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Samsung Electro-Mechanics

K6T1008C2E-GB70 - 128Kx8 SRAM, 70ns, 5V CMOS | Samsung

N.º de pieza: K6T1008C2E-GB70 ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
4.5 V to 5.5 V Vdss 50 mA (typical) Id 32-pin SOP (SOP-32) Package Asynchronous SRAM (Static RAM) Memory
Desde $1.55 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-04
Precios por volumen
Cant. Precio unitario Total
1 $2.7 $2,70
10 $2.4 $24,00
100 $2.1 $210,00
500 $1.8 $900,00
1.000 $1.55 $1.550,00
ℹ️ Todos los precios están en USD

K6T1008C2E-GB70 Descripción general

The Samsung K6T1008C2E-GB70 is a 128K x 8-bit Low Power CMOS Asynchronous Static RAM (SRAM) organized as 1 Mbit of memory with a 70 ns access time, packaged in a 32-pin Small Outline Package (SOP-32). It operates from a single 4.5 V to 5.5 V supply, with 50 mA typical operating current and CMOS-compatible standby current well under 1 mA. The device is fabricated on Samsung's low-power CMOS process that uses six-transistor (6T) memory cells with full CMOS periphery, eliminating the need for external refresh.

An SRAM (Static Random-Access Memory) is a type of volatile semiconductor memory that stores each bit in a bistable latch, retaining data as long as power is applied without any refresh cycles. SRAMs are positioned in the memory hierarchy between high-density DRAM (which requires refresh) and fast register files (which are too small for general storage). Within the broader taxonomy, SRAM is a member of the volatile memory IC family, which in turn belongs to memory and storage semiconductors. The K6T1008C2E is part of Samsung's legacy K6T family of asynchronous SRAMs, which has been widely second-sourced and is considered an industry-standard pinout.

Key features of the K6T1008C2E-GB70 include fully static operation requiring no clock or refresh, three-state common I/O, TTL-compatible inputs and outputs, and a single Chip Enable (CE) pin plus Output Enable (OE) for bus control. The 70 ns access time (tAA) makes it suitable for moderate-speed microcontroller and embedded processor bus interfaces. The SOP-32 surface-mount package provides a low-profile footprint compatible with standard 32-SOIC land patterns, simplifying PCB layout. The device is offered in commercial (C) and industrial (I) temperature grades, with the -GB suffix denoting SOP-32 package, lead-free, and 70 ns speed bin.

Typical applications include industrial controllers, firmware boot memory, embedded data logging, computing modules, and replacement sourcing for obsolete systems. The wide 5 V supply range and TTL compatibility make it ideal for legacy 5 V microcontrollers and 8/16-bit processor buses where modern synchronous SRAMs are not required. The asynchronous interface simplifies the memory controller design, eliminating the need for clock-aligned control logic.

When designing with this part, verify the tAA timing budget against the host processor's memory cycle time. At 70 ns access time, the part is best suited for host buses running at 14 MHz or lower. For higher performance buses, consider a 55 ns variant or move to a synchronous SRAM. Decoupling with a 0.1 µF ceramic capacitor placed within 5 mm of the VCC pin is recommended for stable operation.

Alternativas directas para K6T1008C2E-GB70 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

K6T1008C2E-GB55

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 SOP-32
Same die and SOP-32 package, 55 ns access time vs 70 ns (-30%); pin-to-pin compatible

📋 Alternativa de referencia (no en el catálogo)

K6T1008C2E-DB70

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 SOP-32
Same die in DIP-32 or alternative Samsung package code; identical 128Kx8 / 70 ns / 5 V specs

📋 Alternativa de referencia (no en el catálogo)

AS6C1008-70PCN

✅ Sustitución directa
📦 SOP-32
128Kx8 async SRAM, 70 ns, 5 V, same SOP-32 footprint; pin-to-pin compatible industry-standard second source

📋 Alternativa de referencia (no en el catálogo)

CY7C109-30VC

✅ Sustitución directa
📦 SOP-32
128Kx8 async SRAM, 30 ns (faster) vs 70 ns target; same SOP-32 footprint and JEDEC pinout

📋 Alternativa de referencia (no en el catálogo)

IS62C1024-70V

✅ Sustitución directa
📦 SOP-32
128Kx8 async SRAM, 70 ns, 5 V; same SOP-32 footprint; pin-to-pin compatible JEDEC layout

📋 Alternativa de referencia (no en el catálogo)

ℹ️ 1 pieza(s) de otro encapsulado ocultas — un encapsulado diferente requiere retrabajo de la PCB y no es una sustitución directa real. Contáctenos si necesita sugerencias de otros encapsulados.

K6T1008C2E-GB70 Valores máximos y características eléctricas

Tipo de memoria Asynchronous SRAM (Static RAM)
Memory Organization 128K x 8 bit
Memory Density 1 Mbit
Access Time (tAA) 70 ns
Supply Voltage (VCC) 4.5 V to 5.5 V
Operating Current (ICC) 50 mA (typical)
Temperatura de funcionamiento Commercial (C) and Industrial (I) grades
Encapsulado 32-pin SOP (SOP-32)
Tipo de montaje Surface Mount
Interfaz Asynchronous parallel
Cell Technology 6T CMOS
I/O Compatibility TTL-compatible
Refresh Requirement None (fully static)
Output Enable (OE) Yes
Chip Enable (CE) Yes (active low)
Lead-Free Yes (per -GB suffix)

Configuración de pines de K6T1008C2E-GB70

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 A14 — Address input A14
Pin 2 A12 — Address input A12
Pin 3 A7 — Address input A7
Pin 4 A6 — Address input A6
Pin 5 A5 — Address input A5
Pin 6 A4 — Address input A4
Pin 7 A3 — Address input A3
Pin 8 A2 — Address input A2
Pin 9 A1 — Address input A1
Pin 10 A0 — Address input A0
Pin 11 I/O0 — Data input/output 0
Pin 12 I/O1 — Data input/output 1
Pin 13 I/O2 — Data input/output 2
Pin 14 GND — Ground
Pin 15 I/O3 — Data input/output 3
Pin 16 I/O4 — Data input/output 4
Pin 17 I/O5 — Data input/output 5
Pin 18 I/O6 — Data input/output 6
Pin 19 I/O7 — Data input/output 7
Pin 20 CE — Chip Enable (active low)
Pin 21 A10 — Address input A10
Pin 22 OE — Output Enable (active low)
Pin 23 A11 — Address input A11
Pin 24 A9 — Address input A9
Pin 25 A8 — Address input A8
Pin 26 A13 — Address input A13
Pin 27 WE — Write Enable (active low)
Pin 28 VCC — Power supply (4.5 V to 5.5 V)
Pin 29 NC — Not connected (per JEDEC 32-SOIC pinout)
Pin 30 NC — Not connected (per JEDEC 32-SOIC pinout)
Pin 31 NC — Not connected (per JEDEC 32-SOIC pinout)
Pin 32 NC — Not connected (per JEDEC 32-SOIC pinout)

Aplicaciones típicas

K6T1008C2E-GB70 es adecuado para 6 aplicacións: Firmware Boot Memory, Embedded Data Logging Buffer, Industrial Controller Scratchpad Memory, Legacy Computing Module Replacement, Point-of-Sale Terminal Memory, Test & Measurement Instrument Buffer.

🖥️

Firmware Boot Memory

The K6T1008C2E-GB70 is well suited as firmware boot memory for legacy 8/16-bit microcontroller systems. Its 128Kx8 organization provides 128 KB of non-volatile-equivalent storage for boot loaders and BIOS code. The 70 ns access time aligns with sub-15 MHz host bus speeds, and the asynchronous SRAM interface with Chip Enable (CE) and Output Enable (OE) eliminates the need for a refresh controller or clock-aligned logic. Recommended companion: a 5 V-tolerant MCU host such as legacy 8051 or H8/300H families, paired with 0.1 µF decoupling within 5 mm of the VCC pin.

🏭

Embedded Data Logging Buffer

The K6T1008C2E-GB70 provides 128 KB of high-speed SRAM buffer memory for embedded data logging applications. Its 5 V CMOS design delivers low standby current, making it suitable for battery-backed systems where data integrity is critical between write cycles. The fully static 6T cell eliminates refresh overhead, simplifying the host firmware. At 70 ns access time, the part comfortably handles data streams from UART, SPI, or parallel sensor front-ends in industrial instrumentation. Recommended companion: a battery-backup supervisor or RTC for non-volatile-like behavior.

🏭

Industrial Controller Scratchpad Memory

The K6T1008C2E-GB70 is widely deployed as scratchpad RAM in industrial PLC and motor control boards. Its 5 V tolerance and TTL-compatible I/O interface directly to legacy 5 V microcontrollers without level shifters, simplifying PCB layout in harsh industrial environments. The SOP-32 surface-mount package provides mechanical robustness and standard 32-SOIC land patterns, enabling drop-in second sourcing. At 70 ns access time, the part serves as a fast intermediate buffer between the controller and slower peripheral interfaces such as opto-isolated I/O modules.

🖥️

Legacy Computing Module Replacement

The K6T1008C2E-GB70 is a standard replacement source for discontinued 128Kx8 SRAM sockets in legacy computing modules. Its JEDEC-standard 32-SOIC pinout is shared by analog semiconductor makers including Alliance Memory, ISSI, and Cypress/Infineon, making it the de facto industry-standard 128Kx8 asynchronous SRAM footprint. The 5 V supply and 70 ns access time match the bus timing of legacy x86 and 68k SBC designs. Recommended companion: a supply voltage supervisor and decoupling network per Samsung's typical application circuit.

💡

Point-of-Sale Terminal Memory

The K6T1008C2E-GB70 provides reliable working memory for point-of-sale terminals that require 5 V tolerance and moderate access times. Its asynchronous SRAM interface simplifies the memory controller design, eliminating the need for clock-aligned logic in cost-sensitive POS hardware. The 50 mA typical operating current is acceptable for line-powered terminals, and the SOP-32 footprint allows compact board layout. Recommended companion: a battery-backed RTC and EEPROM for transaction logging persistence.

🔧

Test & Measurement Instrument Buffer

The K6T1008C2E-GB70 serves as a high-speed capture buffer in test and measurement instruments such as oscilloscopes and logic analyzers. Its 70 ns access time is suitable for sampling buffers clocked at speeds up to approximately 14 MHz, and its fully static interface eliminates refresh-induced artifacts in captured waveforms. The 128 KB capacity supports deep pre-trigger capture in cost-sensitive benchtop instruments. Recommended companion: a 5 V-tolerant FPGA or microcontroller host with parallel bus interface.

Resumen de productos recomendados

K6T1008C2E-GB55 Same family, 55 ns speed bin Se usa en: Firmware Boot Memory, Point-of-Sale Terminal Memory CY7C109-30VC Faster 30 ns drop-in alternative Se usa en: Firmware Boot Memory, Industrial Controller Scratchpad Memory, Test & Measurement Instrument Buffer AS6C1008-70PCN Cross-brand long-term replacement Se usa en: Embedded Data Logging Buffer, Legacy Computing Module Replacement, Point-of-Sale Terminal Memory IS62C1024-70V Cross-brand 5 V SRAM alternative Se usa en: Embedded Data Logging Buffer, Legacy Computing Module Replacement K6T1008C2E-DB70 Same family, alternative package code Se usa en: Industrial Controller Scratchpad Memory, Test & Measurement Instrument Buffer
What is the memory capacity of K6T1008C2E-GB70?
The K6T1008C2E-GB70 is a 1 Mbit SRAM organized as 128K words by 8 bits. According to the Samsung datasheet summary, it provides 131,072 bytes of non-volatile-equivalent storage while power is applied. This organization matches the JEDEC-standard 128Kx8 asynchronous SRAM pinout, allowing it to be second-sourced across the industry.
What is the access time of K6T1008C2E-GB70?
The K6T1008C2E-GB70 has an access time (tAA) of 70 ns, as encoded in the -70 speed bin in the part number suffix. The K6T1008C2E family offers 55 ns and 70 ns speed options; the -GB70 variant selects the 70 ns grade. At 70 ns, the part is well matched to host buses of approximately 14 MHz or lower.
What supply voltage does the K6T1008C2E-GB70 require?
The K6T1008C2E-GB70 operates from a single 4.5 V to 5.5 V supply. According to the Samsung datasheet, the device uses CMOS inputs and outputs that are TTL-compatible at this supply range, enabling direct interface with 5 V microcontrollers and standard logic without level shifters.
Where can I buy K6T1008C2E-GB70?
The K6T1008C2E-GB70 can be sourced through distributors including LCSC (from $2.7034), Alibaba, IC-Components, Veswin Electronics, RH Electronics, and Utsource, as listed in the verified web data as of 2026-10-05. Since the part is marked obsolete by Samsung, stock is limited to remaining inventory and broker channels rather than franchise distributors.
What is the current price of K6T1008C2E-GB70?
As of 2026-10-05, the K6T1008C2E-GB70 is priced from $2.7034 at LCSC for small-quantity orders. Pricing is volatile because the part is obsolete and stock levels vary across brokers. Bulk pricing at 1000+ pieces can drop to the $1.50-$2.00 range, but minimum order quantities and lead times depend on remaining inventory.
Is the K6T1008C2E-GB70 obsolete or still in production?
The K6T1008C2E-GB70 is classified as obsolete. The part belongs to Samsung's legacy K6T asynchronous SRAM family, which has been superseded by higher-density and synchronous alternatives. Designers building new products should consider modern SRAMs or FRAM, while existing designs must source from remaining distributor stock.
What package does the K6T1008C2E-GB70 use?
The K6T1008C2E-GB70 uses a 32-pin Small Outline Package (SOP-32), as indicated by the -G package code and B (lead-free) suffix. The SOP-32 land pattern is JEDEC-standard and is shared with common 32-SOIC parts, simplifying PCB footprint reuse when migrating to compatible asynchronous SRAMs.
Does the K6T1008C2E-GB70 require refresh?
No. The K6T1008C2E-GB70 is a fully static SRAM, meaning it retains data as long as power is applied without any refresh cycles. This is a key advantage over DRAM in embedded designs where refresh controller logic is undesirable. According to the Samsung datasheet, the asynchronous interface uses standard Chip Enable (CE), Output Enable (OE), and Write Enable (WE) controls.
What is the difference between K6T1008C2E-GB70 and K6T1008C2E-GL70?
The K6T1008C2E-GB70 uses a 32-pin SOP package (G), while the K6T1008C2E-GL70 typically refers to a different package or speed grade within the same K6T1008C2E family. Both share the 128Kx8 organization and 70 ns access time. According to Samsung's part numbering, the second suffix letter often encodes package and temperature grade.
What is the best drop-in replacement for K6T1008C2E-GB70?
The best drop-in replacement for K6T1008C2E-GB70 is any JEDEC-standard 128Kx8 asynchronous SRAM in a 32-SOIC package, including the Alliance AS6C1008-70PCN, Cypress CY7C109-30VC, and ISSI IS62C1024-70V. These parts match the 128Kx8 organization, 70 ns access time, and SOP-32 footprint, allowing direct PCB substitution. Source: JEDEC SRAM cross-reference data.
Can I use a CY7C109 to replace the K6T1008C2E-GB70?
Yes. The Cypress CY7C109 (128Kx8 asynchronous SRAM) in the 32-SOIC package is a drop-in replacement for the K6T1008C2E-GB70. Both parts share the same pinout, organization, 5 V supply, and 70 ns access time range, enabling direct PCB substitution without firmware changes. Verify OE and CE polarities against the host schematic.
What are the key specifications of K6T1008C2E-GB70 that engineers should know?
The K6T1008C2E-GB70 is a 128Kx8 (1 Mbit) asynchronous CMOS SRAM with 70 ns access time, 4.5-5.5 V supply, 50 mA operating current, and 32-pin SOP package. According to the Samsung datasheet, it uses TTL-compatible I/O, fully static operation (no refresh), and three-state outputs. It belongs to Samsung's legacy K6T family, which has wide cross-brand second-source support.
Is there an Alliance Memory equivalent for K6T1008C2E-GB70?
Yes. The Alliance Memory AS6C1008-70PCN is a direct cross-brand equivalent for the K6T1008C2E-GB70. Both are 128Kx8 asynchronous SRAMs in 32-SOIC packages with 70 ns access time and 5 V supply. The AS6C1008 is widely stocked as a long-term replacement for obsolete Samsung and Cypress 128Kx8 SRAMs, making it the preferred drop-in choice.
Where can I download the K6T1008C2E-GB70 datasheet PDF?
The K6T1008C2E-GB70 datasheet PDF can be downloaded from alldatasheet.com (10 pages, ~190 KB), digchip.com, findic.us, adatasheet.com, and the datasheetbank.com archive. Because Samsung has marked the part obsolete, the official Samsung datasheet is no longer hosted on samsung.com/semiconductor; third-party datasheet sites are the primary source.
What are typical applications for K6T1008C2E-GB70?
The K6T1008C2E-GB70 is used for firmware boot memory, embedded data logging, industrial controllers, computing modules, and legacy system replacement. The 5 V TTL-compatible interface and standard SOP-32 footprint make it well suited for 8/16-bit microcontroller bus attachments. According to industry cross-reference data, it is most often specified in equipment where supply chain longevity of an asynchronous SRAM is critical.

Datos de referencia de ingeniería para K6T1008C2E-GB70 — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the K6T1008C2E-GB70 when you need a proven, JEDEC-standard 128Kx8 asynchronous SRAM in a 32-SOIC package for legacy 5 V microcontroller systems. It is ideal for firmware boot memory, embedded data logging, and industrial controllers where the host bus runs at 14 MHz or lower. For 30 ns performance upgrades, the CY7C109-30VC is a drop-in alternative. For long-term supply continuity, the Alliance Memory AS6C1008-70PCN is the preferred active replacement. The ISSI IS62C1024-70V offers an alternative second source with similar specs. For lower power, the K6T1008C2E-GB55 (55 ns grade) is interchangeable on the same PCB but does not reduce active current.

Comparación con alternativas

Parámetro Este producto K6T1008C2E-GB55 K6T1008C2E-DB70 AS6C1008-70PCN CY7C109-30VC IS62C1024-70V
Brand Samsung Electro-Mechanics Samsung Electro-Mechanics Samsung Electro-Mechanics Alliance Memory Infineon ISSI
Package SOP-32 SOP-32 (same) SOP-32 (same) SOP-32 (same) SOP-32 (same) SOP-32 (same)
Memory Organization 128K x 8 128K x 8 (same) 128K x 8 (same) 128K x 8 (same) 128K x 8 (same) 128K x 8 (same)
Access Time (tAA) 70 ns 55 ns 70 ns (same) 70 ns (same) 30 ns 70 ns (same)
Supply Voltage (VCC) 4.5 V to 5.5 V 4.5 V to 5.5 V (same) 4.5 V to 5.5 V (same) 4.5 V to 5.5 V (same) 4.5 V to 5.5 V (same) 4.5 V to 5.5 V (same)
Memory Type Async SRAM (CMOS) Async SRAM (same) Async SRAM (same) Async SRAM (same) Async SRAM (same) Async SRAM (same)
Lifecycle Status Obsolete Obsolete Obsolete Active Active (limited) Active

Diferenciadores clave

  • Industry-standard JEDEC 128Kx8 32-SOIC pinout (frente a AS6C1008-70PCN)
  • Lower operating current at 70 ns grade (frente a CY7C109-30VC)
  • Wide second-source ecosystem (frente a IS62C1024-70V)

Notas de diseño

Decouple VCC with a 0.1 µF ceramic capacitor placed within 5 mm of the device VCC pin (pin 28), per Samsung's typical application circuit. The K6T1008C2E-GB70 draws up to 50 mA during active read/write cycles; bulk decoupling (10 µF tantalum or aluminum polymer) is recommended at the PCB power entry. Use a star-ground topology to isolate SRAM ground return currents from noisy digital grounds.

Route address and data lines with matched trace lengths to minimize skew. The asynchronous SRAM interface is sensitive to address-to-data timing; keep address lines within 10 mm of the device to limit propagation delay. Place the SOP-32 part on the same signal layer as the host controller when possible, avoiding via stubs on address and data paths.

Do not exceed the absolute maximum VCC rating of 7.0 V, as the CMOS process is not 3.3 V tolerant. Verify CE, OE, and WE polarities against the host schematic before PCB bring-up; the K6T1008C2E-GB70 uses active-low controls. For battery-backed designs, ensure data retention voltage is specified; this part requires VCC ≥ 4.5 V to retain data reliably.

At 70 ns access time, address bus transitions must settle within the tAA specification. Keep capacitive loading on data lines below 50 pF by using a single buffer per bus when fanning out to multiple peripherals. Series termination (33 Ω) at the SRAM output is optional but can help reduce ringing on long PCB traces in noisy industrial environments.

Información de cumplimiento

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

Lead-free per -G package code and -B suffix. RoHS compliance inferred from Samsung K6T family datasheet declarations. REACH, halogen-free, and conflict minerals data not available in verified web data.

Datos verificados el: 2026-10-05 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

K6T1008C2E-GB70 K6T1008C2E-GB70 datasheet Samsung K6T1008C2E-GB70 128Kx8 SRAM 70ns 5V SOP-32 K6T1008C2E-GB70 equivalent K6T1008C2E-GB70 pinout K6T1008C2E-GB70 replacement K6T1008C2E-GB70 buy price where to buy K6T1008C2E-GB70 K6T1008C2E vs AS6C1008 asynchronous SRAM 128Kx8 obsolete Samsung K6T SRAM family

Componentes & términos relacionados

Samsung Electro-Mechanics Samsung Semiconductor K6T1008C2E-GB70 K6T1008C2E-GB55 K6T1008C2E-DB70 AS6C1008-70PCN Alliance Memory CY7C109-30VC Infineon IS62C1024-70V ISSI SRAM Static Random-Access Memory asynchronous SRAM CMOS memory volatile memory memory IC 6T cell JEDEC TTL-compatible SOP-32 32-SOIC Small Outline Package Chip Enable Output Enable Write Enable RoHS lead-free
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