MCIMX257DJM4A - i.MX25 ARM9 400MHz 400-LFBGA MPU | NXP
N.º de pieza: MCIMX257DJM4A ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.85 | $1.985,00 |
| 500 | $18.2 | $9.100,00 |
| 1.000 | $16.54 | $16.540,00 |
MCIMX257DJM4A Descripción general
A microprocessor (MPU) is an integrated circuit that contains the CPU, memory control, and peripheral interfaces on a single silicon die, serving as the central processing unit of an embedded system. Within the broader taxonomy, the MCIMX257DJM4A is an ARM9-based applications processor, a sub-class of microprocessors specialized for low-power multimedia and human-machine interface (HMI) workloads in industrial and consumer products. It sits within the i.MX family hierarchy: i.MX25 -> i.MX application processors -> microprocessors -> integrated circuits.
Key specifications include an ARM926EJ-S core with 16 KB instruction cache and 16 KB data cache, a 400 MHz maximum clock rate, integrated 10/100 Ethernet MAC, two USB 2.0 PHYs (HS OTG + HS Host), three 12-bit ADCs, a touchscreen controller, and an LCD controller supporting resolutions up to WVGA. The device operates across a 1.38 V to 1.52 V core supply and 3.0 V to 3.6 V I/O supply, with industrial temperature range of -40 °C to +85 °C.
Architecturally, the i.MX25 uses an ARM926EJ-S core with a vector floating-point (VFP) coprocessor option and a multi-layer AHB bus matrix for high-throughput peripheral access. The silicon version 1.2 designation reflects hardware revision fixes applied to the original i.MX25 die, including USB PHY errata improvements and power-management refinements.
Typical applications include industrial human-machine interface (HMI) panels, point-of-sale terminals, portable medical monitoring devices, building automation controllers, and consumer multimedia appliances. The wide peripheral set (Ethernet, USB, CAN, I2S, SPI, UART, LCD) allows a single MPU to replace a multi-chip solution in cost-sensitive designs.
When designing with this part, ensure the PCB provides the four-layer BGA breakout needed for the 400-ball MAPBGA footprint and that the boot configuration pins are properly pulled to select the desired boot source (NOR, NAND, SD/MMC, or serial). Adequate thermal vias under the package improve heat extraction for continuous 400 MHz operation.
This page synthesizes NXP official documentation, cross-reference data, distributor pricing, and practical design guidance not consolidated in a single manufacturer datasheet.
Alternativas directas para MCIMX257DJM4A — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX257DJM4A (mismo factor de forma y huella) — difiere en Package, LCD Controller, Core Architecture, Operating Temperature, ADC.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX253DJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX255DJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX258CJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX250DJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX257CJM4A
✅ Sustitución directa✓ En stock
$15.95 / unidad
Ver hoja de datos →MCIMX251DJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX257DJM4A Valores máximos y características eléctricas
| Core Architecture | ARM926EJ-S |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Frecuencia de reloj máxima | 400 MHz |
| Internal SRAM | 128 KB |
| Number of I/O | 128 |
| Encapsulado / Carcasa | 400-LFBGA (17x17 mm) |
| Supply Voltage - Core | 1.38 V to 1.52 V |
| Supply Voltage - I/O | 3.0 V to 3.6 V |
| Temperatura de funcionamiento | -40 °C to +85 °C |
| Oscillator Type | External |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| USB PHYs | 2 (HS OTG + HS Host) |
| Ethernet MAC | 10/100 Mbps |
| ADC Channels | 3 x 12-bit |
| Touchscreen Controller | Yes (integrated) |
| LCD Controller | Yes (up to WVGA) |
| Packaging | Tray |
| Silicon Version | 1.2 |
| Series | i.MX25 |
| Estado RoHS | Compliant |
Guía de configuración de pines de MCIMX257DJM4A 400-lfbga (17x17 mm)
Configuración de pines para MCIMX257DJM4A (encapsulado 400-lfbga (17x17 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX257DJM4A.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX257DJM4A es adecuado para 6 aplicacións: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Portable Medical Monitoring Devices, Building Automation Controllers, Consumer Multimedia Appliances, Automotive Aftermarket Telematics.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX257DJM4A is purpose-built for industrial HMI panels that drive WVGA TFT LCDs while simultaneously managing touch input, Ethernet fieldbus traffic, and USB peripherals. Its ARM926EJ-S core at 400 MHz delivers enough throughput to render 24-bit color graphics at 60 fps while leaving CPU headroom for Modbus/TCP or EtherNet/IP stack execution. The integrated 12-bit ADC and 4-wire touchscreen controller eliminate the need for external touch ASICs, reducing BOM cost by typically $1-2 per board. At industrial temperature grade (-40 °C to +85 °C) and 1.38 V to 1.52 V core supply, it operates reliably in factory cabinets, outdoor kiosks, and process-control enclosures.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals require a processor that can drive a touch display, manage USB peripherals (barcode scanner, receipt printer, cash drawer), encrypt transactions, and connect over Ethernet or Wi-Fi — all within a tight BOM. The MCIMX257DJM4A's integrated 10/100 Ethernet MAC, two USB 2.0 PHYs (OTG + Host), and LCD controller supporting WVGA let a single chip run the entire terminal without external PHY ICs. Its ARM926EJ-S core executes AES-128/256 encryption at speeds sufficient for contactless card transaction pipelines, while DDR2 memory support keeps BOM cost low versus LPDDR-only designs.
Recomendado
Portable Medical Monitoring Devices
Portable medical monitors (pulse oximeters, glucometers, ambulatory ECG) need a low-power ARM-class processor with deterministic real-time response, accurate ADC inputs, and reliable USB/serial connectivity to a host PC or gateway. The MCIMX257DJM4A's three 12-bit ADCs at up to 1 MSPS support multi-channel vital-sign acquisition, and its integrated touchscreen controller simplifies patient-facing UI without extra chips. Operating from a single 3.3 V I/O rail with a 1.38 V to 1.52 V core, it pairs well with single-cell Li-ion or 4xAA battery stacks, while its industrial temperature rating suits field-deployment scenarios.
Recomendado
Building Automation Controllers
Building automation controllers (HVAC, lighting, access) often need to run multiple fieldbus protocols (BACnet, Modbus, KNX, LonWorks) concurrently while presenting a local touch UI. The MCIMX257DJM4A's rich peripheral set — including multiple UART, SPI, I2C, CAN, and Ethernet — allows a single processor to bridge these protocols without external bridge ICs. Its 128 KB of internal SRAM supports modest protocol stacks directly, while external DDR2 handles larger web-server or graphical-interface payloads. The 400 MHz ARM9 core has ample headroom for BACnet/IP routing at typical building-network packet rates.
Recomendado
Consumer Multimedia Appliances
Consumer multimedia devices — smart-home hubs, networked audio players, kitchen appliances with displays — need an MPU that combines decent CPU throughput with integrated LCD, touch, USB, and Ethernet. The MCIMX257DJM4A delivers all of this in a single 17x17 mm BGA, allowing appliance OEMs to ship Wi-Fi-enabled, app-controlled products with rich graphical UIs at a competitive BOM. Running a lightweight Linux distribution on the i.MX25 enables OTA firmware updates and remote diagnostics, while the integrated LCD controller drives WVGA panels directly without a discrete graphics controller.
Recomendado
Automotive Aftermarket Telematics
Aftermarket telematics devices (fleet trackers, OBD-II dongles, dash cameras with connectivity) require a processor that can handle GPS parsing, CAN bus sniffing, cellular modem interfacing, and local storage — all at industrial temperature. The MCIMX257DJM4A's integrated CAN controller, USB OTG for cellular modems, SD/MMC for local storage, and -40 °C to +85 °C operation make it a strong fit. Note: this is the standard industrial-grade silicon, not AEC-Q100 qualified; for OEM automotive designs, NXP offers separately qualified i.MX25 variants.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX257DJM4A — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX253DJM4A | MCIMX255DJM4A | MCIMX258CJM4A | MCIMX250DJM4A | MCIMX257CJM4A |
|---|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm) | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit |
| Number of I/O | 128 | 128 | 128 | 128 | 128 | 128 |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Diferenciadores clave
- Integrated touchscreen + 12-bit ADC + LCD controller in one chip (frente a MCIMX253DJM4A)
- Mature Linux and U-Boot BSP ecosystem (frente a MCIMX258CJM4A)
- Active NXP lifecycle with 39-week lead time (frente a Generic ARM9 BGA from other vendors)
Notas de diseño
Estimated: the 400-ball MAPBGA on a 0.8 mm pitch requires a 4-layer PCB minimum with microvia-in-pad or dogbone fanout. Place a continuous ground plane on Layer 2 and a power plane on Layer 3 to provide low-impedance return paths for the 400 MHz ARM9 core and DDR2 signals. Thermal vias (0.3 mm drill, 1.0 mm pitch) under the center power balls reduce theta-JA by an estimated 25-35 %.
Estimated: at 400 MHz core voltage 1.4 V and typical Dhrystone activity, core current is approximately 200 mA (0.28 W); peak multimedia activity can pull 350 mA. Provide a switching regulator with at least 1 A of headroom on the core rail to absorb transient spikes. The DDR2 memory controller and I/O banks together may add another 200-400 mA; budget a 1.5 A 3.3 V LDO for the I/O supply.
Common design pitfalls include: forgetting to strap BOOT_MODE pins (the part will fail to boot if left floating); mis-ordering DDR2 address/control traces (the i.MX25 reference manual requires matched-length traces within 50 ps for proper DDR2-400 operation); omitting the external 32.768 kHz RTC crystal (required for low-power modes and RTC); and using non-qualified NAND/NOR flash (the i.MX25 boot ROM has a specific ONFI timing profile). Always validate boot from at least two boot sources before mass-production.
Información de cumplimiento
RoHS compliant and lead-free per NXP product page. Industrial temperature grade only - not AEC-Q100 qualified; NXP offers separate automotive-qualified i.MX25 variants. REACH and conflict-minerals compliance per NXP environmental declarations.
