MC7447AVS1333LB - PowerPC G4 MPU 1.333GHz | NXP / Freescale
N.º de pieza: MC7447AVS1333LB ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $245.42 | $245,42 |
| 10 | $235.4 | $2.354,00 |
| 44 | $319.92 | $14.076,48 |
| 100 | $215 | $21.500,00 |
| 500 | $198.5 | $99.250,00 |
| 1.000 | $185 | $185.000,00 |
MC7447AVS1333LB Descripción general
A PowerPC G4 microprocessor is a 32-bit RISC processor derived from the AIM (Apple-IBM-Motorola) PowerPC architecture, with AltiVec/VMX SIMD vector extensions added by Motorola/Freescale. The MPC74xx series extended the G4 line into embedded networking, aerospace, and single-board computer markets with higher thermal envelopes (0C to 105C ambient) and longer lifecycles than the Apple-targeted G4 parts. Within the system hierarchy, the MC7447AVS1333LB sits above companion northbridge/southbridge chipsets such as the MPC107/MPC107A and connects to system DDR memory, local PCI-X buses, and Ethernet MACs.
Key features include the 1.333 GHz clock rate, integrated L1/L2 caches (32 KB instruction / 32 KB data L1, 512 KB on-die L2), AltiVec vector unit, and a 64-bit DDR memory interface. The SOI process reduces active power versus bulk CMOS at equivalent frequencies. Thermal design is constrained by FCCLGA junction-to-ambient resistance that requires a heatsink in production deployments.
Typical applications include aerospace and defense embedded systems, industrial single-board computers, military/aerospace flight-control and mission-computing subsystems, telecom control plane processors, and legacy PowerPC SBC retrofits. The 25x25 mm FCCLGA footprint, 1.8 V/2.5 V supplies, and AltiVec extensions make it a fit where deterministic G4 codebases must be preserved.
When designing with this part, plan thermal management with a calibrated heatsink rated for the 1.333 GHz core; the FCCLGA package exposes the die through a flip-chip interface and requires precise PCB land pattern and socket choice for prototype debugging. Pair it with the MPC107 companion bridge for full address-translation and DDR memory support.
This page consolidates distributor pricing, same-package same-family drop-in alternatives (e.g., MC7447AHX1333LB, MC7448VS1400ND), design notes, and FAQ entries not aggregated on a single manufacturer or distributor page.
Alternativas directas para MC7447AVS1333LB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC7447AVS1333LB (mismo factor de forma y huella) — difiere en Process Technology, Mounting Type, RoHS Status, Series, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC7447AHX1333LB
✅ Sustitución directa✓ En stock
$54 / unidad
Ver hoja de datos →MC7448VS1400ND
✅ Sustitución directa✓ En stock
$650 / unidad
Ver hoja de datos →MC7447AVU1267LB
✅ Sustitución directa✓ En stock
$68.5 / unidad
Ver hoja de datos →MC7448THX1400ND
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7448HX1700LD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447AVS1333LB Valores máximos y características eléctricas
| Core Processor | PowerPC G4 |
| Series | MPC74xx |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Clock Speed | 1.333 GHz |
| Process Technology | 0.13 um CMOS with SOI |
| Encapsulado | 360-FCCLGA (25x25 mm) |
| Core Voltage | 1.8 V |
| I/O Voltage | 2.5 V |
| Temperatura de funcionamiento | 0C to 105C (TA) |
| Packaging | Tray |
| Tipo de montaje | Surface Mount |
| SIMD Extensions | AltiVec / VMX |
Guía de configuración de pines de MC7447AVS1333LB 360-fcclga (25x25 mm)
Configuración de pines para MC7447AVS1333LB (encapsulado 360-fcclga (25x25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC7447AVS1333LB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC7447AVS1333LB es adecuado para 6 aplicacións: Aerospace Flight Control SBCs, Defense Mission Computing, Industrial Single-Board Computers, Telecom Control Plane Processors, Legacy PowerPC G4 Software Retrofit, Test and Measurement Embedded Controllers.
Aerospace Flight Control SBCs
The MC7447AVS1333LB's 1.333 GHz PowerPC G4 core with AltiVec SIMD extensions fits aerospace single-board computers that run deterministic flight-control and mission-computing software. The 32-bit RISC architecture matches legacy certified codebases, while the 360-FCCLGA package and 0-105C operating range meet DO-160 environmental envelopes. SOI process technology reduces active power dissipation relative to bulk CMOS, easing thermal design for line-replaceable units in avionics bays. Compared to a modern multi-core ARM SoC, the MC7447AVS1333LB trades lower GHz per dollar for predictable single-thread latency and a multi-decade support window on the MPC74xx platform.
Recomendado
Defense Mission Computing
Military mission computers demand long-lifecycle processors traceable through decades of program support; the MC7447AVS1333LB qualifies here because the MPC74xx family has industrial/aerospace supply continuity via NXP (formerly Freescale). The 1.333 GHz core, integrated L2 cache, and 64-bit DDR memory interface deliver the throughput required for sensor-fusion, radar preprocessing, and cryptographic workloads. Operating temperature from 0C to 105C supports ground-vehicle and shipboard deployments, while the 360-FCCLGA (25x25 mm) footprint supports ruggedized VPX and VME boards.
Recomendado
Industrial Single-Board Computers
Industrial SBCs leverage the MC7447AVS1333LB for deterministic control software where PowerPC ecosystems (e.g., VxWorks, LynxOS) are already certified. The 1.333 GHz clock, 32-bit data path, and AltiVec SIMD instructions handle PLC bridge, motion control, and protocol-conversion workloads; the 360-FCCLGA package's heatsink-ready top side simplifies integration on conduction-cooled ATR chassis. Compared to lower-power ARM Cortex-A parts, the MC7447AVS1333LB offers more software compatibility with legacy PowerPC field installations.
Recomendado
Telecom Control Plane Processors
Telecom control-plane elements (SS7 signaling, media gateways, base-station controllers) historically used PowerPC G4 parts and the MC7447AVS1333LB is a drop-in upgrade for those slots. The 1.8 V core / 2.5 V I/O dual-rail supply integrates with existing MPC107 chipset designs, while the AltiVec unit accelerates packet-classification and DSP-like voice processing. The MPC74xx family's long-term NXP support makes it suitable for carrier-grade equipment that must remain in service for 10-20 years.
Recomendado
Legacy PowerPC G4 Software Retrofit
Engineers maintaining installed bases of PowerPC G4 systems use the MC7447AVS1333LB as a replacement processor when original parts fail. The 360-FCCLGA (25x25 mm) footprint matches existing sockets in legacy SBC designs, and the same MPC74xx instruction set preserves binary compatibility with deployed firmware. SOI process support delivers lower thermal output than bulk-CMOS predecessors of the same frequency. Rochester Electronics and similar aftermarket distributors specialize in extending the supply of such obsolete NXP/Freescale parts.
Recomendado
Test and Measurement Embedded Controllers
Test instruments and bench-top ATE systems often embed a PowerPC G4 host for instrument control, DSP preprocessing, and Ethernet/USB bridging. The MC7447AVS1333LB's 1.333 GHz throughput and integrated peripherals accelerate waveform processing while the 360-FCCLGA package fits compact controller modules behind instrument front panels. Compared to a discrete MCU + FPGA architecture, the MC7447AVS1333LB consolidates control and signal preprocessing on a single proven RISC core.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC7447AVS1333LB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC7447AHX1333LB | MC7448VS1400ND | MC7447AVU1267LB | MC7448THX1400ND | MC7448HX1700LD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) - same | 360-FCCLGA (25x25 mm) - same | 360-FCCLGA (25x25 mm) - same | 360-FCCLGA (25x25 mm) - same | 360-FCCLGA (25x25 mm) - same |
| Clock Speed | 1.333 GHz | 1.333 GHz | 1.4 GHz | 1.267 GHz | 1.4 GHz | 1.7 GHz |
| Core | PowerPC G4 (MPC7447A) | PowerPC G4 (MPC7447A) | PowerPC G4 (MPC7448) | PowerPC G4 (MPC7447A) | PowerPC G4 (MPC7448) | PowerPC G4 (MPC7448) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process | 0.13 um CMOS SOI | 0.13 um CMOS | 0.13 um CMOS SOI | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Operating Temperature | 0C to 105C (TA) | 0C to 105C (TA) | 0C to 105C (TA) | 0C to 105C (TA) | 0C to 105C (TA) | 0C to 105C (TA) |
| Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
Diferenciadores clave
- SOI low-power process bin (frente a MC7447AHX1333LB)
- 1.333 GHz mid-bin speed (frente a MC7447AVU1267LB)
- Drop-in pin-compatible within MPC7447A family (frente a MC7448VS1400ND)
Notas de diseño
Estimated: at 1.333 GHz core clock on the 0.13um SOI process, expect active core power on the order of 10-15 W depending on workload and voltage trim. The 360-FCCLGA (25x25 mm) package exposes the die directly; a calibrated heatsink with thermal interface material is required to keep junction temperature within the 0C to 105C operating range, and conduction-cooled chassis are recommended for ruggedized deployments. Validate Tjc against the heatsink-included thermal characterization from NXP/MPC74xx family documentation, not a generic package value.
The 360-FCCLGA (25x25 mm) flip-chip land grid array requires a precise PCB land pattern matched to the NXP MPC7447A reference design. Trace the DDR memory bus to the companion MPC107 bridge as matched-length differential pairs and avoid stubs; place decoupling capacitors immediately adjacent to each power pin per the family reference schematic. Production boards should use the exact socket family specified by NXP for prototype and field-replacement compatibility.
Do not substitute a similar-looking 360-ball FCBGA part (e.g., non-MPC74xx G4) without re-validating pinout, ball map, and BIOS/firmware expectations; some variants use FCCLGA while others use FCCBGA ceramic with different thermal characteristics. The 'AVS' suffix in MC7447AVS1333LB specifically denotes the SOI low-power bin - swapping it for an AHX-suffix non-SOI part changes power and thermal behavior. Designers with long-lifecycle programs should verify date codes and plan for end-of-life supply via authorized aftermarket distributors.
Información de cumplimiento
RoHS, REACH, lead-free, halogen-free, and conflict-minerals compliance status are not stated in the scraped distributor pages or LCSC datasheet reference; values are marked unknown. AEC-Q100 is not applicable (this is a non-automotive PowerPC MPU targeted at aerospace/industrial/embedded use).
