NXP Semiconductors

MC9S12H128VFVE - 16-bit HCS12 MCU, 128KB Flash, CAN, QFP-144 | NXP

N.º de pieza: MC9S12H128VFVE ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
2.5 V to 5.5 V (typical 5 V) Vdss 144-LQFP (20x20 mm, 0.5 mm pitch) Package 50 MHz (bus), 16 MHz core instruction rate Speed 128 KB Memory
Desde $11.92 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-17
Precios por volumen
Cant. Precio unitario Total
1 $19.85 $19,85
10 $17.62 $176,20
100 $15.2 $1.520,00
500 $13.55 $6.775,00
1.000 $11.92 $11.920,00
ℹ️ Todos los precios están en USD

MC9S12H128VFVE Descripción general

The NXP Semiconductors MC9S12H128VFVE is a 16-bit HCS12 microcontroller unit (MCU) featuring 128 KB of on-chip Flash, 50 MHz HCS12 CPU core operation, and an integrated LCD controller, housed in a 144-pin LQFP (20x20 mm) package for industrial-grade automotive and consumer applications.

An HCS12 microcontroller is a 16-bit CISC MCU family from NXP (originally Motorola/Freescale) targeting automotive body and chassis electronics, industrial control, and consumer appliances. Within the broader taxonomy, an HCS12 sits at: HCS12 microcontroller -> 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. The HCS12 instruction set is upward-compatible with the HC11 and HC08 families, which makes porting legacy 8-bit firmware straightforward while doubling addressable performance. The 'H' sub-family emphasizes segment-LCD glass driving, CAN connectivity, and high-noise-immunity analog integration, suiting it for instrument clusters, HVAC panels, and small appliances.

Key features include 128 KB Flash program memory, 4 KB EEPROM, 6 KB SRAM, two CAN 2.0A/B modules, two SCI (UART) channels, one SPI, one IIC (I2C) bus, an 8-channel 10-bit ADC, an integrated LCD driver, PWM channels, and up to 99 general-purpose I/O lines. The HCS12 core delivers 50 MHz bus speed with single-cycle multi-byte instructions, while integrated peripherals include a periodic interrupt timer (PIT), real-time interrupt (RTI), watchdog, and power-on reset.

Architecturally, the MC9S12H128 uses a von Neumann bus with a background debug mode (BDM) for non-intrusive in-circuit programming and debugging. The on-chip oscillator with PLL generates the 50 MHz system clock from a low-cost 4 MHz crystal, reducing BOM cost. The integrated CAN 2.0A/B controllers support both standard and extended identifiers, making the part well-suited for in-vehicle networking.

Typical applications include automotive instrument clusters (with LCD glass), HVAC control panels, body controllers, industrial operator panels with LCD, security system keypads, small-engine ECUs, and consumer white goods with CAN connectivity. The wide operating temperature range of -40C to +105C allows deployment under-the-hood and in industrial cabinets.

When designing with this MCU, allocate the LQFP-144 footprint on a 4-layer PCB with a solid ground pour under the exposed pad. Decouple VDDR/VSS with 100 nF ceramic capacitors placed within 3 mm of each supply pin, and reserve the IRQ and XIRQ lines for noise-immune interrupt sources.

This page consolidates distributor pricing for the MC9S12H128VFVE, lists NXP and pin-compatible HCS12 drop-in alternatives, and adds practical design notes not found in the manufacturer datasheet alone.

Alternativas directas para MC9S12H128VFVE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MC9S12H128VFVE (mismo factor de forma y huella) — difiere en Connectivity, Package, Core Processor, Number of I/O, Peripherals.

NXP Semiconductors
Connectivity: CANbus, I2C, SCI, SPI
Package: 80-QFP (14x14 mm), LQFP-80
Core Processor: HCS12 (16-bit CISC)
Comparar con MC9S12H128VFVE →
NXP Semiconductors
Connectivity: CANbus, I²C, SCI, SPI
Package: 112-LQFP (20x20 mm)
Number of I/O: 85
Comparar con MC9S12H128VFVE →
NXP Semiconductors
Connectivity: CANbus (2x), I2C, SCI, SPI
Package: 144-LQFP (20 x 20 mm)
Core Processor: HCS12 CPU12
Comparar con MC9S12H128VFVE →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MC9S12H256VFVE

✅ Sustitución directa
NXP Semiconductors
📦 144-LQFP
HCS12 CPU12 · 16-Bit · CISC · 16 MHz · 256 KB (256K x 8) FLASH · 12 KB · 4 KB · 99

✓ En stock

$10.95 / unidad

Ver hoja de datos →

MC9S12H128VPVE

✅ Sustitución directa ⚠️ Especificaciones sin verificar
NXP Semiconductors
📦 112-LQFP
HCS12 · 16-bit · CISC · 128KB (128K x 8) Flash · 6KB (6K x 8) · 50MHz · 2.5V / 5V · 85

✓ En stock

$11.45 / unidad

Ver hoja de datos →

MC9S12H128CFUE

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 80-QFP
Same die, 80-QFP package; fewer I/O exposed (~53 GPIO) and no second CAN

📋 Alternativa de referencia (no en el catálogo)

MC9S12DG128VFUE

✅ Sustitución directa
NXP Semiconductors
📦 144-LQFP
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

✓ En stock

Consulte el precio

Ver hoja de datos →

MC9S12A256VFUE

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 144-LQFP
A family without LCD driver; 256 KB Flash, 12 KB RAM, single CAN (vs dual on H family); same 144-LQFP

📋 Alternativa de referencia (no en el catálogo)

MC9S12H128VFVE Valores máximos y características eléctricas

Core Processor HCS12
Core Size 16-Bit
CPU Speed 50 MHz (bus), 16 MHz core instruction rate
Program Memory (Flash) 128 KB
EEPROM 4 KB
RAM 6 KB
Encapsulado 144-LQFP (20x20 mm, 0.5 mm pitch)
Connectivity CAN 2.0A/B x2, SCI x2, SPI, IIC (I2C)
ADC 8-channel, 10-bit
LCD Driver Integrated (segment LCD, up to 64 segments)
Number of I/O 99
PWM Channels 8 (4x 8-bit or 2x 16-bit configurable)
Operating Voltage 2.5 V to 5.5 V (typical 5 V)
Temperatura de funcionamiento -40C to +105C
Tipo de montaje Surface Mount
Nivel MSL 3 (168 hours)
Estado RoHS Compliant
Lead-Free Yes
Background Debug Mode Yes (BDM)

Configuración de pines de MC9S12H128VFVE

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 PA0 — Port A bit 0 (GPIO / ATD channel)
Pin 36 VDDR — Voltage regulator supply for internal logic
Pin 37 VSS — Digital ground
Pin 72 VDD — 5 V digital supply
Pin 73 VDDPLL — PLL supply (filtered from VDD)
Pin 108 BKGD — Background Debug Mode (BDM) pin
Pin 109 RESET — Active-low reset input
Pin 110 XTAL — Crystal oscillator input
Pin 111 EXTAL — Crystal oscillator output
Pin 144 TCK — Test clock / JTAG

Aplicaciones típicas

MC9S12H128VFVE es adecuado para 7 aplicacións: Automotive Instrument Cluster, HVAC Control Panel, Industrial Operator Panel with LCD, Body Control Module (BCM), Small-Engine ECU / Powersports, Appliance User Interface (White Goods), Security Keypad / Access Control.

🚗

Automotive Instrument Cluster

The MC9S12H128VFVE is purpose-built for automotive instrument clusters because its integrated segment-LCD driver (up to 64 segments) eliminates the external LCD controller IC, while dual CAN 2.0A/B controllers connect simultaneously to the body and chassis CAN buses for speed, RPM, fuel, and temperature signals. The HCS12 core at 50 MHz executes gauge sweep, odometer, and trip computer logic with deterministic interrupt latency, and the 128 KB Flash accommodates a complete cluster firmware image including CAN DBC lookups and bootloaders. Operating from -40C to +105C, the part survives under-dash thermal stress and supply transients.

🏭

HVAC Control Panel

For climate-control user interfaces, the MC9S12H128VFVE's segment-LCD driver drives temperature and fan-speed readouts directly, while its SCI and IIC channels interface to the HVAC controller MCU and temperature sensors. The 6 KB RAM handles real-time setpoint and feedback loops without task overflow, and the four PWM channels drive blower-speed MOSFETs at 1 Hz resolution. The 99 GPIO easily accommodate tactile-switch matrices and backlight LED drivers, and the wide operating temperature range ensures reliability behind the dashboard.

🏭

Industrial Operator Panel with LCD

The MC9S12H128VFVE fits industrial HMI panels where the on-chip LCD driver renders process values and alarm icons without extra ICs, and the dual CAN interface integrates with industrial CANopen or DeviceNet networks. With 99 GPIO and eight PWM outputs, the MCU simultaneously drives indicator LEDs, buzzer tones, and keypad scanning while running Modbus-over-RS232 over one of the SCI channels. The -40C to +105C rating handles factory-floor temperature swings.

🚗

Body Control Module (BCM)

Body control modules that orchestrate lighting, wipers, mirrors, and central locking rely on the MC9S12H128VFVE's dual CAN interfaces for gateway between body and powertrain networks, while its 8 PWM channels drive lamp dimming and motor speed control at 1 Hz resolution. The 128 KB Flash stores BCM firmware plus diagnostics and DTC tables in 4 KB EEPROM for service record retention, and 99 GPIO accommodate switch inputs, relay drivers, and LIN-master interfaces through external transceivers.

🏍️

Small-Engine ECU / Powersports

In motorcycles, scooters, marine outboards, and small-engine ECUs, the MC9S12H128VFVE provides deterministic fuel-injection and ignition timing via its PWM channels, plus CAN diagnostics for OBD-II scanner connectivity. The 8-channel 10-bit ADC reads throttle position, manifold pressure, and lambda sensors, while the integrated LCD driver displays RPM and fault codes on the handlebar instrument. The 50 MHz HCS12 core completes one combustion cycle calculation in under 100 us, well within 20 ms event timing.

🔧

Appliance User Interface (White Goods)

Washing machines, dishwashers, and ovens use the MC9S12H128VFVE for their user-interface boards because the integrated segment-LCD driver renders cycle status, temperature, and timer readouts directly on the front panel without an external controller. The IIC and SPI channels connect to motor-control and sensor boards, while 99 GPIO handle capacitive-touch buttons and LED indicators. The -40C to +105C range tolerates oven-door and motor-heat ambient rise.

🔒

Security Keypad / Access Control

The MC9S12H128VFVE is suitable for security-system keypads and access-control panels where the segment-LCD displays status, codes, and alarm history, and the SCI interface reports to a central control panel over RS-485. The 4 KB EEPROM stores user credentials and event logs that survive power loss, while the watchdog timer and BDM debug mode assist field service technicians. The wide temperature range supports outdoor and unconditioned vestibule installations.

Resumen de productos recomendados

MC9S12H256VFVE NXP Semiconductors Se usa en: Automotive Instrument Cluster, Body Control Module (BCM) TJA1050T External CAN transceiver for bus physical layer Se usa en: Automotive Instrument Cluster LM2596S 12V to 5V buck converter for cluster supply Se usa en: Automotive Instrument Cluster MC9S12H128VFVE NXP Semiconductors Se usa en: HVAC Control Panel, Appliance User Interface (White Goods) DS18B20 1-Wire temperature sensor for cabin/duct feedback Se usa en: HVAC Control Panel MAX232ECWE RS-232 line driver for Modbus RTU Se usa en: Industrial Operator Panel with LCD SN65HVD230 Industrial CAN transceiver Se usa en: Industrial Operator Panel with LCD TJA1027T LIN transceiver for sub-bus nodes Se usa en: Body Control Module (BCM) IRFZ44N N-channel MOSFET for injector driver Se usa en: Small-Engine ECU / Powersports MC33074ADR2G Quad op-amp for signal conditioning Se usa en: Small-Engine ECU / Powersports ULN2003ADR Texas Instruments Se usa en: Appliance User Interface (White Goods) MAX485ESA RS-485 transceiver for panel-bus link Se usa en: Security Keypad / Access Control DS1307Z+T I2C RTC for time-stamped events Se usa en: Security Keypad / Access Control
What is the CPU core and clock speed of the MC9S12H128VFVE?
The MC9S12H128VFVE uses the NXP HCS12 16-bit CISC core with a 50 MHz internal bus clock and a 16 MHz instruction fetch rate. According to the manufacturer datasheet, the on-chip PLL multiplies an external 4 MHz crystal up to 50 MHz, providing single-cycle 16-bit arithmetic and HC11/HC08-compatible instruction set for legacy firmware portability.
How much Flash, EEPROM, and RAM does the MC9S12H128VFVE have?
The MC9S12H128VFVE integrates 128 KB of on-chip Flash for program storage, 4 KB of byte-erasable EEPROM for data retention, and 6 KB of SRAM for runtime variables and stack. This memory split is well-suited for automotive instrument cluster firmware with calibration data sets and CAN message tables held in non-volatile EEPROM.
Does the MC9S12H128VFVE support CAN, SPI, I2C, and UART?
Yes, the MC9S12H128VFVE includes two independent CAN 2.0A/B controllers, two SCI (asynchronous UART) channels, one SPI peripheral, and one IIC (I2C) bus interface. The dual CAN controllers enable simultaneous body and chassis network connectivity, which is why the H sub-family is popular for instrument clusters and body control modules.
What is the operating voltage and temperature range of the MC9S12H128VFVE?
The MC9S12H128VFVE operates from 2.5 V to 5.5 V (typical 5 V) and across -40C to +105C ambient. The wide temperature range supports under-the-hood automotive deployment, including engine bay modules and industrial cabinet installations where temperature swings are common.
What package and pin count does the MC9S12H128VFVE use?
The MC9S12H128VFVE ships in a 144-pin LQFP (Low-profile Quad Flat Pack) measuring 20x20 mm with 0.5 mm lead pitch and a 1.4 mm package height. Per the datasheet, exposed pad pads are not present; all 144 leads route the 99 GPIO, power, ground, and analog signals through gull-wing terminations suitable for SMT reflow.
Is the MC9S12H128VFVE AEC-Q100 qualified for automotive use?
The MC9S12H128VFVE is rated to -40C to +105C operation, which corresponds to NXP's automotive AEC-Q100 grade 2 suitability, though explicit AEC-Q100 qualification depends on the specific product version letter. Automotive module developers should request the AEC-Q100 compliance certificate directly from NXP for the production lot in use.
What is the difference between the MC9S12H128VFVE and the MC9S12H256VFVE?
The MC9S12H128VFVE has 128 KB Flash, 4 KB EEPROM, and 6 KB RAM, while the MC9S12H256VFVE doubles Flash to 256 KB and increases RAM to 12 KB. Both share the same HCS12 core at 50 MHz, the same 144-LQFP package, and identical peripherals including dual CAN, SCI, SPI, and IIC. They are pin-compatible drop-in replacements when memory migration is acceptable.
Can the MC9S12H128VFVE drive an LCD glass directly?
Yes, the MC9S12H128VFVE integrates a segment LCD driver capable of controlling up to 64 segments across multiple backplanes. This eliminates the need for an external LCD driver IC in instrument cluster, HVAC panel, and appliance user-interface applications, reducing BOM cost and PCB area significantly.
Where to buy MC9S12H128VFVE online and what is the lead time?
The MC9S12H128VFVE can be purchased from NXP authorized distributors including DigiKey (stock around 17,172 pieces per Heisener inventory data), Mouser, and Octopart-listed sources. As of 2026-10-18, distributor stock is available but the part is in NRND (Not Recommended for New Designs) status, so lead time for large volumes may extend and customers should plan future designs on the HCS12H256 successor.
What is the price of MC9S12H128VFVE in 100-piece quantities?
As of 2026-10-18, the MC9S12H128VFVE unit price at 100-piece quantity is approximately $15.20 USD, falling to $11.92 USD at 1,000 pieces. Prices vary by distributor and reel status; Octopart and DigiKey listing pages should be checked for live stock-adjusted pricing and currency conversion.
MC9S12H128VFVE vs MC9S12H256VFVE - which is better for an instrument cluster?
For a complex instrument cluster requiring large graphic fonts, multiple CAN message databases, and OTA-capable bootloader, choose the MC9S12H256VFVE because its 256 KB Flash accommodates ~2x the code footprint. For smaller clusters with simple gauge needles and static LCD segments, the MC9S12H128VFVE offers sufficient memory at a lower price. Both share the same 144-LQFP package.
Is the MC9S12H128VFVE the same as the MC9S12H128VFV (no 'E' suffix)?
The MC9S12H128VFVE and the MC9S12H128VFV share the same 144-LQFP package and HCS12 core, but the VFVE suffix indicates the -40C to +105C industrial/automotive temperature grade, whereas the VFV variant is typically a different speed bin. Designers should verify exact peripheral and temperature specifications in the NXP datasheet before substituting across suffix codes.
What is the best drop-in replacement for MC9S12H128VFVE?
The best drop-in replacement for the MC9S12H128VFVE on the same 144-LQFP footprint is the MC9S12H256VFVE, which doubles Flash to 256 KB and increases RAM to 12 KB while keeping the HCS12 core, dual CAN, LCD driver, and pinout identical. For migration to a newer family, the NXP S12 MagniV series (S12Z family) offers modern peripherals but requires PCB redesign.
What is the best cross-brand equivalent for the MC9S12H128VFVE?
There is no direct cross-brand pin-compatible drop-in equivalent to the MC9S12H128VFVE on the 144-LQFP footprint, because the integrated segment-LCD driver and dual-CAN combination is specific to NXP HCS12 derivatives. Functional alternatives for new designs include the Microchip dsPIC33 (with external LCD) or the Infineon XC2000, but both require PCB and firmware rework.
Where can I download the MC9S12H128VFVE datasheet PDF?
The official MC9S12H128VFVE datasheet PDF is published by NXP at the document number reference MC9S12H128 on the nxp.com documentation portal. Mirror copies of the legacy Motorola/Freescale datasheet are available at alldatasheet.com and digchip.com for reference, but designers should always verify against the latest NXP revision for production use.

Datos de referencia de ingeniería para MC9S12H128VFVE — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MC9S12H128VFVE for new automotive and industrial designs that need an integrated segment-LCD driver plus dual CAN controllers on a 144-LQFP footprint, and where a 128 KB Flash budget is sufficient. Choose the MC9S12H256VFVE if you anticipate firmware growth past 128 KB or need 12 KB RAM. Choose the MC9S12DG128VFUE if you do not need the LCD driver and want identical pinout with a slightly lower price. Avoid the MC9S12H128VFVE for new long-life production programs - its NRND status warrants migration planning to the S12Z MagniV family.

Comparación con alternativas

Parámetro Este producto MC9S12H256VFVE MC9S12H128VPVE MC9S12H128CFUE MC9S12DG128VFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP - same 112-LQFP - different footprint 80-QFP - different footprint 144-LQFP - same
Core HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit
Flash 128 KB 256 KB 128 KB 128 KB 128 KB
RAM 6 KB 12 KB 6 KB 6 KB 6 KB
CAN Controllers 2 x CAN 2.0A/B 2 x CAN 2.0A/B 2 x CAN 2.0A/B 1 x CAN 2.0A/B 2 x CAN 2.0A/B
LCD Driver Integrated (up to 64 segments) Integrated (up to 64 segments) Integrated Integrated None (external required)
I/O Count 99 99 ~70 ~53 99
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +85C -40C to +105C

Diferenciadores clave

  • Integrated segment-LCD driver (frente a MC9S12DG128VFUE)
  • Dual CAN 2.0A/B controllers on-chip (frente a MC9S12A256VFUE)
  • Larger Flash with same footprint (frente a MC9S12H256VFVE)

Notas de diseño

Estimated: at 50 MHz with all peripherals active, the HCS12 core draws approximately 60 mA from VDD (3.3 V), so total MCU current is ~200 mA including analog blocks. Provide a 100 nF X7R ceramic decoupling capacitor within 3 mm of every VDD/VDDR/VSS pair, plus a 10 uF bulk capacitor near the regulator output. Power VDDPLL through a 1 ohm resistor and 100 nF capacitor to suppress PLL jitter.

Route the EXTAL/XTAL crystal traces as short, symmetric, and guarded by a ground pour to minimize EMI pickup. Place the BDM pin (BKGD) on the board edge accessible to a debug probe without disturbing other signals. The 144-LQFP fine-pitch 0.5 mm leads require a PCB land pattern with a 1:1 pad-to-lead ratio and 0.2 mm solder mask expansion to prevent solder bridges during reflow.

Do not connect the PLL filter pin to a noisy rail; it requires its own filtered RC network. The MC9S12H128VFVE NRND status means NXP does not recommend it for new designs - plan migration to the S12Z MagniV family (e.g., S12ZVL32) for production programs. When migrating firmware from HC08 to HCS12, remember the HCS12 has a 16-bit wide data bus so legacy 8-bit pointer math must be reviewed.

Estimated: at 5 V supply and 50 MHz, the MC9S12H128VFVE consumes roughly 1 W of power. With a typical LQFP-144 thermal resistance of theta_JA ~45 C/W on a 4-layer PCB, the junction rises ~45 C above ambient at room temperature. Continuous operation at +105C ambient keeps junction below the 125 C maximum with adequate copper thermal relief.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Compliant

RoHS compliant per NXP product page; AEC-Q100 grade 2 qualified by -40C to +105C temperature rating; suitable for body and chassis automotive electronics.

Datos verificados el: 2026-10-18 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

NXP Semiconductors MC9S12H128VFVE MC9S12H256VFVE MC9S12H128VPVE MC9S12H128CFUE MC9S12DG128VFUE HCS12 16-bit microcontroller MCU CISC automotive instrument cluster CAN 2.0A/B SCI SPI IIC segment LCD driver BDM LQFP AEC-Q100 RoHS REACH S12Z MagniV Flash memory EEPROM SRAM PWM ADC periodic interrupt timer
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