MCF5274LVM166 - 166MHz ColdFire V2 MPU | NXP | Industrial
N.º de pieza: MCF5274LVM166 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $43.9968 | $44,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MCF5274LVM166 Descripción general
A microprocessor is a programmable control component that executes instructions, manages system resources, and coordinates peripherals. The ColdFire architecture belongs to the 32-bit RISC microprocessor hierarchy, while MCF5274LVM166 integrates the processor, memory interfaces, I/O, and communication-oriented peripherals into one system-on-chip solution. Its 166 MHz operating speed supports embedded control workloads without requiring a separate external memory array for the stated 64K x 8 RAM configuration.
The principal verified characteristics are a 166 MHz core frequency, 32-bit processing, 64K x 8 RAM, 61 I/O, ROMless operation, and a 196-LBGA package. The ROMless architecture allows firmware and boot code to reside in external nonvolatile memory, providing flexibility for application-specific code storage and field updates. The 196-LBGA package is intended for high-density PCB layouts where fine-pitch interconnect and multilayer construction are practical.
The ColdFire V2 processor is positioned for embedded networking, industrial control, communications, data buffering, and file-management equipment. Its integrated peripheral selection can reduce the need for separate interface controllers in systems where the selected peripheral functions match the design requirements. Designers must still validate pin multiplexing, memory topology, voltage limits, clocking, and signal integrity against the complete hardware specification before layout release.
The verified source data identifies the device as an NRND NXP product, so new production designs should confirm lifecycle availability and migration options before committing. The MCF5272VM66J from the Site MPN list may be relevant for family-level evaluation, but it is not included as a drop-in alternative because its package and exact pin compatibility are not verified by the supplied data. The 196-LBGA footprint also requires careful escape-routing, via-in-pad policy, thermal management, and assembly-process qualification.
MCF5274LVM166 is best treated as a legacy embedded-control platform rather than a generic substitute target. Its 166 MHz ColdFire V2 performance, 64K x 8 RAM, external-memory architecture, and 196-LBGA integration are the main decision points. This page synthesizes the verified manufacturer and distributor listings, lifecycle status, package information, practical implementation guidance, and explicitly identifies missing technical data instead of inventing specifications.
Alternativas directas para MCF5274LVM166 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCF5274LVM166 (mismo factor de forma y huella) — difiere en Core Architecture, Program Memory, USB, Mounting Type, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCF5274LCVM166
✅ Sustitución directa✓ En stock
$16.2 / unidad
Ver hoja de datos →MCF5272VM66J
✅ Sustitución directa✓ En stock
$18.2 / unidad
Ver hoja de datos →MCF5271CVM100
✅ Sustitución directa✓ En stock
$17.6 / unidad
Ver hoja de datos →MCF52277CVM160
✅ Sustitución directa✓ En stock
$8.04 / unidad
Ver hoja de datos →MCF5373LCVM240
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCF5274LVM166 Valores máximos y características eléctricas
| Product Type | 32-bit ColdFire V2 integrated microprocessor |
| Processor Speed | 166 MHz |
| Processor Architecture | ColdFire V2 |
| Program Memory | ROMless |
| RAM Size | 64K x 8 |
| I/O Count | 61 I/O |
| Encapsulado | 196-LBGA, 15 x 15 mm |
| Terminal Type | Ball |
| Number of Terminals | 196 |
| Tipo de montaje | Surface mount |
| Oscillator Type | External |
| Temperatura de funcionamiento | 0C to +70C |
| Temperature Grade | Commercial |
| Supply Classification | NRND |
| Core Type | 32-bit RISC processor |
| Application Class | Cost-sensitive, power-conscious embedded processing |
Guía de configuración de pines de MCF5274LVM166 196-lbga, 15 x 15 mm
Configuración de pines para MCF5274LVM166 (encapsulado 196-lbga, 15 x 15 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCF5274LVM166.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCF5274LVM166 es adecuado para 6 aplicacións: Industrial Control, Connectivity Gateway, Data Buffering System, File Management Appliance, Embedded Communications Equipment, User Interface Controller.
Industrial Control
MCF5274LVM166 fits cost-sensitive embedded control equipment that needs a 32-bit processor, 166 MHz performance, 64K x 8 RAM, and 61 I/O while remaining ROMless for external firmware storage. The ColdFire V2 processor can coordinate control loops, communications, and data movement without relying on a separate general-purpose host processor. Its listed 0C to +70C commercial range must be checked against the enclosure temperature, and the 196-LBGA footprint requires a multilayer PCB with controlled escape routing and validated assembly capability.
Recomendado
Connectivity Gateway
The MCF5274LVM166 is suitable for an embedded connectivity gateway when the design benefits from 166 MHz ColdFire V2 processing and a high number of I/O connections. The ROMless architecture allows firmware to be stored in external nonvolatile memory, while the processor manages protocol handling, buffering, and peripheral coordination. Before selecting it, verify the actual Ethernet, serial, USB, or other interface requirements because the supplied data does not enumerate those peripherals, and confirm the external clock and memory interface against the NXP hardware specification.
Recomendado
Data Buffering System
For a data-buffering system, MCF5274LVM166 provides 32-bit processing at 166 MHz and identifies 64K x 8 RAM, allowing embedded firmware to manage incoming and outgoing data in a controlled processor environment. The external oscillator and ROMless architecture make the device suitable for systems where code storage and clocking are managed outside the package. Actual throughput depends on external memory, bus timing, DMA behavior, and peripheral configuration, none of which are fully specified in the supplied snippets.
Recomendado
File Management Appliance
MCF5274LVM166 can support file-management-oriented embedded appliances because its ColdFire V2 processor provides 32-bit control processing at 166 MHz and the device is positioned for connectivity, buffering, and file-management workloads. ROMless operation allows the firmware image and configuration data to be placed in external memory, but designers must establish the exact memory map, bus timing, boot method, and nonvolatile storage strategy. The 196-LBGA package also demands careful power delivery, thermal design, and PCB assembly planning.
Recomendado
Embedded Communications Equipment
The MCF5274LVM166 is applicable to embedded communications equipment where 61 I/O, 32-bit processing, and a 166 MHz ColdFire V2 core are useful for coordinating data acquisition, buffering, and control functions. Its ROMless configuration permits application firmware to be updated in external nonvolatile memory, which can simplify field maintenance. The supplied data does not verify individual communications peripherals or electrical interface levels, so the designer must confirm pin multiplexing, signal termination, isolation, and protocol timing in the manufacturer documentation.
Recomendado
User Interface Controller
MCF5274LVM166 can serve as the control processor in an embedded user-interface system when the application benefits from 32-bit instruction handling, 166 MHz performance, and external memory flexibility. The processor can coordinate display updates, input handling, local storage, and communication tasks, subject to the exact peripheral resources and memory interface in the hardware specification. Because the package uses 196 ball terminals, the PCB should be reviewed for high-density routing, assembly yield, thermal spreading, and connector accessibility before release.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCF5274LVM166 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCF5274LCVM166 | MCF5272VM66J | MCF5271CVM100 | MCF52277CVM160 | MCF5373LCVM240 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (15 x 15 mm) | 196-LBGA (15 x 15 mm) - package compatibility unconfirmed | 196-LBGA (15 x 15 mm) - package compatibility unconfirmed | 196-LBGA (15 x 15 mm) - package compatibility unconfirmed | 196-LBGA (15 x 15 mm) - package compatibility unconfirmed | 196-LBGA (15 x 15 mm) - package compatibility unconfirmed |
| Architecture | ColdFire V2 | ColdFire family | ColdFire family | ColdFire family | ColdFire family | ColdFire family |
Diferenciadores clave
- Higher verified nominal processor speed than the MCF5271CVM100 candidate (frente a MCF5271CVM100)
- Higher verified nominal speed than the MCF5272VM66J candidate (frente a MCF5272VM66J)
- Closer nominal speed to the MCF52277CVM160 candidate than higher-speed alternatives (frente a MCF52277CVM160)
- Explicit 64K x 8 RAM and 61 I/O specification in the verified listing (frente a MCF5373LCVM240)
Notas de diseño
The verified package is a 196-LBGA measuring 15 x 15 mm. Before schematic capture, obtain the official land pattern and ball map, then reserve escape routing for power, ground, external oscillator, reset, and memory signals. Keep sensitive clock and high-speed routes short and controlled, use a multilayer stack-up with continuous ground references, and validate the design against the manufacturer's package drawing because the supplied data does not include pad dimensions or routing rules.
MCF5274LVM166 is ROMless and uses an external oscillator according to the verified specifications. Do not assume that boot code or firmware is embedded in the processor. Confirm the external memory type, address map, bus timing, voltage levels, clock source, reset behavior, and required pull components in the hardware specification. A substitute also must preserve these interfaces; a similar processor speed alone does not establish drop-in compatibility.
The supplied data lists a 0C to +70C commercial temperature range but does not provide power dissipation, thermal resistance, or maximum junction temperature. Use the manufacturer's electrical limits and the final PCB thermal model before production. Estimated: without verified power and thermal-resistance data, a numerical junction-temperature estimate would be speculative, so do not use an assumed value for heatsinking or copper-area decisions.
External oscillator and memory connections can make clock, reset, and bus routing sensitive to impedance, return-path discontinuities, and crosstalk. Route clocks away from high-current switching nodes, provide local decoupling according to the manufacturer reference design, and keep the power and ground distribution network continuous beneath the BGA. Validate signal integrity with the actual memory device, stack-up, loading, and firmware timing rather than relying only on nominal processor frequency.
The product is listed as NRND. Do not treat a distributor's available stock as proof that the device is suitable for a new long-life design. Confirm NXP lifecycle status, date code, authorized sourcing, and a migration strategy before committing a new product. For an existing design, preserve the original firmware configuration, external-memory requirements, and 196-LBGA assembly constraints when sourcing replacements.
Información de cumplimiento
The supplied data identifies a commercial 0C to +70C part and an NRND lifecycle status, but it does not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. AEC-Q100 is marked not_applicable because the product is identified as commercial rather than automotive-qualified in the supplied data.
