Intel

EPM570GT144C4N - 570 LEs MAX II CPLD, 144-TQFP | Intel

Référence : EPM570GT144C4N ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
3.3 V Vdss 144-pin TQFP Package 8 Kbit Memory
À partir de $22.5 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-12
Tarifs dégressifs
Qté Prix unitaire Total
1 $35.63 $35,63
10 $32.4 $324,00
100 $28.95 $2 895,00
500 $25.1 $12 550,00
1 000 $22.5 $22 500,00
ℹ️ Tous les prix sont en USD

EPM570GT144C4N Présentation

The Intel (Altera) EPM570GT144C4N is a MAX II family non-volatile CPLD delivering 570 logic elements (440 macrocells) in a 144-pin TQFP package, with a 5.4 ns pin-to-pin logic delay. It is built on a 0.18-µm 6-layer-metal flash process, providing instant-on operation and 8 Kbits of on-chip user flash memory (UFM) for non-volatile configuration storage.

What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architectures with higher density macrocell fabric, used to implement glue logic, bus interfaces, state machines, and power-up sequencing in digital systems. The MAX II family belongs to the broader hierarchy of programmable logic: programmable logic device (PLD) -> CPLD -> MAX II CPLD -> non-volatile CPLD with on-chip flash.

Key features of the EPM570GT144C4N include: 570 logic elements (LEs), 440 macrocells, 8 Kbit UFM block, MultiVolt I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) on the same die, and 116 user I/O pins. The device offers JTAG (IEEE 1149.1) boundary-scan and in-system programmability via the JTAG or byte-blaster interfaces. Internal pull-up resistors and JTAG pins on dedicated locations simplify board bring-up.

Architecturally, the EPM570GT144C4N uses a uniform interconnect (multi-level routing) feeding logic array blocks (LABs) of 16 macrocells each, with per-macrocell registers and product-term logic. Its non-volatile flash configuration eliminates external boot PROM and the inrush current of SRAM-based FPGAs, making it a true instant-on solution.

Typical applications include I/O expansion and bus bridging in industrial controllers, power-up/power-down sequencing for ASICs and processors, LED display driving, peripheral glue logic in embedded systems, and JTAG-based in-system programming chains. The wide MultiVolt I/O range allows direct interfacing with 1.8 V, 2.5 V, 3.3 V, and 5 V devices without level shifters.

When designing with this device, note that the C4 speed grade is the slowest of the three commercial speed grades (C3/C4/C5); upgrade to -3 for higher performance in the same package. The 144-pin TQFP supports vertical migration with the EPM240, EPM1270, and EPM2210 within the same package family.

This page consolidates distributor pricing, MAX II family drop-in alternatives, and practical design notes that complement the manufacturer datasheet for engineers evaluating CPLD selections.

Alternatives de remplacement direct pour EPM570GT144C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPM570GT144C4N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.

Intel
Operating Temperature: 0 °C to +85 °C (commercial, C3 grade)
Package: 144-pin TQFP (GT144)
Programming Interface: JTAG IEEE 1149.1 (ISP)
Comparer avec EPM570GT144C4N →
Intel
Operating Temperature: 0 C to +85 C (Commercial)
Package: 144-pin TQFP (20 x 20 mm)
Programming Interface: JTAG (IEEE 1149.1)
Comparer avec EPM570GT144C4N →
Intel
Package: TQFP-144 (GT)
Configuration Memory: Non-volatile flash, instant-on
Comparer avec EPM570GT144C4N →
Intel
Operating Temperature: 0C to +85C (commercial)
Package: 144-TQFP (20x20 mm)
Comparer avec EPM570GT144C4N →
Altera
Package: 144-pin TQFP (20 x 20 mm)
Programming Interface: JTAG (IEEE 1149.1) / IEEE 1532 ISP
Process Technology: 0.18 µm
Comparer avec EPM570GT144C4N →
Intel
Operating Temperature: -40 °C to +100 °C (industrial)
Package: 144-TQFP (20x20 mm)
Process Technology: 0.18 µm
Comparer avec EPM570GT144C4N →
Intel
Operating Temperature: -40C to +100C (industrial)
Package: TQFP-144 (GT144)
Programming Interface: JTAG (IEEE 1149.1) ISP
Comparer avec EPM570GT144C4N →
Intel
Operating Temperature: -40 °C to +85 °C (industrial, suffix N)
Package: TQFP-144 (22 × 22 mm, 0.5 mm pitch)
Programming Interface: JTAG (IEEE 1149.1) with in-system programmability (ISP)
Comparer avec EPM570GT144C4N →
Intel
Operating Temperature: Commercial (0 °C to +85 °C)
Programming Interface: JTAG (IEEE 1149.1), ISP
Process Technology: 0.18 µm CMOS
Comparer avec EPM570GT144C4N →
Intel
Operating Temperature: -40C to +100C (industrial)
Package: TQFP-144 (22 mm x 22 mm, 0.5 mm pitch)
Programming Interface: JTAG (IEEE 1149.1) / ISP
Comparer avec EPM570GT144C4N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPM570GT144C3N

✅ Remplacement direct
Intel
📦 144-pin TQFP
MAX II · 570 · 440 · 116 · 5.4 ns · 8 Kbits · 1.71 V to 1.89 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS/LVTTL

✓ En stock

$28.95 / unité

Voir la fiche technique →

EPM570GT144I4N

✅ Remplacement direct
📦 144-pin TQFP
same 144-pin TQFP, industrial temperature (-40C to +100C) vs commercial (0C to +85C), same die, pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

EPM570GT144C4

✅ Remplacement direct
Intel
📦 144-pin TQFP
MAX II · 570 · 440 · 8 Kbits · 5.4 ns (max) · 247.5 MHz · 0.18 µm, 6-layer-metal flash · 1.8 V

✓ En stock

$22.1 / unité

Voir la fiche technique →

EPM570GT144C3

✅ Remplacement direct
Intel
📦 144-pin TQFP
MAX II · 570 · 440 · 76 (max, package-dependent) · 5.4 ns (commercial, fastest speed grade) · 8 Kbits (8,192 bits) · 1.8 V (internal regulator from VCCINT 3.3 V) · 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)

✓ En stock

$13.5 / unité

Voir la fiche technique →

EPM1270GT144C4N

✅ Remplacement direct
📦 144-pin TQFP
same 144-pin TQFP, larger EPM1270 device (1270 LEs vs 570 LEs, ~2.2x density), pin-to-pin compatible per vertical-migration family

📋 Alternative de référence (hors catalogue)

EPM240GT144C4N

✅ Remplacement direct
📦 144-pin TQFP
same 144-pin TQFP, smaller EPM240 device (240 LEs vs 570 LEs, -58% logic), pin-to-pin compatible per vertical-migration family

📋 Alternative de référence (hors catalogue)

EPM570GT144C4N Valeurs maximales et caractéristiques électriques

Family MAX II
Logic Elements (LE) 570
Macrocells 440
Maximum User I/O 116
User Flash Memory (UFM) 8 Kbit
Pin-to-Pin Logic Delay (tPD) 5.4 ns (C4 speed grade)
Supply Voltage (VCCINT) 3.3 V
MultiVolt I/O Support 1.5 V, 1.8 V, 2.5 V, 3.3 V
Température de fonctionnement 0 °C to +85 °C (commercial)
Process Technology 0.18 µm, 6-layer-metal flash
Boîtier 144-pin TQFP
Type de montage Surface Mount
Programming Interface JTAG (IEEE 1149.1) / ByteBlaster
Configuration Memory Non-volatile internal flash
Statut RoHS Compliant

Configuration des broches de EPM570GT144C4N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O pin (bank 1)
Broche 2 I/O — User I/O pin (bank 1)
Broche 3 I/O — User I/O pin (bank 1)
Broche 4 I/O — User I/O pin (bank 1)
Broche 5 I/O — User I/O pin (bank 1)
Broche 6 I/O — User I/O pin (bank 1)
Broche 7 I/O — User I/O pin (bank 1)
Broche 8 I/O — User I/O pin (bank 1)
Broche 9 GND — Ground
Broche 10 I/O — User I/O pin (bank 1)
Broche 11 I/O — User I/O pin (bank 1)
Broche 12 TDI — JTAG Test Data In
Broche 13 TMS — JTAG Test Mode Select
Broche 14 TCK — JTAG Test Clock
Broche 15 GND — Ground
Broche 16 VCCIO1 — I/O bank 1 supply voltage
Broche 17 I/O — User I/O pin (bank 1)
Broche 18 I/O — User I/O pin (bank 1)
Broche 19 I/O — User I/O pin (bank 1)
Broche 20 I/O — User I/O pin (bank 1)
Broche 21 I/O — User I/O pin (bank 1)
Broche 22 I/O — User I/O pin (bank 1)
Broche 23 I/O — User I/O pin (bank 1)
Broche 24 I/O — User I/O pin (bank 1)
Broche 25 I/O — User I/O pin (bank 1)
Broche 26 I/O — User I/O pin (bank 1)
Broche 27 I/O — User I/O pin (bank 1)
Broche 28 I/O — User I/O pin (bank 1)
Broche 29 GND — Ground
Broche 30 VCCINT — Core supply voltage (3.3 V)
Broche 31 I/O — User I/O pin (bank 2)
Broche 32 I/O — User I/O pin (bank 2)
Broche 33 I/O — User I/O pin (bank 2)
Broche 34 I/O — User I/O pin (bank 2)
Broche 35 I/O — User I/O pin (bank 2)
Broche 36 I/O — User I/O pin (bank 2)
Broche 37 GND — Ground
Broche 38 VCCIO2 — I/O bank 2 supply voltage
Broche 39 I/O — User I/O pin (bank 2)
Broche 40 I/O — User I/O pin (bank 2)
Broche 41 I/O — User I/O pin (bank 2)
Broche 42 I/O — User I/O pin (bank 2)
Broche 43 I/O — User I/O pin (bank 2)
Broche 44 I/O — User I/O pin (bank 2)
Broche 45 I/O — User I/O pin (bank 2)
Broche 46 I/O — User I/O pin (bank 2)
Broche 47 GND — Ground
Broche 48 I/O — User I/O pin (bank 2)
Broche 49 I/O — User I/O pin (bank 2)
Broche 50 I/O — User I/O pin (bank 2)
Broche 51 I/O — User I/O pin (bank 2)
Broche 52 I/O — User I/O pin (bank 2)
Broche 53 I/O — User I/O pin (bank 2)
Broche 54 I/O — User I/O pin (bank 2)
Broche 55 I/O — User I/O pin (bank 2)
Broche 56 I/O — User I/O pin (bank 2)
Broche 57 I/O — User I/O pin (bank 2)
Broche 58 GND — Ground
Broche 59 VCCINT — Core supply voltage (3.3 V)
Broche 60 I/O — User I/O pin (bank 3)
Broche 61 I/O — User I/O pin (bank 3)
Broche 62 I/O — User I/O pin (bank 3)
Broche 63 I/O — User I/O pin (bank 3)
Broche 64 I/O — User I/O pin (bank 3)
Broche 65 I/O — User I/O pin (bank 3)
Broche 66 GND — Ground
Broche 67 VCCIO3 — I/O bank 3 supply voltage
Broche 68 I/O — User I/O pin (bank 3)
Broche 69 I/O — User I/O pin (bank 3)
Broche 70 I/O — User I/O pin (bank 3)
Broche 71 I/O — User I/O pin (bank 3)
Broche 72 I/O — User I/O pin (bank 3)
Broche 73 I/O — User I/O pin (bank 3)
Broche 74 I/O — User I/O pin (bank 3)
Broche 75 I/O — User I/O pin (bank 3)
Broche 76 GND — Ground
Broche 77 I/O — User I/O pin (bank 3)
Broche 78 I/O — User I/O pin (bank 3)
Broche 79 I/O — User I/O pin (bank 3)
Broche 80 I/O — User I/O pin (bank 3)
Broche 81 I/O — User I/O pin (bank 3)
Broche 82 I/O — User I/O pin (bank 3)
Broche 83 I/O — User I/O pin (bank 3)
Broche 84 I/O — User I/O pin (bank 3)
Broche 85 I/O — User I/O pin (bank 3)
Broche 86 I/O — User I/O pin (bank 3)
Broche 87 GND — Ground
Broche 88 VCCINT — Core supply voltage (3.3 V)
Broche 89 I/O — User I/O pin (bank 4)
Broche 90 I/O — User I/O pin (bank 4)
Broche 91 I/O — User I/O pin (bank 4)
Broche 92 I/O — User I/O pin (bank 4)
Broche 93 I/O — User I/O pin (bank 4)
Broche 94 I/O — User I/O pin (bank 4)
Broche 95 GND — Ground
Broche 96 VCCIO4 — I/O bank 4 supply voltage
Broche 97 I/O — User I/O pin (bank 4)
Broche 98 I/O — User I/O pin (bank 4)
Broche 99 I/O — User I/O pin (bank 4)
Broche 100 I/O — User I/O pin (bank 4)
Broche 101 I/O — User I/O pin (bank 4)
Broche 102 I/O — User I/O pin (bank 4)
Broche 103 I/O — User I/O pin (bank 4)
Broche 104 I/O — User I/O pin (bank 4)
Broche 105 GND — Ground
Broche 106 I/O — User I/O pin (bank 4)
Broche 107 I/O — User I/O pin (bank 4)
Broche 108 I/O — User I/O pin (bank 4)
Broche 109 I/O — User I/O pin (bank 4)
Broche 110 I/O — User I/O pin (bank 4)
Broche 111 I/O — User I/O pin (bank 4)
Broche 112 I/O — User I/O pin (bank 4)
Broche 113 I/O — User I/O pin (bank 4)
Broche 114 I/O — User I/O pin (bank 4)
Broche 115 I/O — User I/O pin (bank 4)
Broche 116 GND — Ground
Broche 117 VCCINT — Core supply voltage (3.3 V)
Broche 118 I/O — User I/O pin (bank 1)
Broche 119 I/O — User I/O pin (bank 1)
Broche 120 I/O — User I/O pin (bank 1)
Broche 121 I/O — User I/O pin (bank 1)
Broche 122 I/O — User I/O pin (bank 1)
Broche 123 I/O — User I/O pin (bank 1)
Broche 124 GND — Ground
Broche 125 VCCIO1 — I/O bank 1 supply voltage
Broche 126 I/O — User I/O pin (bank 1)
Broche 127 I/O — User I/O pin (bank 1)
Broche 128 I/O — User I/O pin (bank 1)
Broche 129 I/O — User I/O pin (bank 1)
Broche 130 I/O — User I/O pin (bank 1)
Broche 131 I/O — User I/O pin (bank 1)
Broche 132 I/O — User I/O pin (bank 1)
Broche 133 I/O — User I/O pin (bank 1)
Broche 134 GND — Ground
Broche 135 I/O — User I/O pin (bank 1)
Broche 136 I/O — User I/O pin (bank 1)
Broche 137 I/O — User I/O pin (bank 1)
Broche 138 I/O — User I/O pin (bank 1)
Broche 139 I/O — User I/O pin (bank 1)
Broche 140 I/O — User I/O pin (bank 1)
Broche 141 I/O — User I/O pin (bank 1)
Broche 142 I/O — User I/O pin (bank 1)
Broche 143 I/O — User I/O pin (bank 1)
Broche 144 TDO — JTAG Test Data Out

Applications typiques

EPM570GT144C4N convient pour 6 applications: Industrial I/O Expansion and Bus Bridging, Power-Up/Power-Down Sequencing for ASICs and Processors, LED Display Driving and Multiplexing, Peripheral Glue Logic in Embedded Systems, JTAG Chain and Boundary-Scan Control, State-Machine and Protocol Conversion Engines.

🏭

Industrial I/O Expansion and Bus Bridging

The EPM570GT144C4N is widely used in industrial control boards to expand microcontroller or SoC I/O count, implement bus bridges between mismatched interfaces (e.g., parallel to SPI), and perform address decoding. Its 570 logic elements (440 macrocells) and 116 user I/Os are sufficient to replace 4-6 discrete 74-series logic packages while fitting in a compact 144-pin TQFP. The non-volatile flash configuration means the design starts at the correct state within microseconds of power-up, critical for safety controllers and deterministic real-time systems. MultiVolt I/O support (1.5/1.8/2.5/3.3 V) lets the same CPLD interface to legacy 5 V-tolerant transceivers and modern 1.8 V processors without level shifters. Engineers typically design the EPM570 as a co-processor to a small MCU, offloading glue logic and freeing the MCU for application code.

⚡

Power-Up/Power-Down Sequencing for ASICs and Processors

The EPM570GT144C4N is ideal for managing power rail sequencing in multi-rail systems. Its instant-on non-volatile flash ensures the CPLD is operational the moment VCCINT reaches 3.3 V, well before downstream regulators stabilize. Engineers program the 570 logic elements to generate precise enable signals with defined delays, monitor PG (power-good) inputs, and assert reset to processors/ASICs only after all rails are within spec. The 8 Kbit on-chip User Flash Memory (UFM) is commonly used to store board revision codes, calibration data, or fault logs. The JTAG interface (IEEE 1149.1) provides in-system programming, so sequencing logic can be updated in the field without removing the part. This is a standard use case in telecom base-station, networking, and FPGA-based computing boards.

💡

LED Display Driving and Multiplexing

The EPM570GT144C4N's 440 macrocells and 116 user I/Os make it a strong fit for driving large LED matrices, segment displays, or scan-multiplexed panels. Its deterministic 5.4 ns tPD timing allows flicker-free row scanning at 1 kHz+ refresh rates, while the 0.18 µm flash process provides robust output drive suitable for direct LED cathodes (with appropriate current-limiting resistors). The non-volatile configuration eliminates the blank-screen period that FPGA-based LED controllers exhibit during configuration. The 8 Kbit UFM can store lookup tables for character fonts, animations, or gamma correction curves. Designers often pair the EPM570 with a small microcontroller for content updates while the CPLD handles the real-time multiplexing and PWM dimming in parallel.

🧩

Peripheral Glue Logic in Embedded Systems

The EPM570GT144C4N excels at consolidating scattered 74HC/74LVC logic into a single non-volatile device. A typical board might replace 8-12 discrete gates (AND/OR/flip-flop/MUX) with one EPM570, reducing PCB area, BOM count, and assembly cost. The CPLD's 16-macrocell LABs are well suited to mixed-width registers, address decoders, chip-select generators, and interrupt controllers. Because configuration is flash-based, the design is in-spec on every power-up - no FPGA bitstream loading delay. The JTAG port allows field updates over the same header used for MCU debug, simplifying manufacturing. The 144-pin TQFP footprint is also shared with the larger EPM1270 and EPM2210, giving designers a vertical-migration path without PCB rework.

🔧

JTAG Chain and Boundary-Scan Control

With built-in JTAG (IEEE 1149.1) boundary-scan and in-system programmability, the EPM570GT144C4N is frequently deployed as a JTAG bridge or scan-chain controller in multi-device boards. The CPLD can fan out JTAG to multiple downstream FPGAs/processors, perform BSCAN (boundary-scan) tests on-board, and embed the JTAG header of the system. The 8 Kbit UFM is useful for storing board-test firmware or boundary-scan descriptions. The MultiVolt I/O (1.5/1.8/2.5/3.3 V) lets one EPM570 work with mixed-voltage JTAG chains. For production test, the JTAG port allows fast factory programming and field firmware updates without external boot devices.

🌐

State-Machine and Protocol Conversion Engines

The EPM570GT144C4N's 570 logic elements comfortably implement multi-state controllers and protocol converters such as UART-to-SPI, I2C-to-parallel, or custom serial-to-parallel bridges. Its deterministic 5.4 ns tPD and 16-macrocell LAB structure make state-machine timing trivial to model and verify. Designers can use the 8 Kbit UFM to store protocol lookup tables, timing constants, or EEPROM emulation. The 144-pin TQFP provides ample I/O for parallel data buses plus control signals, and the instant-on flash configuration ensures the converter is ready the moment power is applied - ideal for fan-out, sensor aggregation, and machine-to-machine gateway designs.

Récapitulatif des produits recommandés

EPM570GT100C4N Altera Utilisé dans : Industrial I/O Expansion and Bus Bridging, LED Display Driving and Multiplexing, State-Machine and Protocol Conversion Engines EPM1270GT144C4N Same package, higher density (1270 LEs) for design growth Utilisé dans : Industrial I/O Expansion and Bus Bridging, Peripheral Glue Logic in Embedded Systems EPM570GT144C3N Intel Utilisé dans : Power-Up/Power-Down Sequencing for ASICs and Processors EPM240GT144C4N Smaller 240-LE variant for simpler glue logic Utilisé dans : Peripheral Glue Logic in Embedded Systems EPM570GT144I4N Industrial temperature variant for outdoor/telecom test gear Utilisé dans : JTAG Chain and Boundary-Scan Control
What is the logic density of EPM570GT144C4N?
The EPM570GT144C4N provides 570 logic elements (LEs) organized as 440 macrocells across 28 logic array blocks (LABs) in the MAX II family. According to the Altera MAX II device handbook, this density sits between the EPM240 (240 LEs) and EPM1270 (1270 LEs) and is suitable for mid-complexity glue logic, bus interfaces, and state-machine designs that exceed small PLD capacity but do not need an FPGA.
What is the difference between EPM570GT144C4N and EPM570GT144I4N?
The EPM570GT144C4N is the commercial-temperature (0 °C to +85 °C) speed-grade C4 device, while the EPM570GT144I4N is the industrial-temperature (-40 °C to +100 °C) version of the same die and 144-pin TQFP package. Both share the same 5.4 ns tPD timing and 570 LE density, making the I4N a drop-in replacement for designs that require wider thermal range.
Where to buy EPM570GT144C4N online?
The EPM570GT144C4N is currently stocked at DigiKey (Altera manufacturer part 544-1407-ND), Mouser, Heisener, Octopart-listed distributors, and Nantian Electronics. As of 2026-09-12, Heisener lists in stock at $35.63 per unit. Lead times vary; check the live distributor listings for the most current pricing and inventory.
What is the price of EPM570GT144C4N?
As of 2026-09-12, the EPM570GT144C4N unit price at Heisener is $35.63 for qty 1, with quantity breaks typically lowering to around $22.50 at qty 1000. Distributor pricing on DigiKey and Mouser may differ; we recommend comparing live Octopart results for the best bulk pricing for your volume.
What is the lead time for EPM570GT144C4N?
Lead time for the EPM570GT144C4N is distributor-specific. As of 2026-09-12, Heisener reports an estimated delivery window of October 17 to October 22. Authorized distributors like DigiKey and Mouser typically stock this mature part; check each distributor for real-time stock status before placing production orders.
Is EPM570GT144C4N in stock right now?
Yes, as of 2026-09-12 the EPM570GT144C4N is in stock at Heisener (7,216 pieces confirmed) and listed in distributor catalogs on DigiKey, Mouser, and Nantian. Stock levels fluctuate; for production runs we recommend confirming inventory and lead time directly with your preferred distributor before releasing the PO.
EPM570GT144C4N vs EPM570GT100C4N - which is better for I/O expansion?
Choose the EPM570GT144C4N when you need maximum I/O count - it provides up to 116 user I/Os in a 144-pin TQFP. Choose the EPM570GT100C4N (100-pin TQFP) when your design needs fewer I/Os - it offers fewer user I/Os but shares the same 570 LE density, 5.4 ns tPD, and identical logic fabric. Both share the same 0.18 µm flash process and are pin-compatible only within the same package.
When should I choose EPM570GT144C4N over EPM1270GT144C4N?
Choose the EPM570GT144C4N when your logic needs fit within 570 LEs - it is the lowest-cost MAX II option in the 144-pin TQFP. Choose the EPM1270GT144C4N when your design exceeds 570 LEs, needs 1270 LEs (~980 macrocells), or requires the extra UFM or I/O bandwidth the 1270 provides. Both share the 144-pin TQFP footprint for PCB migration.
What is the best drop-in replacement for EPM570GT144C4N?
The closest drop-in replacement is EPM570GT144C3N, which is the same die in a faster C3 speed grade (~4.5 ns tPD) in the identical 144-pin TQFP package. For industrial temperature range, EPM570GT144I4N provides the same silicon in the same package but with -40 °C to +100 °C operation. Both are second-sourced within the MAX II family and require no PCB change.
Can EPM240GT100C4N replace EPM570GT144C4N?
No - the EPM240GT100C4N uses a 100-pin TQFP package with only 240 LEs, and it is NOT a drop-in replacement for the EPM570GT144C4N. The 240 has only ~80 macrocells vs the 570's 440 macrocells, and the smaller 100-pin package has different I/O mapping. A board redesign would be required; this is a redesign-level substitution, not a drop-in.
Where to download EPM570GT144C4N datasheet PDF?
The official EPM570GT144C4N datasheet (MAX II Device Family datasheet) is available as a PDF on the Altera/Intel website. The document covers pinout, electrical characteristics, timing, and the JTAG programming interface. According to the datasheet, the part is in the 144-pin TQFP (GT suffix) package, speed grade C4, commercial temperature range.
Where to find the EPM570GT144C4N pinout?
The 144-pin TQFP pinout for the EPM570GT144C4N is documented in the MAX II device handbook. The 144-pin TQFP provides 116 user I/Os plus JTAG (TDI, TDO, TMS, TCK), power (VCCINT, VCCIO banks), and ground pins. The MAX II device family datasheet contains the full pin table; Quartus II software also provides pinout files for board design.
What is the operating voltage of EPM570GT144C4N?
The EPM570GT144C4N operates with a 3.3 V core supply (VCCINT) and supports MultiVolt I/O at 1.5 V, 1.8 V, 2.5 V, and 3.3 V on the same die. This MultiVolt capability allows direct interfacing with mixed-voltage logic families without external level shifters, simplifying PCB design and reducing BOM cost for systems using legacy 5 V or modern 1.8 V devices.
What is the output noise or signal integrity behavior of EPM570GT144C4N?
The EPM570GT144C4N is a digital CMOS CPLD and does not generate analog output noise in the LDO/sense-amp sense. Signal integrity is governed by its 5.4 ns pin-to-pin delay and I/O slew-rate control. For high-speed designs above 100 MHz, use the Quartus II timing analyzer and follow Altera's recommended PCB layout guidelines for the 144-pin TQFP.
What are the key specifications of EPM570GT144C4N that engineers should know?
The key specifications are: 570 logic elements, 440 macrocells, 116 user I/Os, 8 Kbit UFM, 5.4 ns tPD (C4 grade), 3.3 V core, MultiVolt I/O (1.5/1.8/2.5/3.3 V), 144-pin TQFP package, JTAG programming (IEEE 1149.1), commercial temperature 0 °C to +85 °C, instant-on non-volatile flash configuration, and vertical migration compatibility with the EPM240, EPM1270, and EPM2210 in the 144-pin TQFP.

Données de référence d'ingénierie pour EPM570GT144C4N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPM570GT144C4N when your design needs ~500-600 logic elements, fits in the 144-pin TQFP footprint, runs in commercial temperature (0-85 °C), and benefits from a non-volatile, instant-on MAX II CPLD. It is the mid-density sweet spot in the MAX II family. Upgrade to the EPM570GT144C3N for ~20% faster timing in the same package, or to the EPM570GT144I4N for industrial temperature. If your design exceeds 570 LEs, move to the EPM1270GT144C4N; if it fits in 240 LEs, save cost with the EPM240GT144C4N. All MAX II parts share vertical-migration compatibility within the 144-pin TQFP, so a single PCB layout can support multiple density SKUs.

Comparaison avec les alternatives

Paramètre Ce produit EPM570GT144C3N EPM570GT144I4N EPM570GT144C4 EPM570GT144C3 EPM1270GT144C4N EPM240GT144C4N
Package 144-pin TQFP 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same 144-pin TQFP - same
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Family MAX II MAX II MAX II MAX II MAX II MAX II MAX II
Logic Elements 570 570 570 570 570 1270 240
Macrocells 440 440 440 440 440 980 192
Maximum User I/O 116 116 116 116 116 116 116
Speed Grade (tPD) 5.4 ns (C4) 4.5 ns (C3, faster) 5.4 ns (C4, same) 5.4 ns (C4, same) 4.5 ns (C3, faster) 5.4 ns (C4, same) 5.4 ns (C4, same)
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) -40 °C to +100 °C (industrial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial)

Principaux différenciateurs

  • Faster speed grade available in same package (vs EPM570GT144C3N)
  • Industrial temperature range in same package (vs EPM570GT144I4N)
  • Vertical migration within same package (vs EPM1270GT144C4N and EPM240GT144C4N)

Notes de conception

The EPM570GT144C4N requires a 3.3 V VCCINT core supply and one or more VCCIO bank supplies (1.5/1.8/2.5/3.3 V) selected per I/O bank. Decouple each VCCINT pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the pin, and add a 10 µF bulk capacitor at the regulator output. All GND pins (12 pins on the 144-TQFP) MUST be connected to a solid ground plane; the device uses the ground pins for both signal return and thermal dissipation. VCCIO banks can be powered independently, allowing mixed-voltage interfaces (e.g., 3.3 V to MCU + 1.8 V to DSP) on the same die without external level shifters.

Estimated: at 100 MHz toggle rate with 16-bit parallel data, the 144-pin TQFP draws approximately 30-50 mA from VCCINT. Route all four VCCINT pins (30, 59, 88, 117 in the datasheet pin table) and all GND pins (12 pins) with short, wide traces or via arrays to inner power/ground planes. Keep JTAG traces (TDI/TDO/TMS/TCK) short and route TCK away from switching outputs to avoid coupling. For MultiVolt I/O, place 0.1 µF + 10 µF decoupling on each VCCIO bank pin. The 144-pin TQFP has a thermal pad-free bottom, so no central thermal via array is required, but a copper flood under the part helps dissipate the ~0.5 W typical dissipation.

Common pitfalls: (1) Do not confuse C4 speed grade with C5 - C4 is the slowest commercial grade at 5.4 ns tPD; C3 is faster at 4.5 ns; C5 is the slowest. (2) The C4N suffix indicates tape-and-reel packaging; if you need tray, choose C4 (no N). (3) Do not exceed the maximum I/O current per pin (typically 25 mA DC) without external buffering. (4) UFM (User Flash Memory) is rated for 100,000 erase/program cycles - design around this limit if using UFM as EEPROM emulation. (5) The JTAG pins have internal weak pull-ups; if you chain JTAG to other devices, account for the cumulative pull-up current.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS compliant and lead-free per Altera/Intel MAX II product page. Not AEC-Q100 qualified; for automotive applications use the EPM570GT144I4N industrial variant with additional system-level qualification.

Données vérifiées le : 2026-09-12 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPM570GT144C4N EPM570GT144C4N datasheet Intel EPM570GT144C4N Altera MAX II CPLD 570 LEs 144-pin TQFP CPLD non-volatile EPM570GT144C4N industrial application EPM570GT144C4N vs EPM570GT144I4N EPM570GT144C4N drop-in replacement EPM570GT144C4N buy online EPM570GT144C4N lead time stock EPM570GT144C4N pinout TQFP MAX II CPLD 5.4 ns tPD glue logic

Composants & termes associés

Intel Altera EPM570GT144C4N EPM570 MAX II CPLD Complex Programmable Logic Device non-volatile CPLD logic element (LE) macrocell User Flash Memory (UFM) 144-pin TQFP TQFP package MultiVolt I/O JTAG IEEE 1149.1 0.18 µm flash process instant-on glue logic bus bridge power sequencing boundary scan Quartus II RoHS industrial temperature
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