MPC755BPX350LE vs MPC745BPX350LE Comparación
Comparación detallada lado a lado de MPC755BPX350LE por NXP Semiconductors y MPC745BPX350LE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC755BPX350LE | MPC745BPX350LE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $49,90 | $64,80 |
| Product Type | Microprocessor (MPU) | — |
| Architecture | RISC, PowerPC MPC7xx | — |
| Core Count | 1 | — |
| Ancho del bus de datos | 64-Bit | 64-bit |
| Clock Speed (Core) | 350 MHz | — |
| Supply Voltage (Core) | 2 V | 2 V |
| I/O Supply Voltage | 3.3 V | — |
| Encapsulado | 360-FCPBGA (25x25 mm, 1.27 mm pitch) | — |
| Terminal Form | Ball | — |
| Number of Terminals | 360 | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Process Technology | 0.22 micrometer CMOS | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 | — |
| Package Type | FCBGA-360, Plastic, 25x25 mm, 2.77 mm height | FCBGA-255 (Plastic BGA, 21 x 21 mm) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance] |
| Manufacturer | — | NXP Semiconductors (formerly Motorola/Freescale) |
| Product Series | — | MPC7xx (MPC745) |
| Core Architecture | — | PowerPC RISC |
| Frecuencia de reloj máxima | — | 350 MHz |
| Number of Cores | — | 1 |
| Recuento de pines | — | 255 |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 2.80 mm |
| Tipo de montaje | — | Surface Mount (BGA) |
| Boundary Scan | — | Yes (JTAG/IEEE 1149.1) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |