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NXP Semiconductors

MPC8306SCVMABDCA - PowerQUICC II Pro SoC 133MHz | NXP

N.º de pieza: MPC8306SCVMABDCA ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
369-PBGA MAP-BGA (19x19 mm) Package 133 MHz Speed DDR2 Memory
Desde $26.4 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-17
Precios por volumen
Cant. Precio unitario Total
1 $38.5 $38,50
10 $35.2 $352,00
100 $31.75 $3.175,00
500 $28.9 $14.450,00
1.000 $26.4 $26.400,00
ℹ️ Todos los precios están en USD

MPC8306SCVMABDCA Descripción general

The NXP MPC8306SCVMABDCA is a PowerQUICC II Pro communications processor built on Power Architecture e300c3 technology, integrating a single 32-bit core running up to 133 MHz in a 369-ball MAP-BGA package (19x19 mm). The device combines a CPU subsystem with the QUICC Engine for HDLC, TDM and 10/100 Ethernet (R/MII) processing, plus IEEE 1588 v2 time-stamping support, making it a cost-effective SoC for embedded networking and industrial control.

A communications SoC (System-on-Chip) is an integrated circuit that consolidates a processor core, memory controllers, and dedicated communications peripherals onto a single die. The MPC8306SCVMABDCA sits in the hierarchy SoC -> communications processor -> PowerQUICC II Pro -> MPC830x family, where it serves as the ultra low-end node targeting price-sensitive wireline and industrial designs. Its integrated QUICC Engine offloads bit-level protocol processing from the CPU, enabling deterministic throughput for HDLC and TDM traffic.

Key features include a 32-bit PowerPC e300c3 core, 133 MHz operation, DDR2 memory controller, 16-bit local bus, dual 10/100 Ethernet MACs, USB 2.0 (full-speed), HDLC/TDM support via QUICC Engine, IEEE 1588 v2 hardware time-stamping, and an extended -40C to +105C industrial operating temperature range. The 369-PBGA MAP-BGA package exposes the full peripheral set while keeping the PCB footprint compact. Security, boot, and reset features include secure boot, multiple reset sources, and JTAG boundary scan.

The architecture pairs the e300c3 superscalar core with the QUICC Engine block, which contains RISC communication controllers optimized for serial protocol termination. On-chip DDR2 controller supports common industrial memory configurations, while the local bus controller glues to NOR flash, NAND flash, and FPGA/ASIC peripherals. Industrial-grade temperature compliance and a long-life roadmap (when active) make the part suitable for legacy factory automation, telecom edge nodes, and serial concentrator designs.

Typical applications include industrial Ethernet gateways, HDLC/TDM line-card controllers, sub-rack telecom equipment, serial-protocol concentrators, secure embedded routers, and legacy industrial control boards. The combination of QUICC Engine, dual Ethernet, and USB also fits retail/POS terminals that need deterministic serial-channel processing alongside IP connectivity.

When designing with this device, ensure DDR2 trace lengths follow the NXP reference design layout guide and that the QUICC Engine firmware (RISC microcode) is loaded into the designated memory region during boot. Thermal management is straightforward due to the modest 133 MHz clock and industrial-grade silicon.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Alternativas directas para MPC8306SCVMABDCA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MPC8306SCVMABDCA (mismo factor de forma y huella) — difiere en Ethernet, Memory Controller, Operating Temperature, Package, Data Bus Width.

NXP Semiconductors
Ethernet: Dual 10/100 MAC with MII/RMII
Memory Controller: DDR2 up to 333 MHz data rate
Operating Temperature: 0C to +105C
Comparar con MPC8306SCVMABDCA →
NXP Semiconductors
Ethernet: 2x 10/100 MAC with R/MII, IEEE 1588 v2
Memory Controller: DDR2 with ECC
Operating Temperature: 0 °C to +105 °C
Comparar con MPC8306SCVMABDCA →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MPC8306CVMABDCA

✅ Sustitución directa
📦 369-PBGA MAP-BGA (19x19 mm)
Same 369-PBGA package and e300c3 architecture, slight speed grade variation, pin-to-pin compatible

📋 Alternativa de referencia (no en el catálogo)

MPC8306VMABDCA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
NXP Semiconductors
📦 369-PBGA MAP-BGA (19x19 mm)
PowerPC e300c3 · 1 · 32 bit · 133 MHz · DDR2 with ECC · QUICC Engine (communications offload) · 2x 10/100 MAC with R/MII, IEEE 1588 v2 · USB 2.0 Full-Speed

✓ En stock

$16.1 / unidad

Ver hoja de datos →

MPC8306SCVMADDCA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 369-PBGA MAP-BGA (19x19 mm)
Same die and package, different temperature grade or screening designation

📋 Alternativa de referencia (no en el catálogo)

MPC8306SVMABDCA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
NXP Semiconductors
📦 369-PBGA MAP-BGA (19x19 mm)
PowerPC e300c3 (Power Architecture) · 1 · 32-bit · 133 MHz · DDR2 up to 333 MHz data rate · 32 KB instruction / 32 KB data · Dual 10/100 MAC with MII/RMII · USB 2.0 Full-Speed

✓ En stock

$17 / unidad

Ver hoja de datos →

MPC8306CVMAJDCA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 369-PBGA MAP-BGA (19x19 mm)
Same package footprint, slight frequency/feature trim, pin-compatible

📋 Alternativa de referencia (no en el catálogo)

MPC8306SCVMABDCA Valores máximos y características eléctricas

Core PowerPC e300c3
Architecture Power Architecture, 32-bit
Maximum Core Frequency 133 MHz
Number of Cores 1
Ancho del bus de datos 32 bit
Encapsulado 369-PBGA MAP-BGA (19x19 mm)
Tipo de montaje Surface Mount
Temperatura de funcionamiento -40C to +105C (extended)
Memory Controller DDR2
Local Bus 16-bit
Ethernet Dual 10/100 MAC (R/MII)
USB USB 2.0 Full-Speed
Communications Engine QUICC Engine (HDLC, TDM)
Time Synchronization IEEE 1588 v2
Estado RoHS Compliant

Guía de configuración de pines de MPC8306SCVMABDCA 369-pbga map-bga (19x19 mm)

Configuración de pines para MPC8306SCVMABDCA (encapsulado 369-pbga map-bga (19x19 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 369-pbga map-bga (19x19 mm) para MPC8306SCVMABDCA

No hay datos detallados de patillaje disponibles para MPC8306SCVMABDCA.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MPC8306SCVMABDCA es adecuado para 6 aplicacións: Industrial Ethernet Gateways, Telecom Line-Card Controllers, Serial Protocol Concentrators, Secure Embedded Routers, POS and Retail Terminals, Legacy Industrial Control Boards.

🏭

Industrial Ethernet Gateways

The MPC8306SCVMABDCA is well-suited for industrial Ethernet gateway designs that bridge legacy serial fieldbuses to modern IP networks. Its dual 10/100 Ethernet MACs (R/MII) provide redundant uplink and field-network connections, while the integrated QUICC Engine handles HDLC and TDM protocols commonly found in industrial automation. The 133 MHz e300c3 core delivers sufficient processing power for protocol translation, firewall filtering, and basic web management. The extended -40C to +105C temperature range ensures reliable operation in factory-floor cabinets and outdoor enclosures. The 369-PBGA MAP-BGA package allows compact gateway hardware designs, and DDR2 memory support enables buffering of industrial traffic bursts. Compared to switching regulators, the deterministic QUICC Engine offloads bit-level processing from the CPU.

🌐

Telecom Line-Card Controllers

For telecom line-card and sub-rack equipment, the MPC8306SCVMABDCA provides an integrated solution combining PowerPC processing with dedicated serial-channel handling. The QUICC Engine supports HDLC framing and TDM time-slot management, which are essential for legacy T1/E1 and DSLAM line cards. Its IEEE 1588 v2 hardware time-stamping capability enables precise timing distribution across telecom networks. The DDR2 memory controller interfaces with cost-effective commodity memory for packet buffering, and the 16-bit local bus connects to control-plane glue logic and FPGA co-processors. At 133 MHz, the core handles routing tables and management-plane software with predictable latency. The industrial temperature grade ensures operation in thermally constrained central-office environments.

🔧

Serial Protocol Concentrators

Designers building serial protocol concentrators benefit from the MPC8306SCVMABDCA's QUICC Engine, which terminates HDLC and TDM traffic deterministically without burdening the host CPU. This is critical for systems aggregating dozens of serial channels from sensors, controllers, or legacy telecom equipment. The device's 16-bit local bus allows connection to multiple external UARTs or framers, while the dual Ethernet ports aggregate traffic onto IP backhaul. At 133 MHz the e300c3 core runs management, statistics, and protocol-conversion software. The 369-PBGA MAP-BGA footprint supports miniaturized concentrator boards. Extended temperature operation enables deployment in outdoor cabinets and unconditioned industrial spaces.

🖥️

Secure Embedded Routers

The MPC8306SCVMABDCA serves as the main processor in secure embedded routers used in branch-office and industrial networking. Its hardware-assisted security features, combined with the QUICC Engine for encrypted serial links, allow secure VPN tunnels and firewall processing. The dual 10/100 Ethernet MACs enable WAN and LAN segmentation, and the USB 2.0 Full-Speed port supports external storage or 3G/4G modems for backup connectivity. The 32-bit e300c3 core at 133 MHz runs embedded Linux with adequate performance for routing tables, NAT, and basic IDS functions. DDR2 memory support allows cost-effective expansion for routing-table storage. The MAP-BGA package keeps the router board compact for DIN-rail mounting.

💳

POS and Retail Terminals

Retail point-of-sale and kiosk terminals can leverage the MPC8306SCVMABDCA for its combination of Ethernet, USB, and legacy serial support. The QUICC Engine handles payment-terminal serial protocols while the Ethernet MACs connect to store networks for transaction processing. The integrated USB 2.0 port supports peripherals such as barcode scanners, receipt printers, and customer displays. At 133 MHz with DDR2 memory, the core runs embedded Linux for payment applications, inventory lookups, and receipt rendering. The industrial temperature range suits deployments in non-climate-controlled retail back rooms. The compact MAP-BGA footprint enables slim kiosk form factors.

⚙️

Legacy Industrial Control Boards

For legacy industrial control boards and PLC communication modules, the MPC8306SCVMABDCA offers a proven Power Architecture platform with long-term availability through authorized aftermarket sources. Its deterministic QUICC Engine handles proprietary serial protocols common in factory automation, while the Ethernet ports enable modern SCADA connectivity. The 16-bit local bus interfaces with industrial I/O expansion, and the DDR2 controller supports standard industrial memory modules. Extended -40C to +105C operation handles harsh factory environments. The 369-PBGA MAP-BGA package is compatible with existing board designs from earlier MPC8306 revisions, simplifying upgrades and replacements in installed machinery.

Resumen de productos recomendados

MPC8306CVMABDCA Drop-in alternative for same family Se usa en: Industrial Ethernet Gateways, Serial Protocol Concentrators, POS and Retail Terminals MPC8308 Higher-performance family upgrade Se usa en: Industrial Ethernet Gateways, Secure Embedded Routers MPC8313 Higher-performance MPC83xx family member Se usa en: Telecom Line-Card Controllers MPC8306S Streamlined S-variant for cost reduction Se usa en: Telecom Line-Card Controllers, POS and Retail Terminals MPC8306VMABDCA NXP Semiconductors Se usa en: Serial Protocol Concentrators, Legacy Industrial Control Boards MPC8306SCVMADDCA Screening/temperature grade variant Se usa en: Secure Embedded Routers MPC8306CVMAJDCA Drop-in compatible family variant Se usa en: Legacy Industrial Control Boards
What is the core architecture of MPC8306SCVMABDCA?
The MPC8306SCVMABDCA uses a 32-bit PowerPC e300c3 core built on Power Architecture technology. According to NXP product documentation, the device integrates a single core running up to 133 MHz alongside the QUICC Engine communications block, making it part of the MPC830x family targeting cost-sensitive wireline and industrial designs.
What is the maximum operating frequency of MPC8306SCVMABDCA?
The MPC8306SCVMABDCA operates at a maximum core frequency of 133 MHz. This clock rate is part-number specific: the SC suffix indicates the 133 MHz speed grade, while other suffixes such as VMADA denote lower grades. The 133 MHz figure is the upper bound used for industrial communications and gateway designs.
What package does MPC8306SCVMABDCA use?
The MPC8306SCVMABDCA is housed in a 369-ball MAP-BGA package measuring 19x19 mm. This fine-pitch BGA exposes the full peripheral set including DDR2, dual Ethernet, USB, and the QUICC Engine signals. PCB layout requires careful via-in-pad and microvia considerations per NXP reference designs.
Is MPC8306SCVMABDCA still in production?
The MPC8306SCVMABDCA has reached End of Life per the NXP product page notice. Distributors such as DigiKey, Mouser, and authorized resellers may still hold inventory, and Rochester Electronics typically continues manufacturing EOL parts. New design-ins should evaluate active MPC platforms unless drop-in compatibility with installed bases is required.
What is the difference between MPC8306 and MPC8306S?
The MPC8306S is a streamlined variant of the MPC8306 with reduced peripheral integration. The standard MPC8306 adds IEEE 1588 v2 hardware time-stamping support and additional connectivity options. Both share the same e300c3 core and 369-PBGA MAP-BGA package, making them closely related but not pin-for-pin identical.
Where can I buy MPC8306SCVMABDCA online?
The MPC8306SCVMABDCA is available from authorized distributors including DigiKey and Mouser. Authorized aftermarket suppliers such as Rochester Electronics continue to manufacture EOL NXP silicon. Pricing as of 2026-10-17 ranges roughly $26-38 per unit depending on quantity breaks. Independent brokers may also carry stock but with authenticity and lifecycle risk.
What is the price of MPC8306SCVMABDCA?
The MPC8306SCVMABDCA unit price ranges from approximately $26.40 at 1000 pieces to $38.50 at single-piece quantity, as of 2026-10-17 distributor data. Higher volumes and reel-pack options may attract further discounts. Contact authorized distributors for current quotes, as EOL inventory pricing can fluctuate.
What is the lead time for MPC8306SCVMABDCA?
Lead time for the MPC8306SCVMABDCA varies with stock at distributors. As an EOL part, expect limited distributor inventory and possible factory lead times of 8-12 weeks through Rochester Electronics. Designers are advised to confirm current availability and PCN status before placing production orders.
What is the best drop-in replacement for MPC8306SCVMABDCA?
The MPC8306CVMABDCA is a direct drop-in alternative sharing the same 369-PBGA MAP-BGA package and key parameters. For higher performance migration within the same family, the MPC8308 or MPC8313 may also be considered, though these require PCB and firmware validation. Same-package drop-in ensures no footprint rework is needed.
MPC8306SCVMABDCA vs MPC8306VMADDCA - which is better for industrial use?
The MPC8306SCVMABDCA and MPC8306VMADDCA share the same 369-PBGA MAP-BGA package and e300c3 architecture. The SC suffix denotes the 133 MHz speed grade while VMADA denotes lower grades. For industrial temperature range applications, the SCVMABDCA suffix specifically confirms -40C to +105C support.
Can the MPC8308 replace the MPC8306SCVMABDCA?
The MPC8308 belongs to the same MPC830x communications processor family and offers higher performance than the MPC8306. While both share Power Architecture and QUICC Engine heritage, the MPC8308 has different peripheral integration and may require PCB and firmware changes. Designers must validate pin compatibility before substitution.
What are the key specifications engineers should know about MPC8306SCVMABDCA?
Key MPC8306SCVMABDCA specifications include: 133 MHz PowerPC e300c3 single core, 32-bit data bus, DDR2 memory controller, dual 10/100 Ethernet MACs, USB 2.0 Full-Speed, QUICC Engine for HDLC and TDM, IEEE 1588 v2 time-stamping, and -40C to +105C industrial operating range in a 369-PBGA MAP-BGA package.
Where to download MPC8306SCVMABDCA datasheet PDF?
The official NXP datasheet for the MPC8306SCVMABDCA is available at the NXP product page (nxp.com/part/MPC8306SCVMABDCA). Third-party distributors including LCSC and DigiChip also host the PDF for convenience. Always cross-reference the latest revision before committing to a design.
Where to find MPC8306SCVMABDCA pinout and BGA ball map?
The complete pinout and 369-ball BGA map for the MPC8306SCVMABDCA is documented in the NXP datasheet. Hardware designers should also consult the NXP hardware reference manual and design checklist for PCB layout guidelines specific to DDR2 memory and Ethernet PHY connections.
When should I choose MPC8306SCVMABDCA over newer SoCs?
Choose the MPC8306SCVMABDCA when maintaining compatibility with installed base firmware, when cost is a primary driver, or when the proven QUICC Engine for HDLC/TDM is required. New designs without legacy constraints should consider active NXP platforms or modern i.MX processors for better long-term support.

Datos de referencia de ingeniería para MPC8306SCVMABDCA — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MPC8306SCVMABDCA when designing industrial Ethernet gateways, telecom line-card controllers, or serial protocol concentrators that require full QUICC Engine HDLC/TDM offload and IEEE 1588 v2 time-stamping. Select the MPC8306CVMABDCA as a direct drop-in alternative with the same specifications. Choose the MPC8306SVMABDCA only for cost-optimized designs that can accept reduced peripheral integration. For new designs without legacy constraints, consider active NXP i.MX or QorIQ platforms. The extended -40C to +105C temperature range makes this family particularly suited for harsh industrial environments.

Comparación con alternativas

Parámetro Este producto MPC8306CVMABDCA MPC8306VMABDCA MPC8306SCVMADDCA MPC8306SVMABDCA
Package 369-PBGA MAP-BGA (19x19 mm) 369-PBGA MAP-BGA (19x19 mm) - same 369-PBGA MAP-BGA (19x19 mm) - same 369-PBGA MAP-BGA (19x19 mm) - same 369-PBGA MAP-BGA (19x19 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core PowerPC e300c3 PowerPC e300c3 PowerPC e300c3 PowerPC e300c3 PowerPC e300c3 (S-variant)
Maximum Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C
Ethernet Dual 10/100 (R/MII) Dual 10/100 (R/MII) Dual 10/100 (R/MII) Dual 10/100 (R/MII) Reduced Ethernet
QUICC Engine Yes (HDLC, TDM) Yes (HDLC, TDM) Yes (HDLC, TDM) Yes (HDLC, TDM) Limited QUICC Engine
IEEE 1588 v2 Yes Yes Yes Yes No (S-variant)

Diferenciadores clave

  • Integrated QUICC Engine for HDLC/TDM offload (frente a MPC8306SVMABDCA)
  • IEEE 1588 v2 hardware time-stamping (frente a MPC8306SVMABDCA)
  • Dual 10/100 Ethernet MACs (frente a MPC8306SVMABDCA)

Notas de diseño

The 369-ball MAP-BGA package requires careful PCB layout with microvia or via-in-pad technology for reliable assembly. Follow NXP hardware reference manual guidelines for BGA breakout routing, maintaining controlled impedance for DDR2 signals and Ethernet differential pairs. Decoupling capacitors should be placed as close as possible to power pins with short, wide traces.

The MPC8306SCVMABDCA requires multiple supply rails including core voltage and I/O voltage. Use a power sequencing circuit to ensure proper rail order during startup, preventing latch-up conditions. Bulk decoupling on each rail and high-frequency ceramic decoupling near the IC are essential for stable operation of the e300c3 core and QUICC Engine block.

Do not omit the QUICC Engine firmware (microcode) load during boot; the communications engines will not function without proper initialization. Ensure JTAG boundary scan access is preserved for board-level testing, and verify reset circuit timing meets the NXP datasheet specifications to avoid boot failures in production units.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS and REACH compliant per NXP product documentation. Not AEC-Q100 qualified - this is an industrial-grade communications processor, not an automotive part. Lead-free packaging confirmed.

Datos verificados el: 2026-10-17 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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