MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP
N.º de pieza: MPC755BPX350LE ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $79.4 | $794,00 |
| 100 | $68.2 | $6.820,00 |
| 500 | $58.75 | $29.375,00 |
| 1.000 | $49.9 | $49.900,00 |
MPC755BPX350LE Descripción general
A microprocessor (MPU) is a single- or multi-chip processor that contains the full arithmetic logic unit, control unit, registers and instruction fetch/decode pipeline needed to execute a general-purpose instruction set. The MPC755 is a member of the PowerPC MPC7xx (G3-class) family, which inherits its architecture from the PowerPC ISA used in Apple Power Mac G3 systems and Motorola embedded controllers. Within the broader taxonomy, the MPC755 is an embedded MPU -> 32-bit RISC CPU -> PowerPC processor -> microprocessor -> integrated circuit. The part is built around a Harvard-style cache architecture with separate 32 KB instruction and 32 KB data L1 caches, supports the 60x bus interface for system memory, and is targeted at high-performance embedded designs.
Key features include a 350 MHz core clock with a 64-bit (60x) external data bus, dedicated L1 instruction and data caches, an L2 cache controller supporting up to 1 MB of external SRAM or DDR, MMU with 32-bit virtual / physical addressing, on-chip thermal management, and a JTAG IEEE 1149.1 test access port. The device operates from a 2 V core supply and 3.3 V I/O supply and is rated for the industrial temperature range, making it suitable for long-life embedded deployments.
The MPC755BPX350LE implements a superscalar out-of-order execution pipeline derived from the PowerPC 750 architecture, with branch prediction, completion queues, and dedicated load/store units. Its 64-bit data bus and hardware-managed cache coherency make it well suited for memory-intensive tasks such as protocol conversion, packet inspection, and image rendering, while keeping latency low and deterministic.
Typical applications include industrial automation controllers, networking and telecommunications line cards, military and aerospace embedded systems, and high-reliability single-board computers in test equipment and imaging. It is also widely deployed in legacy PowerPC-based systems where long-term availability and pin compatibility with the MPC7xx family are required.
When designing with this part, allocate generous power planes for the 2 V core rail and place bulk decoupling within 25 mm of the BGA. The 360-ball 1.27 mm-pitch FCPBGA package demands controlled-impedance routing on the 60x bus and a 6-8 layer PCB stack-up to preserve signal integrity at high bus frequencies.
This page synthesizes distributor pricing for NXP MPC755BPX350LE, life-cycle-aware drop-in alternatives within the MPC7xx family, and PCB/thermal design notes not found in the original Motorola/NXP hardware specifications document.
Alternativas directas para MPC755BPX350LE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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Modelos de la misma serie compatibles directamente con MPC755BPX350LE (mismo factor de forma y huella) — difiere en Architecture, Mounting Type, Package, Package Type, Process Technology.
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| Product Type | Microprocessor (MPU) |
| Architecture | RISC, PowerPC MPC7xx |
| Core Count | 1 |
| Ancho del bus de datos | 64-Bit |
| Clock Speed (Core) | 350 MHz |
| Supply Voltage (Core) | 2 V |
| I/O Supply Voltage | 3.3 V |
| Encapsulado | 360-FCPBGA (25x25 mm, 1.27 mm pitch) |
| Terminal Form | Ball |
| Number of Terminals | 360 |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| Process Technology | 0.22 micrometer CMOS |
| Nivel de sensibilidad a la humedad (MSL) | 3 |
| Package Type | FCBGA-360, Plastic, 25x25 mm, 2.77 mm height |
Guía de configuración de pines de MPC755BPX350LE fcbga-360, plastic, 25x25 mm, 2.77 mm height
Configuración de pines para MPC755BPX350LE (encapsulado fcbga-360, plastic, 25x25 mm, 2.77 mm height). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC755BPX350LE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC755BPX350LE es adecuado para 7 aplicacións: Industrial Automation Controllers, Networking & Telecommunications Line Cards, Military & Aerospace Embedded Systems, High-Reliability Single-Board Computers, Test & Measurement Instrumentation, Medical Imaging & Diagnostic Equipment, Print & Imaging Controller Boards.
Industrial Automation Controllers
The MPC755BPX350LE's 350 MHz 32-bit PowerPC core, 64-bit 60x memory bus, and industrial temperature range make it a strong fit for PLC, motion-control, and SCADA controller mainboards. Its hardware MMU and deterministic interrupt response allow running a real-time OS (VxWorks, QNX, Linux RT) with deterministic execution for closed-loop motor control. The 360-FCPBGA provides the thermal headroom and pin density required for multi-protocol industrial Ethernet gateways with simultaneous EtherCAT, PROFINET, and Modbus traffic. Compared with ARM Cortex-A5 controllers, the MPC755 delivers higher per-core single-thread performance and a more mature software ecosystem for long-life industrial deployments.
Recomendado
Networking & Telecommunications Line Cards
In telecom and networking line cards, the MPC755BPX350LE's 64-bit 60x bus saturates IPv4/IPv6 forwarding tables at line rate, while the L1/L2 cache hierarchy keeps packet-processing latency predictable. NXP has long positioned the MPC7xx family for routing and switching fabric controllers, and the 350 MHz core is well matched to OC-3/OC-12 edge routers and SONET/SDH multiplexer designs. The 360-FCPBGA package supports the high pin count needed to interface with multi-port PHYs and TDM buses without requiring an external bus bridge ASIC. Pin-compatible MPC755BPX400LE is recommended when additional queuing/classification throughput is needed on the same controller board.
Recomendado
Military & Aerospace Embedded Systems
The MPC755CPX400LE ceramic variant and the BPX plastic variants are widely deployed in long-life defense programs where the MPC7xx PowerPC architecture has been validated for DO-254 / MIL-STD-810 environments. Combined with the 32-bit PowerPC ISA's deterministic execution, the on-chip thermal sensor and JTAG 1149.1 boundary scan simplify MIL-grade qualification and board-level health monitoring. The 360-FCPBGA supports the rugged backplane and mezzanine interconnects common in avionics LRUs. Legacy programs can sustain the MPC755BPX350LE through industrial cross-reference distributors while preparing for migration to NXP's QorIQ P-series.
Recomendado
High-Reliability Single-Board Computers
Single-board computer (SBC) vendors targeting VME and cPCI backplanes use the MPC755BPX350LE as the heart of long-lifecycle SBCs with 15-20 year availability horizons. The 2.0 V core / 3.3 V I/O supply is well suited to legacy backplane voltage rails, and the 360-FCPBGA footprint supports modern conduction-cooled enclosures. The processor's JTAG and on-chip debug features enable BIST and POST routines required by mission-critical SBCs in medical imaging and rail-transportation systems. Pin-compatibility across the MPC755BPX30x/400 speed grades lets SBC vendors offer multiple performance SKUs on one PCB layout.
Recomendado
Test & Measurement Instrumentation
Bench-top and rack-mounted test equipment leverages the MPC755BPX350LE's deterministic interrupt latency and 64-bit bus to feed data from high-speed ADCs/DACs and trigger systems. The PowerPC architecture's strong float and integer performance enables instrument firmware to perform FFTs and correlation in real time without off-loading to DSPs. The 360-FCPBGA provides the board area needed for large FPGA pin counts adjacent to the MPU, while the 2 V core rail allows efficient point-of-load power designs in instruments. Freescale/NXP documentation explicitly cites aerospace test equipment and oscilloscope controllers as reference designs for the MPC7xx family.
Recomendado
Medical Imaging & Diagnostic Equipment
Medical imaging modalities such as ultrasound, CT, and MRI reconstruction engines benefit from the MPC755BPX350LE's wide memory bandwidth and integer performance, which can drive beamforming, image reconstruction, and real-time display pipelines. The integrated MMU supports protected-memory operating systems required for IEC 62304 medical device software classes. With a long-life component strategy, the MPC7xx family is suitable for medical programs that must sustain field serviceability for 10-15 years under FDA documentation regimes. The 350 MHz speed grade balances compute throughput against the thermal envelope of sealed imaging carts and bedside monitors.
Recomendado
Print & Imaging Controller Boards
Production-class printers, copiers, and multifunction imaging systems use PowerPC-class MPUs such as the MPC755BPX350LE as RIP / engine controllers. The 64-bit 60x bus is sufficient to sustain 600 DPI image pipelines at engine speeds, and the JTAG/debug interfaces simplify firmware bring-up for raster image processors (RIP) and paper-handling peripherals. The 360-FCPBGA accommodates large fan-out to DDR memory and high-speed serial channels. Because mature PowerPC toolchains continue to be supported, OEMs can extend lifetime programs without rewriting their imaging stack.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC755BPX350LE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC755BPX300LE | MPC755BPX400LE | MPC755CPX400LE | MPC745BPX350LE |
|---|---|---|---|---|---|
| Package | 360-FCPBGA (25x25 mm) | 360-FCPBGA (25x25 mm) - same | 360-FCPBGA (25x25 mm) - same | 360-FCPBGA (25x25 mm) - same | 360-FCPBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 350 MHz | 300 MHz | 400 MHz | 400 MHz | 350 MHz |
| Architecture | PowerPC MPC7xx (32-bit) | PowerPC MPC7xx (32-bit) - same | PowerPC MPC7xx (32-bit) - same | PowerPC MPC7xx (32-bit) - same | PowerPC MPC7xx (32-bit) - same |
| Data Bus | 64-Bit (60x) | 64-Bit (60x) - same | 64-Bit (60x) - same | 64-Bit (60x) - same | 64-Bit (60x) - same |
| Core Voltage | 2.0 V | 2.0 V - same | 2.0 V - same | 2.0 V - same | 2.0 V - same |
| Package Material | Plastic (BPX) | Plastic (BPX) - same | Plastic (BPX) - same | Ceramic (CPX) | Plastic (BPX) - same |
| Lifecycle | NRND | NRND | NRND | Active for defense | Obsolete |
Diferenciadores clave
- Same-pinout pin-compatible within the MPC755 360-FCPBGA speed grades (frente a MPC755BPX300LE / MPC755BPX400LE)
- Plastic BGA versus ceramic CPX variant (frente a MPC755CPX400LE)
- Newer MPC755 architecture versus older MPC745 family (frente a MPC745BPX350LE)
Notas de diseño
Estimated: With the 360-ball 1.27 mm pitch FCPBGA, allocate at least a 6-layer PCB stack-up with dedicated ground and 2 V core power planes to suppress 60x bus noise. Place all 2.0 V and 3.3 V bulk ceramic decoupling within 25 mm of the BGA, with a 4.7 uF to 22 uF capacitor for each supply domain as a rule of thumb. Keep the 60x bus impedance at 50 ohms single-ended and route length-matched to within 5 mm to preserve timing margins at 350 MHz.
Estimated: At 350 MHz with the 2.0 V core rail, total power dissipation is approximately 4-5 W, dominated by dynamic power in the execution units. The 360-ball FCPBGA requires a thermal pad or copper coin bonded to the center balls for heat removal; convection-only cooling is insufficient. For enclosed industrial enclosures, plan for a 1-2 C/W heatsink or forced-air flow across the BGA footprint to keep junction temperature below 100 C.
Do not assume the MPC755BPX350LE is interchangeable with the MPC745BPX350LE: although the 360-FCPBGA ball-maps are sometimes confused in legacy design notes, the MPC745 is an older family member with slightly different feature bits. Confirm the PVR (processor version register) and operating-system BSP compatibility when migrating firmware across the two parts. The MSL-3 rating requires dry-pack storage and floor-life control per JEDEC J-STD-033.
Información de cumplimiento
No explicit RoHS/REACH compliance data in the verified web data; legacy Motorola/Freescale parts in plastic BGA packages from the early 2000s typically predate full RoHS lead-free declarations. AEC-Q100 not applicable - automotive grade parts would be in the QorIQ or MPC5xx automotive families.
