N vs EPM570GT100C4N - which is better for I/O expansion?
Choose the EPM570GT144C4N when you need maximum I/O count - it provides up to 116 user I/Os in a 144-pin TQFP. Choose the EPM570GT100C4N (100-pin TQFP) when your design needs fewer I/Os - it offers fewer user I/Os but shares the same 570 LE density, 5.4 ns tPD, and identical logic fabric. Both share the same 0.18 µm flash process and are pin-compatible only within the same package.
When should I choose EPM570GT144C4N over EPM1270GT144C4N?
Choose the EPM570GT144C4N when your logic needs fit within 570 LEs - it is the lowest-cost MAX II option in the 144-pin TQFP. Choose the EPM1270GT144C4N when your design exceeds 570 LEs, needs 1270 LEs (~980 macrocells), or requires the extra UFM or I/O bandwidth the 1270 provides. Both share the 144-pin TQFP footprint for PCB migration.
What is the best drop-in replacement for EPM570GT144C4N?
The closest drop-in replacement is EPM570GT144C3N, which is the same die in a faster C3 speed grade (~4.5 ns tPD) in the identical 144-pin TQFP package. For industrial temperature range, EPM570GT144I4N provides the same silicon in the same package but with -40 °C to +100 °C operation. Both are second-sourced within the MAX II family and require no PCB change.
Can EPM240GT100C4N replace EPM570GT144C4N?
No - the EPM240GT100C4N uses a 100-pin TQFP package with only 240 LEs, and it is NOT a drop-in replacement for the EPM570GT144C4N. The 240 has only ~80 macrocells vs the 570's 440 macrocells, and the smaller 100-pin package has different I/O mapping. A board redesign would be required; this is a redesign-level substitution, not a drop-in.
Where to download EPM570GT144C4N datasheet PDF?
The official EPM570GT144C4N datasheet (MAX II Device Family datasheet) is available as a PDF on the Altera/Intel website. The document covers pinout, electrical characteristics, timing, and the JTAG programming interface. According to the datasheet, the part is in the 144-pin TQFP (GT suffix) package, speed grade C4, commercial temperature range.
Where to find the EPM570GT144C4N pinout?
The 144-pin TQFP pinout for the EPM570GT144C4N is documented in the MAX II device handbook. The 144-pin TQFP provides 116 user I/Os plus JTAG (TDI, TDO, TMS, TCK), power (VCCINT, VCCIO banks), and ground pins. The MAX II device family datasheet contains the full pin table; Quartus II software also provides pinout files for board design.
What is the operating voltage of EPM570GT144C4N?
The EPM570GT144C4N operates with a 3.3 V core supply (VCCINT) and supports MultiVolt I/O at 1.5 V, 1.8 V, 2.5 V, and 3.3 V on the same die. This MultiVolt capability allows direct interfacing with mixed-voltage logic families without external level shifters, simplifying PCB design and reducing BOM cost for systems using legacy 5 V or modern 1.8 V devices.
What is the output noise or signal integrity behavior of EPM570GT144C4N?
The EPM570GT144C4N is a digital CMOS CPLD and does not generate analog output noise in the LDO/sense-amp sense. Signal integrity is governed by its 5.4 ns pin-to-pin delay and I/O slew-rate control. For high-speed designs above 100 MHz, use the Quartus II timing analyzer and follow Altera's recommended PCB layout guidelines for the 144-pin TQFP.
What are the key specifications of EPM570GT144C4N that engineers should know?
The key specifications are: 570 logic elements, 440 macrocells, 116 user I/Os, 8 Kbit UFM, 5.4 ns tPD (C4 grade), 3.3 V core, MultiVolt I/O (1.5/1.8/2.5/3.3 V), 144-pin TQFP package, JTAG programming (IEEE 1149.1), commercial temperature 0 °C to +85 °C, instant-on non-volatile flash configuration, and vertical migration compatibility with the EPM240, EPM1270, and EPM2210 in the 144-pin TQFP.

Datos de referencia de ingeniería para EPM570GT144C4N — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the EPM570GT144C4N when your design needs ~500-600 logic elements, fits in the 144-pin TQFP footprint, runs in commercial temperature (0-85 °C), and benefits from a non-volatile, instant-on MAX II CPLD. It is the mid-density sweet spot in the MAX II family. Upgrade to the EPM570GT144C3N for ~20% faster timing in the same package, or to the EPM570GT144I4N for industrial temperature. If your design exceeds 570 LEs, move to the EPM1270GT144C4N; if it fits in 240 LEs, save cost with the EPM240GT144C4N. All MAX II parts share vertical-migration compatibility within the 144-pin TQFP, so a single PCB layout can support multiple density SKUs.

Comparación con alternativas

Parámetro Este producto EPM570GT144C3N EPM570GT144I4N EPM570GT144C4 EPM570GT144C3 EPM1270GT144C4N EPM240GT144C4N
Package 144-pin TQFP 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Family MAX II MAX II MAX II MAX II MAX II MAX II MAX II
Logic Elements 570 570 570 570 570 1270 240
Macrocells 440 440 440 440 440 980 192
Maximum User I/O 116 116 116 116 116 116 116
Speed Grade (tPD) 5.4 ns (C4) 4.5 ns (C3, faster) 5.4 ns (C4, same) 5.4 ns (C4, same) 4.5 ns (C3, faster) 5.4 ns (C4, same) 5.4 ns (C4, same)
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) -40 °C to +100 °C (industrial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial)

Diferenciadores clave

  • Faster speed grade available in same package (frente a EPM570GT144C3N)
  • Industrial temperature range in same package (frente a EPM570GT144I4N)
  • Vertical migration within same package (frente a EPM1270GT144C4N and EPM240GT144C4N)

Notas de diseño

The EPM570GT144C4N requires a 3.3 V VCCINT core supply and one or more VCCIO bank supplies (1.5/1.8/2.5/3.3 V) selected per I/O bank. Decouple each VCCINT pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the pin, and add a 10 µF bulk capacitor at the regulator output. All GND pins (12 pins on the 144-TQFP) MUST be connected to a solid ground plane; the device uses the ground pins for both signal return and thermal dissipation. VCCIO banks can be powered independently, allowing mixed-voltage interfaces (e.g., 3.3 V to MCU + 1.8 V to DSP) on the same die without external level shifters.

Estimated: at 100 MHz toggle rate with 16-bit parallel data, the 144-pin TQFP draws approximately 30-50 mA from VCCINT. Route all four VCCINT pins (30, 59, 88, 117 in the datasheet pin table) and all GND pins (12 pins) with short, wide traces or via arrays to inner power/ground planes. Keep JTAG traces (TDI/TDO/TMS/TCK) short and route TCK away from switching outputs to avoid coupling. For MultiVolt I/O, place 0.1 µF + 10 µF decoupling on each VCCIO bank pin. The 144-pin TQFP has a thermal pad-free bottom, so no central thermal via array is required, but a copper flood under the part helps dissipate the ~0.5 W typical dissipation.

Common pitfalls: (1) Do not confuse C4 speed grade with C5 - C4 is the slowest commercial grade at 5.4 ns tPD; C3 is faster at 4.5 ns; C5 is the slowest. (2) The C4N suffix indicates tape-and-reel packaging; if you need tray, choose C4 (no N). (3) Do not exceed the maximum I/O current per pin (typically 25 mA DC) without external buffering. (4) UFM (User Flash Memory) is rated for 100,000 erase/program cycles - design around this limit if using UFM as EEPROM emulation. (5) The JTAG pins have internal weak pull-ups; if you chain JTAG to other devices, account for the cumulative pull-up current.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Compliant

RoHS compliant and lead-free per Altera/Intel MAX II product page. Not AEC-Q100 qualified; for automotive applications use the EPM570GT144I4N industrial variant with additional system-level qualification.

Datos verificados el: 2026-09-12 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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Componentes & términos relacionados

Intel Altera EPM570GT144C4N EPM570 MAX II CPLD Complex Programmable Logic Device non-volatile CPLD logic element (LE) macrocell User Flash Memory (UFM) 144-pin TQFP TQFP package MultiVolt I/O JTAG IEEE 1149.1 0.18 µm flash process instant-on glue logic bus bridge power sequencing boundary scan Quartus II RoHS industrial temperature
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