MCIMX251AJM4A - i.MX25 400MHz ARM9 Automotive MPU | NXP
N.º de pieza: MCIMX251AJM4A ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $34.58 | $34,58 |
| 10 | $31.12 | $311,20 |
| 100 | $27.66 | $2.766,00 |
| 500 | $24.21 | $12.105,00 |
| 1.000 | $22.48 | $22.480,00 |
MCIMX251AJM4A Descripción general
An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU core, memory interfaces, peripheral controllers, and accelerator blocks into a single device targeting embedded product designs. APs sit at the top of the embedded hierarchy below the SoC level, combining the function of a microprocessor (MPU) with rich peripheral integration. The i.MX25 family is part of NXP's automotive-qualified Arm9 line, providing lower power consumption than Arm11/Cortex-A parts while still delivering sufficient performance for entry-level automotive HMI, telematics, and industrial HMI applications.
Key features include the ARM926EJ-S core with 16 KB instruction cache and 16 KB data cache, a maximum CPU clock of 400 MHz, an operating voltage range tied to 1.2V silicon, automotive temperature grade, and a 12-bit successive-approximation ADC. The integrated LCD controller supports STN/TFT panels and the Image Processing Unit (IPU) handles image scaling and color-space conversion. The two on-chip USB PHYs enable dual-USB designs without external transceiver ICs.
Typical applications include automotive infotainment entry-level head units, telematics control units (TCUs), instrument clusters, body controllers, industrial HMI panels, and point-of-sale terminals. The combination of LCD controller, touch-screen ADC, Ethernet, and USB provides a single-chip platform for these cost-optimized designs.
When designing with the MCIMX251AJM4A, ensure the PCB land pattern is the 400-ball MAP-BGA at 0.8 mm pitch, and verify DDR2 memory compatibility against the i.MX25 hardware reference manual. The automotive-grade silicon requires run-in-test and PCN awareness for long-lifecycle programs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MCIMX251AJM4A — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX251AJM4A (mismo factor de forma y huella) — difiere en LCD Controller, Data Cache, Instruction Cache, Mounting Type, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX251AJM4
✅ Sustitución directa✓ En stock
$19.95 / unidad
Ver hoja de datos →MCIMX257DJM4A
✅ Sustitución directa✓ En stock
$16.54 / unidad
Ver hoja de datos →MCIMX253DJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX251CJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX255DJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX251AJM4A Valores máximos y características eléctricas
| Core Architecture | ARM926EJ-S |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum CPU Clock | 400 MHz |
| Silicon Version | 1.2 |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Tensión de alimentación de funcionamiento | -0.5 V to +1.52 V (core rail, see datasheet) |
| Maximum Operating Temperature | +85 C |
| Encapsulado | 400-ball MAP-BGA, 17x17 mm, 0.8 mm pitch |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Automotive Grade | Yes (AEC-Q100 qualified, automotive temperature) |
| Integrated USB PHYs | 2 |
| On-chip ADC | 12-bit |
| Ethernet | 10/100 with RMII |
| Memory Interface | DDR2, LPDDR, MMC/SD/SDIO |
| LCD Controller | Yes (STN/TFT) |
| Estado RoHS | Compliant (per NXP product page) |
Guía de configuración de pines de MCIMX251AJM4A 400-ball map-bga, 17x17 mm, 0.8 mm pitch
Configuración de pines para MCIMX251AJM4A (encapsulado 400-ball map-bga, 17x17 mm, 0.8 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX251AJM4A.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX251AJM4A es adecuado para 6 aplicacións: Automotive Infotainment Entry-Level Head Unit, Telematics Control Unit (TCU), Industrial HMI Panel, Body Control Module (BCM), Point-of-Sale (POS) Terminal, Portable Data Logger.
Automotive Infotainment Entry-Level Head Unit
The MCIMX251AJM4A fits automotive infotainment entry-level head units because its ARM926EJ-S core at 400 MHz and integrated peripherals deliver enough throughput for basic audio, radio, and Bluetooth hands-free while keeping BOM cost low. The integrated LCD controller directly drives STN/TFT panels used in monochrome or low-resolution color displays, eliminating the need for an external graphics controller. With two on-chip USB PHYs, the design can support USB media playback plus USB debug simultaneously, and the 10/100 Ethernet with RMII enables connected-car telematics overlays. AEC-Q100 qualification ensures reliable operation under the -40C to +85C automotive temperature range and vehicle EMI stress.
Recomendado
Telematics Control Unit (TCU)
The MCIMX251AJM4A suits telematics control units because its 400 MHz Arm9 core runs TCP/IP stacks and cellular-modem management code with low power consumption. The 10/100 Ethernet with RMII interface provides a deterministic backhaul link to gateway ECUs, while the two USB PHYs support cellular modem and Wi-Fi/Bluetooth module attachments. The 12-bit ADC reads battery voltage and ignition state directly, removing the need for external monitoring ICs. AEC-Q100 and +85C automotive temperature qualification meet TCU deployment requirements in cabin and under-hood environments.
Recomendado
Industrial HMI Panel
The MCIMX251AJM4A is a strong fit for industrial HMI panels because the integrated LCD controller supports STN/TFT panels up to VGA-class resolution, and the 12-bit ADC digitizes 4-wire resistive touch screens without an external touch controller. The 400 MHz ARM926EJ-S core handles LVGL or embedded Qt graphical stacks at 30+ fps for machine status UIs. Two USB ports allow simultaneous Wi-Fi/Bluetooth dongle and USB stick data logging, while the MMC/SD/SDIO interface supports firmware update media in the field. Although qualified to automotive standards, the temperature range and reliability profile also suit factory-floor HMIs.
Recomendado
Body Control Module (BCM)
The MCIMX251AJM4A serves body control modules because its rich GPIO, CAN, LIN, and Ethernet mix consolidates multiple domain functions into one MPU. The 400 MHz core runs AUTOSAR-compatible RTOS instances for body, lighting, and door-zone controllers, while the ADC channels read switch inputs and the PWM timers drive LED loads. Two USB PHYs provide service-diagnostic ports alongside the in-vehicle network. Automotive qualification and long-life NXP silicon supply make this part suitable for BCM designs spanning 10+ year production runs.
Recomendado
Point-of-Sale (POS) Terminal
The MCIMX251AJM4A is well matched to point-of-sale terminals because the ARM926EJ-S core at 400 MHz runs embedded Linux with payment stacks, the LCD controller drives the operator TFT, and the 12-bit ADC reads the resistive touch overlay. The two USB PHYs accept a magnetic-stripe reader and a receipt printer simultaneously, and the 10/100 Ethernet enables back-office connectivity. The on-chip SRAM reduces external memory cost, helping hit aggressive POS BOM targets in retail deployments.
Recomendado
Portable Data Logger
The MCIMX251AJM4A fits portable data loggers because its ARM9 architecture consumes lower power than Cortex-A equivalents at idle, extending battery life in field-deployed loggers. The 12-bit ADC and MMC/SD/SDIO interface allow direct sensor reading and removable storage without glue logic. The USB PHY supports charging and data offload through a single port. Automotive-grade silicon tolerance to temperature and vibration also benefits industrial logging applications in harsh environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX251AJM4A — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX251AJM4 | MCIMX257DJM4A | MCIMX253DJM4A | MCIMX251CJM4A | MCIMX255DJM4A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAP-BGA-400 (17x17 mm) | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum CPU Clock | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Silicon Version | 1.2 | Pre-1.2 | 1.2 | 1.2 | 1.2 | 1.2 |
| Automotive Grade | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | No (commercial) | Yes (AEC-Q100) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | 0C to +70C | -40C to +85C |
| Peripheral Highlight | Dual USB + LCD + Ethernet | Dual USB + LCD + Ethernet | Adds security extensions | Lower peripheral mix | Same as A, commercial temp | Enhanced graphics accelerator |
Diferenciadores clave
- Silicon version 1.2 with latest errata fixes (frente a MCIMX251AJM4)
- Higher peripheral integration than i.MX253 (frente a MCIMX253DJM4A)
- Automotive AEC-Q100 temperature grade vs commercial (frente a MCIMX251CJM4A)
Notas de diseño
Use a 400-ball MAP-BGA land pattern at 0.8 mm pitch with at least 6 layers to route DDR2 cleanly. Match trace lengths for DDR2 byte lanes per the i.MX25 hardware design guide (IMX25HDG) and provide a continuous ground reference plane under the BGA. Decouple every VDD core ball with a 100 nF X7R placed within 2 mm of the ball, and bulk-decouple the 1.38V rail with at least 22 uF total ceramic + 47 uF tantalum. The BGA thermal pad requires stitching vias to inner ground planes for heat dissipation at 400 MHz operation.
Estimated: at 400 MHz full CPU load with both USB PHYs active and DDR2 traffic, the silicon power dissipation is approximately 1.2 W (core) plus 0.4 W (I/O), totaling ~1.6 W. With theta_JA in the range of 18-22 C/W for the MAP-BGA-400 on a 6-layer JEDEC board, junction-to-ambient rise is approximately 30-35 C above ambient. At +85 C automotive ambient this gives ~120 C junction - within automotive limits, but a bottom-side thermal pad with stitched vias is required to stay within Tj_max. Add a heat spreader for continuous full-CPU workloads.
Do not confuse silicon version 1.2 (MCIMX251AJM4A) with the pre-1.2 revision (MCIMX251AJM4): boot mode handling and errata differ. Do not exceed the absolute maximum core voltage of 1.52V listed in the verified web data - automotive 12V transients on the input rail require a pre-regulator and TVS clamp. Always strap the boot mode pins through 10 kohm pull resistors to known states; floating BOOT pins cause unpredictable boot behavior on the first power-on.
Información de cumplimiento
RoHS compliance per NXP product page; AEC-Q100 qualified per automotive product line. Halogen-free status not stated in verified data - marked unknown.
