NXP Semiconductors

MC9S08GT16AMFDE - 8-bit S08 MCU, 16KB Flash, 40MHz, QFN-48 | NXP

부품 번호: MC9S08GT16AMFDE ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.8 V to 3.6 V Vdss 48-VFQFN Exposed Pad (7x7 mm), HVQCCN Package 40 MHz Speed 16 KB (16K x 8) Memory
문의하기 가격 문의
MOQ: 1 |
가격 업데이트: 2026-10-18
볼륨 가격
수량 단가 합계
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1,000 $0 $0.00
ℹ️ 모든 가격은 USD 기준입니다

MC9S08GT16AMFDE 개요

The NXP Semiconductors MC9S08GT16AMFDE is an 8-bit S08 (HCS08) general-purpose microcontroller IC running at up to 40 MHz with 16 KB (16K x 8) of Flash program memory and 2 KB of RAM, housed in a 48-pin VFQFN exposed-pad (7x7 mm) package.

An 8-bit microcontroller is an integrated circuit that contains a processor core, memory, and peripherals on a single chip, executing one byte of data per instruction cycle. Within the power-management and embedded-control hierarchy, the MC9S08GT16A belongs to the MC9S08GT family of cost-effective, high-performance S08 general-purpose MCUs from NXP (formerly Freescale Semiconductor), positioned above smaller 8K devices and below larger 32K/60K family members.

Key features include the 40 MHz HCS08 CPU with HC08 instruction set compatibility plus an added BGND instruction, support for up to 32 interrupt/reset sources, software-selectable pullups on ports when used as inputs, and a wide 1.8V to 3.6V single-supply operating range. The 16 KB Flash supports in-application reprogramming, and the 48-QFN-EP package with exposed pad provides good thermal and grounding performance in a compact 7x7 mm footprint.

Architecturally, the S08 core is an enhanced derivative of the HC08 core, offering backward code compatibility while improving interrupt handling and adding debug instructions. The device integrates Flash, RAM, and standard S08 peripheral modules on a single die, reducing system BOM count for cost-sensitive embedded designs. The automotive temperature grade (per Partstack package data: HVQCCN square no-lead package) extends use into harsher environments.

Typical applications include automotive body electronics and accessories, industrial control panels, consumer appliance control, low-cost motor control, and system monitoring where an 8-bit MCU with modest Flash (16 KB) is sufficient.

When designing with this device, plan the supply network for the 1.8V to 3.6V range and verify Flash density against code growth, since 16 KB is fixed per orderable part number. The exposed pad should be soldered to a ground pour for best electrical and thermal performance.

This page synthesizes distributor stock data, cross-reference comparisons, drop-in alternatives, and practical design guidance not found in any single datasheet or distributor listing.

드롭인 대체품: MC9S08GT16AMFDE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08GT16AMFDE (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Processor, Temperature Grade, RAM Size, Maximum Clock Frequency.

NXP Semiconductors
Package: 48-QFN-EP (7x7 mm)
Core Processor: S08
비교 대상: MC9S08GT16AMFDE →
NXP Semiconductors
Package: 44-LQFP / 44-QFP (10x10 mm)
RAM Size: 2 KB (2K x 8)
비교 대상: MC9S08GT16AMFDE →
NXP Semiconductors
Package: 32-HVQFN (5x5 mm), No-Lead
Core Processor: S08 (HCS08)
Temperature Grade: Automotive
비교 대상: MC9S08GT16AMFDE →
NXP Semiconductors
Package: 44-QFP (10x10 mm)
Core Processor: S08 (HCS08) 8-bit CISC
비교 대상: MC9S08GT16AMFDE →
NXP Semiconductors
Package: 48-QFN exposed-pad, 7 x 7 mm
Temperature Grade: Industrial
Maximum Clock Frequency: 20 MHz
비교 대상: MC9S08GT16AMFDE →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S08GT16ACFDE

✅ 드롭인
NXP Semiconductors
📦 QFN-48 (7x7 mm)
S08 · 8-Bit · 40 MHz · 16 KB (16K x 8) · 2 KB · 48-QFN-EP (7x7 mm) · Surface Mount · 48

✓ 재고 있음

$9.3 / 개

데이터시트 보기 →

MC9S08GT16ACFDER

✅ 드롭인
📦 QFN-48 (7x7 mm)
FindIC lists as QFN-48 40 MHz 48-pin functional equivalent with consistent characteristics; R suffix denotes tape-and-reel shipping option

📋 참조 대체품 (카탈로그에 없음)

MC9S08GT16CFBE

✅ 드롭인 ⚠️ 사양 미검증
NXP Semiconductors
📦 [DATA_NEEDED: package]
S08 (HCS08) 8-bit CISC · 8-Bit · 40 MHz · 16 KB (16K x 8) · 2 KB · None (Flash-based) · 2.5 V / 3.3 V · 10-bit (8 channels)

✓ 재고 있음

$4.65 / 개

데이터시트 보기 →

MC9S08GT16AMFDE 최대 정격 & 전기적 특성

Core Processor S08 (HCS08) 8-bit
Core Size 8-bit
최대 클록 주파수 40 MHz
Flash Memory 16 KB (16K x 8)
RAM Size 2 KB
Supply Voltage Range 1.8 V to 3.6 V
I/O Ports 34
Interrupt/Reset Sources Up to 32
Instruction Set HC08-compatible with added BGND instruction
Pullups Software selectable on ports when used as inputs
패키지 48-VFQFN Exposed Pad (7x7 mm), HVQCCN
실장 유형 Surface Mount
Terminal Form No Lead
Temperature Grade Automotive (per distributor package data)
수명 주기 상태 Active

MC9S08GT16AMFDE 48-vfqfn exposed pad (7x7 mm), hvqccn 핀 구성 가이드

MC9S08GT16AMFDE(48-vfqfn exposed pad (7x7 mm), hvqccn 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MC9S08GT16AMFDE의 48-vfqfn exposed pad (7x7 mm), hvqccn 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MC9S08GT16AMFDE.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MC9S08GT16AMFDE 적합 용도: 6 애플리케이션s: Automotive Body Electronics, Industrial Control Panels, Home Appliance Control, Low-Cost Motor Control, System Monitoring and Telemetry, Legacy HC08/S08 System Continuity.

🚗

Automotive Body Electronics

The MC9S08GT16AMFDE fits automotive body-control functions such as door modules, seat controllers, lighting switches, and mirror control because distributor package data classifies it with an automotive temperature grade, and its 34 software-pullup I/O lines directly interface switches, relays, and lamp drivers without external pull resistors. In a typical design the MCU runs from a regulated 3.3V or 5V-derived supply within its 1.8V to 3.6V range (use a pre-regulator for 5V rails), monitors switch inputs via the internal pullups, and drives loads through high-side drivers or relays. The 40 MHz S08 core delivers enough headroom for LIN-style polling loops and diagnostic routines, while 16 KB Flash stores application code plus calibration data. The 48-QFN-EP exposed pad gives a low-impedance ground that helps EMC performance, which is critical in the electrically noisy automotive environment.

🏭

Industrial Control Panels

In industrial control panels, the MC9S08GT16AMFDE serves as a low-cost logic controller for sequence control, interlock monitoring, and operator interface scanning. Its 40 MHz HCS08 core executes HC08-compatible code, letting teams reuse proven HC08 firmware, and the added BGND instruction supports background debugging during commissioning. The 1.8V to 3.6V supply range allows operation directly from a 3.3V rail, while 34 I/O with software-selectable pullups handle pushbuttons, limit switches, and relay-driving outputs with minimal external parts. The 16 KB Flash supports in-system reprogramming for field updates of control logic, and up to 32 interrupt/reset sources allow responsive handling of safety interlocks. The 7x7 mm 48-QFN-EP package with exposed ground pad aids thermal dissipation and noise immunity inside enclosures containing contactors and switching power supplies.

⚡

Home Appliance Control

Appliance control boards for washers, dishwashers, fans, and small cooking appliances benefit from the MC9S08GT16AMFDE's combination of adequate Flash (16 KB) and generous I/O (34 lines) at an economical 8-bit price point. The MCU scans a membrane keypad using internal pullups, drives LEDs and buzzer outputs, and sequences motor relays or triac drivers according to cycle state machines stored in Flash. The 40 MHz internal clock supports timing-critical zero-cross detection for triac phase control. Because the 48-QFN-EP package is leadless (HVQCCN, 7x7 mm), it assembles reliably on standard reflow lines and its exposed pad anchors ground for noisy motor-switching environments. The 1.8V to 3.6V operating range allows a simple shunt or linear pre-regulator from the appliance's 5V standby rail, keeping the power bill of materials minimal.

🔧

Low-Cost Motor Control

For fan, pump, and small BLDC or brushed-DC motor applications, the MC9S08GT16AMFDE provides the timing resources of the 40 MHz S08 bus to generate PWM outputs and execute commutation or speed-loop software. The 34 I/O include timer-capable pins for PWM generation and hall-sensor or tachometer input capture; up to 32 interrupt/reset sources ensure fast response to commutation events. Firmware fits comfortably in 16 KB Flash with room for protection routines such as overcurrent and stall detection. The 2 KB RAM supports modest control-loop variables and filtering buffers. Operating from 1.8V to 3.6V, the MCU interfaces directly with gate-driver ICs level-shifted to the motor rail. The exposed-pad QFN-48 package dissipates controller heat into the PCB ground plane, which matters inside sealed motor housings with limited airflow.

🖥️

System Monitoring and Telemetry

The MC9S08GT16AMFDE is well suited to board-level monitoring tasks such as temperature, voltage, and door/enclosure status polling, then reporting over a simple serial link. The S08 core at 40 MHz handles sensor polling schedules and checksummed message framing with ease, while 16 KB Flash retains configuration tables and event logs across power cycles. Software-selectable pullups on the 34 input-capable I/O lines simplify interfacing to open-collector alarm outputs. Its 1.8V to 3.6V supply window matches 3.3V sensor rails directly, avoiding level shifters. In automotive and industrial variants, the automotive temperature grade noted in distributor data extends deployment into harsher cabinets. The 7x7 mm no-lead footprint lets a full monitor node fit on the host board's spare area rather than a separate module, trimming system cost.

🧩

Legacy HC08/S08 System Continuity

A major practical application of the MC9S08GT16AMFDE is sustaining mature products originally built around HC08 or early S08 devices. Because the HCS08 core executes the HC08 instruction set with added BGND, existing assembly and C code ports with minimal change, protecting years of validated firmware investment. The GT16A sits in the middle of the MC9S08GT family that NXP explicitly extended downward from higher-end parts, so migration paths to GT32/GT60 exist if code grows. With the base part sourced through Rochester Electronics and DigiKey Marketplace legacy channels, manufacturers can keep shipping to fleets of installed systems while the 48-QFN-EP footprint preserves existing PCB layouts. This makes the device a continuity anchor for long-lifecycle industrial, appliance, and automotive accessory platforms still in production support.

What is the MC9S08GT16AMFDE microcontroller?
The MC9S08GT16AMFDE is an NXP (formerly Freescale) 8-bit S08 microcontroller IC with a 40 MHz HCS08 core, 16 KB Flash, and 2 KB RAM, packaged in a 48-pin VFQFN with exposed pad (7x7 mm). It operates from a 1.8V to 3.6V supply, offers 34 I/O, and supports up to 32 interrupt/reset sources. According to distributor listings and the manufacturer family overview, it belongs to the cost-effective MC9S08GT general-purpose family.
Where can I buy MC9S08GT16AMFDE and is it in stock?
The MC9S08GT16AMFDE can be purchased from distributors including DigiKey (which lists the NXP USA Inc. part with same-day shipping availability) and through Rochester Electronics on the DigiKey Marketplace for legacy Freescale-sourced stock. Heisener reported 10,416 pieces in stock with immediate shipment. Availability changes daily, so confirm real-time stock and pricing with each distributor before ordering, as this part is sourced by multiple channels including authorized and independent distributors.
What is the price of MC9S08GT16AMFDE?
Verified unit pricing for the MC9S08GT16AMFDE was not published in the retrieved distributor data as of 2026-10-18; several channels, including Heisener, operate on a request-for-quote model for this part. Because it is an automotive-grade, no-lead QFN-48 device with active lifecycle status, pricing typically depends on quantity and stock channel. Contact distributors such as DigiKey, Mouser, or Heisener directly for a current quotation before committing to a bill of materials.
What is the difference between MC9S08GT16AMFDE and MC9S08GT16ACFDE?
The MC9S08GT16AMFDE and MC9S08GT16ACFDE share the same S08 core, 40 MHz clock, 16 KB Flash, and 2 KB RAM. The key difference is the package: MF denotes the 48-pin VFQFN exposed pad (7x7 mm), while CF denotes a larger QFP package. According to FindIC, the functional characteristics are consistent with some main parameters matching, so the choice depends on your PCB land pattern and I/O pin count requirements rather than on core performance.
MC9S08GT16AMFDE vs MC9S08GT8ACFDE - which should I choose?
Choose the MC9S08GT16AMFDE when your firmware requires 16 KB of Flash; choose the MC9S08GT8ACFDE when 8 KB is sufficient and board space or cost must be minimized. Both use the same 40 MHz S08 core and belong to the MC9S08GT16A/GT8A family extension described by NXP. Note the package differs (MF = 48-QFN-EP, CF = QFP), so they are not footprint-compatible and swapping requires PCB redesign rather than a drop-in replacement.
When should I choose the MC9S08GT16AMFDE over larger GT-family parts?
Choose the MC9S08GT16AMFDE when your application fits within 16 KB of Flash and 2 KB of RAM, and you want the compact 7x7 mm 48-QFN-EP footprint with 34 I/O. It suits cost-sensitive automotive body electronics, appliance control, and industrial monitoring. If your code base is expected to grow beyond 16 KB or requires more peripherals, step up to GT32 or larger family members instead; the GT16A occupies the middle of the family's memory range.
Can the MC9S08GT16AMFDE be used in automotive applications?
Yes. Distributor package data (Partstack) classifies the MC9S08GT16AMFDE with an automotive temperature grade, and the MC9S08GT family is positioned by NXP for cost-effective, high-performance general-purpose use including automotive body electronics. It operates from 1.8V to 3.6V, so design a regulated supply within that window. Always verify the specific temperature range and qualification level for your vehicle program directly against the official NXP datasheet before design release.
What is the best drop-in replacement for MC9S08GT16AMFDE?
The closest drop-in replacement is the MC9S08GT16ACFDER, listed by FindIC as a QFN-48, 40 MHz, 48-pin NXP 8-bit MCU with functionally consistent characteristics, followed by the MC9S08GT16ACFDE. Verify footprint identity against the official NXP mechanical drawing before substitution, as some sources describe the CF suffix as a QFP variant. Beyond these family members, no true pin-to-pin drop-in alternatives from other manufacturers were found in the retrieved cross-reference data.
What can replace MC9S08GT16AMFDE if it becomes unavailable?
Replacement options are primarily within the NXP MC9S08GT16A family itself: MC9S08GT16ACFDE and MC9S08GT16ACFDER (both listed in cross-reference data as QFN-48 functional equivalents). Legacy-stock channels such as Rochester Electronics also supply the original part, mitigating obsolescence risk. For long-term continuity, NXP's cross-reference tool can suggest compatible parts, but any non-family replacement requires footprint and firmware verification since no cross-brand pin-compatible equivalent appeared in the retrieved data.
What is the best cross-brand equivalent for MC9S08GT16AMFDE?
No verified cross-brand pin-to-pin equivalent was found in the retrieved cross-reference data as of 2026-10-18. Parametrically similar 8-bit MCUs exist from other vendors, but none were documented as same-package, pin-compatible substitutes for the 48-QFN-EP S08 device. This is typical for NXP S08 parts, whose pin maps are proprietary. Rather than risking a non-verified substitution, source the original through legacy distributors like Rochester Electronics or migrate within the NXP family with a PCB respin.
What are the key specifications of MC9S08GT16AMFDE engineers should know?
Key specifications: 8-bit S08 (HCS08) core at 40 MHz with HC08-compatible instruction set plus BGND; 16 KB (16K x 8) Flash; 2 KB RAM; 1.8V to 3.6V single supply; 34 I/O lines with software-selectable input pullups; up to 32 interrupt/reset sources; 48-VFQFN exposed-pad package (7x7 mm, HVQCCN, no-lead); active lifecycle status per DigChip lifecycle data. These parameters define its role as a mid-density, cost-effective member of the MC9S08GT general-purpose MCU family.
Where can I download the MC9S08GT16AMFDE datasheet PDF?
The MC9S08GT16AMFDE datasheet PDF is available through the official NXP Semiconductors product page (nxp.com), which hosts the MC9S08GT family data sheet covering the GT16A series including package mechanical drawings for the 48-VFQFN exposed pad. Distributor sites such as DigiKey, Hotenda, and Heisener also link to the datasheet download. Always download from NXP directly to ensure you have the latest revision, since family documents are periodically updated for errata and package data.
How many I/O pins does the MC9S08GT16AMFDE have?
The MC9S08GT16AMFDE provides 34 general-purpose I/O, according to the DigChip specification summary. This I/O count is delivered on the 48-pin VFQFN exposed-pad package, with the remaining pins allocated to power, ground, and reset functions. Port pins feature software-selectable pullups when configured as inputs, which reduces external component count in button and switch interfaces. For exact port-to-pin mapping, consult the pinout chapter of the official NXP MC9S08GT family datasheet.
Is the MC9S08GT16AMFDE end-of-life?
No. The MC9S08GT16AMFDE has an active lifecycle stage according to DigChip lifecycle data, and DigiKey lists it as an orderable NXP part with shipping availability. However, related NXP orderables can differ: for example, the MC9S08GT16ACFDE variant page indicates end-of-life status on nxp.com, with Rochester Electronics and other legacy channels covering residual demand. Always confirm lifecycle on the exact full orderable part number, since suffix changes (temperature, package, shipping) can carry different lifecycle states.
What design considerations apply to the 48-QFN exposed pad of the MC9S08GT16AMFDE?
The exposed pad on the 48-QFN-EP (7x7 mm) should be soldered to a grounded PCB thermal pad with an array of vias to the ground plane, ensuring low-impedance ground return and improved heat dissipation. Because the package is no-lead (HVQCCN), inspection is limited to perimeter pins, so design the stencil with adequate paste coverage on both the pads and the exposed pad. Confirm the exact land-pattern dimensions against the NXP mechanical drawing before PCB fabrication.

엔지니어링 참조 데이터: MC9S08GT16AMFDE — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MC9S08GT16AMFDE when you need an active-lifecycle, automotive-grade 8-bit MCU with 16 KB Flash and 2 KB RAM in the compact 48-QFN-EP (7x7 mm) footprint, especially for automotive body electronics, appliance control, or sustaining an existing HC08/S08 code base. Choose MC9S08GT8ACFDE only if 8 KB Flash suffices and cost must be minimized, accepting a different package. The MC9S08GT16ACFDE/ACFDER variants offer the same core and memory and are cross-referenced as functional equivalents, but note that NXP lists ACFDE as end-of-life and some sources conflict on its package, so verify the mechanical drawing before any substitution. For long production runs, dual-source via Rochester Electronics legacy stock. If your firmware will exceed 16 KB or needs CAN, move to MC9S08DZ or S12 family parts instead.

대체품과의 비교

파라미터 이 제품 MC9S08GT16ACFDE MC9S08GT16ACFDER MC9S08GT8ACFDE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core / Clock S08, 40 MHz S08, 40 MHz S08, 40 MHz S08, 40 MHz
Flash Memory 16 KB 16 KB 16 KB 8 KB
Supply Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V

주요 차별점

  • 16 KB Flash with active lifecycle status (vs MC9S08GT8ACFDE)
  • Compact 7x7 mm no-lead footprint (vs MC9S08GT16ACFDE)
  • HC08 code compatibility (vs MC9S08GT16ACFDER)

설계 노트

Solder the 48-QFN-EP exposed pad to a dedicated ground pad on the PCB with an array of 5x5 or similar via pattern connecting to the ground plane. This provides the low-impedance ground return required for EMC performance and the primary thermal path for the die. Follow the land pattern in the NXP mechanical drawing exactly - no-lead packages tolerate little rework, so verify stencil aperture design (typically 50-70% coverage on the exposed pad) before first production run.

The device operates from a 1.8V to 3.6V single supply. In systems with a 5V rail (common in automotive and appliance designs), add a 3.3V LDO pre-regulator and decouple the MCU VDD pins with 100 nF ceramic capacitors placed within a few millimeters of each supply pin, plus bulk 4.7-10 uF at the regulator. Do not feed 5V directly to any I/O pin; the absolute maximum ratings are defined in the NXP datasheet and exceed the operating range only marginally.

Verify lifecycle and footprint before committing to substitutions: the MC9S08GT16ACFDE variant is listed by NXP as end-of-life while the MFDE orderable remains active, and cross-reference sources describe CF-suffix parts as QFN-48 while NXP nomenclature often assigns CF to QFP packages. Always confirm the package from the official NXP mechanical drawing for the exact full orderable number, and qualify legacy-stock sources (Rochester Electronics) for date-code and authenticity requirements.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Compliance data was not included in the retrieved web data. The device carries an automotive temperature grade per distributor package data, but formal AEC-Q100 qualification status is not stated in the provided sources - confirm on the official NXP product page.

데이터 검증일: 2026-10-18 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

NXP Semiconductors Freescale Semiconductor MC9S08GT16AMFDE MC9S08GT16ACFDE MC9S08GT16ACFDER MC9S08GT8ACFDE MC9S08GT16A S08 HCS08 core 8-bit microcontroller MCU HC08 instruction set BGND instruction 48-VFQFN Exposed Pad QFN-48 HVQCCN Flash memory Rochester Electronics DigiKey Mouser automotive temperature grade surface mount system monitoring industrial control appliance control
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